IP Library Granted Patent US 8,290,746
Granted Patent B2
US 8,290,746 · App. 12/495,478 · Granted Oct 16, 2012

Embedded microcontrollers classifying signatures of components for predictive maintenance in computer servers

Assignee: Oracle America, Inc.
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Quick Facts
Patent No.
US 8,290,746
App. No.
12/495,478
Granted
Oct 16, 2012
Kind
B2
Abstract

Some embodiments of the present invention provide a system that analyzes data from a computer system. During operation, the system obtains the sensor data from a component in the computer system using a set of sensors. Next, the system transmits the sensor data to a microcontroller unit (MCU) coupled to the sensors and stores the sensor data in internal memory of the MCU. Finally, the system assesses the integrity of the component by analyzing the sensor data using a pattern-recognition apparatus in the MCU.

Claims (79)

1. A method for analyzing sensor data from a computer system, comprising:

obtaining the sensor data from a component in the computer system using a set of sensors;

transmitting the sensor data to a microcontroller unit (MCU) coupled to the sensors;

storing the sensor data in internal memory of the MCU;

assessing the integrity of the component by analyzing the sensor data using a pattern-recognition apparatus in the MCU; and

further analyzing the sensor data using a system controller if the assessed integrity falls below a threshold.

2. The method of claim 1 , wherein the system controller is in the computer system.

3. The method of claim 2 , wherein further analyzing the sensor data using the system controller involves at least one of:

transmitting a portion of the sensor data to the system controller; and

managing a fault in the computer system using the system controller.

4. The method of claim 1 , wherein analyzing the sensor data using the pattern-recognition apparatus in the MCU involves at least one of:

constructing a waveform signature of the sensor data;

removing outliers in the sensor data;

performing feature extraction on the sensor data;

normalizing the sensor data;

performing missing attribute processing on the sensor data; and

classifying the component using the sensor data.

5. The method of claim 1 , wherein the sensors correspond to microelectromechanical systems (MEMS) sensors.

6. The method of claim 1 , wherein the sensor data comprises at least one of:

a load metric;

a CPU utilization;

an idle time;

a memory utilization;

a disk activity;

a transaction latency;

a temperature;

a voltage;

a fan speed;

a current; and

a vibration acceleration or displacement.

7. A system for analyzing sensor data from a computer system, comprising:

a set of sensors configured to obtain the sensor data from a component in the computer system; and

a microcontroller unit (MCU) coupled to the sensors, comprising:

internal memory configured to store the sensor data; and

a pattern-recognition module configured to assess the integrity of the component by analyzing the sensor data using a pattern-recognition apparatus in the MCU,

wherein a system controller is configured to further analyze the sensor data if the assessed integrity falls below a threshold.

8. The system of claim 7 , further comprising the system controller.

9. The system of claim 8 , wherein further analyzing the sensor data using the system controller involves at least one of:

transmitting a portion of the sensor data to the system controller; and

managing a fault in the computer system using the system controller.

10. The system of claim 9 , wherein the portion of the sensor data is transmitted to the system controller using a system bus on the computer system.

11. The system of claim 7 , wherein the pattern-recognition apparatus in the MCU is configured to analyze the sensor data by:

constructing a waveform signature of the sensor data;

removing outliers in the sensor data;

performing feature extraction on the sensor data;

normalizing the sensor data;

performing missing attribute processing on the sensor data; and

classifying the component using the sensor data.

12. The system of claim 7 , wherein the sensors correspond to microelectromechanical systems (MEMS) sensors.

13. The system of claim 7 , wherein the sensor data comprises at least one of:

a load metric;

a CPU utilization;

an idle time;

a memory utilization;

a disk activity;

a transaction latency;

a temperature;

a voltage;

a fan speed;

a current; and

a vibration acceleration or displacement.

14. A non-transitory computer-readable storage medium storing instructions that when executed by a computer cause the computer to perform a method for analyzing sensor data from a computer system, the method comprising:

obtaining the sensor data from a component in the computer system using a set of sensors;

transmitting the sensor data to a microcontroller unit (MCU) coupled to the sensors;

storing the sensor data in internal memory of the MCU;

assessing the integrity of the component by analyzing the sensor data using a pattern-recognition apparatus in the MCU; and

further analyzing the sensor data using a system controller if the assessed integrity falls below a threshold.

15. The non-transitory computer-readable storage medium of claim 14 ,

wherein the system controller is in the computer system.

16. The non-transitory computer-readable storage medium of claim 15 , wherein further analyzing the sensor data using the system controller involves at least one of:

transmitting a portion of the sensor data to the system controller; and

managing a fault in the computer system using the system controller.

17. The non-transitory computer-readable storage medium of claim 14 , wherein analyzing the sensor data using the pattern-recognition apparatus in the MCU involves at least one of:

constructing a waveform signature of the sensor data;

removing outliers in the sensor data;

performing feature extraction on the sensor data;

normalizing the sensor data;

performing missing attribute processing on the sensor data; and

classifying the component using the sensor data.

Assignments (2)
MERGER AND CHANGE OF NAME Recorded Dec 16, 2015
From: ORACLE USA, INC.; SUN MICROSYSTEMS, INC.; ORACLE AMERICA, INC.
To: ORACLE AMERICA, INC.
Reel/Frame 037311/0182 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2009
From: URMANOV, ALEKSEY M.; BOUGAEV, ANTON A.; DONALDSON, DARRELL D.
To: SUN MICROSYSTEMS, INC.
Reel/Frame 023023/0885 →
Continuity (1)
Related Publication 20100332189A1 · Dec 30, 2010