Etching with improved control of critical feature dimensions at the bottom of thick layers

1. A method for etching a feature in an etch layer, the method comprising:

providing a substrate layer;

fabricating a mask feature from a mask layer material, the mask feature being fabricated at a lateral feature position on the substrate layer, the mask feature having a critical lateral extension, wherein fabricating the mask feature comprises fabricating a mask opening in a mask layer on the substrate layer at the lateral feature position and with the critical lateral extension and wherein the mask layer comprises TiW or Al with an aluminum oxide cover layer;

depositing an etch layer from an etch layer material on the mask feature and on the substrate layer, the etch layer being deposited to a thickness of more than 2 micrometers from an initial contact face, the etch layer material being selectively etchable relative to the mask layer material, wherein the etch layer comprises Al; and

etching a feature in the etch layer at a first lateral position with a lateral extension larger than the critical lateral extension, the etching using an etchant that selectively removes the etch layer material relative to the mask layer material.

2. The method of claim 1 , wherein

fabricating the mask feature comprises fabricating a sacrificial etch-stop cap from an etch-stop material in the mask opening, the etch-stop material being selectively etchable relative to the mask layer material and the etch layer material;

the etch layer material is additionally selectively etchable relative to the etch-stop material; and

etching the feature in the etch layer comprises performing a first selective etching step during which the etch layer is removed selectively relative to the etch-stop cap, and performing a second selective etching step during which the etch-stop cap is removed selectively relative to the etch layer and to the mask layer.

3. The method of claim 2 , wherein the etch-stop cap is T-shaped.

4. The method of claim 2 , wherein the etch layer material comprises a metal and the etch-stop material is non-metallic.

5. The method of claim 2 , wherein the etch layer material comprises Al and the etch-stop material comprises SiO 2 .

6. The method of claim 2 , wherein the first selective etching step uses H 3 PO 4 /HNO 3 (aq.) and wherein the second selective etching step uses NH 4 F/HF (aq.).

7. The method of claim 1 , wherein

fabricating the mask feature comprises removing those mask layer sections that are arranged outside the critical lateral extension at the lateral feature position, and

etching the feature in the etch layer comprises performing a first selective etching step during which the etch layer is removed selectively relative to the mask feature and performing a second selective etching step during which the mask feature is removed selectively relative to the etch layer.

8. The method of claim 7 , wherein the mask layer sections are removed from a mask layer on the substrate layer.

9. The method of claim 7 , wherein the first selective etching step uses H 3 PO 4 /HNO 3 (aq.) and wherein the second selective etching step uses NH 4 F/HF (aq.).

10. The method of claim 1 , wherein fabricating the mask feature comprises depositing a mask layer on the substrate layer and structuring the mask layer with a lithographic process to form the mask feature.

11. The method of claim 1 , wherein etching the feature in the etch layer is performed with the aid of a lithographic process.

12. The method of claim 1 , further comprising removing the substrate layer relative to the etch layer after etching the feature in the etch layer.

13. The method of claim 1 , wherein etching comprises etching to an opposite bottom face of the etch layer.

14. A method for etching a feature in an etch layer, the method comprising:

providing a substrate layer;

fabricating a mask feature from a mask layer material, the mask feature being fabricated at a lateral feature position on the substrate layer, the mask feature having a critical lateral extension, wherein fabricating the mask feature comprises fabricating a mask opening in a mask layer on the substrate layer at the lateral feature position and with the critical lateral extension;

depositing an etch layer from an etch layer material on the mask feature and on the substrate layer, the etch layer being deposited to a thickness of more than 2 micrometers from an initial contact face, the etch layer material being selectively etchable relative to the mask layer material; and

etching a feature in the etch layer at a first lateral position with a lateral extension larger than the critical lateral extension, the etching using an etchant that selectively removes the etch layer material relative to the mask layer material;

wherein fabricating the mask feature comprises fabricating a sacrificial etch-stop cap from an etch-stop material in the mask opening, the etch-stop material being selectively etchable relative to the mask layer material and the etch layer material;

wherein the etch layer material is additionally selectively etchable relative to the etch-stop material; and

wherein etching the feature in the etch layer comprises performing a first selective etching step during which the etch layer is removed selectively relative to the etch-stop cap, and performing a second selective etching step during which the etch-stop cap is removed selectively relative to the etch layer and to the mask layer.

15. The method of claim 14 , wherein the etch-stop cap is T-shaped.

16. The method of claim 14 , wherein the etch layer material comprises Al and the etch-stop material comprises SiO 2 .

17. A method for etching a feature in an etch layer, the method comprising:

providing a substrate layer;

fabricating a mask feature from a mask layer material, the mask feature being fabricated at a lateral feature position on the substrate layer, the mask feature having a critical lateral extension;

depositing an etch layer from an etch layer material on the mask feature and on the substrate layer, the etch layer being deposited to a thickness of more than 2 micrometers from an initial contact face, the etch layer material being selectively etchable relative to the mask layer material; and

etching a feature in the etch layer at a first lateral position with a lateral extension larger than the critical lateral extension, the etching using an etchant that selectively removes the etch layer material relative to the mask layer material;

wherein fabricating the mask feature comprises removing those mask layer sections that are arranged outside the critical lateral extension at the lateral feature position; and

wherein etching the feature in the etch layer comprises performing a first selective etching step during which the etch layer is removed selectively relative to the mask feature and performing a second selective etching step during which the mask feature is removed selectively relative to the etch layer.

18. The method of claim 17 , wherein the mask layer sections are removed from a mask layer on the substrate layer.

19. The method of claim 17 , wherein the first selective etching step uses H 3 PO 4 /HNO 3 (aq.) and wherein the second selective etching step uses NH 4 F/HF (aq.).

20. A method for etching a feature in an etch layer, the method comprising:

providing a substrate layer;

fabricating a mask feature from a mask layer material, the mask feature being fabricated at a lateral feature position on the substrate layer, the mask feature having a critical lateral extension;

depositing an etch layer from an etch layer material on the mask feature and on the substrate layer, the etch layer being deposited to a thickness of more than 2 micrometers from an initial contact face, the etch layer material being selectively etchable relative to the mask layer material;

etching a feature in the etch layer at a first lateral position with a lateral extension larger than the critical lateral extension, the etching using an etchant that selectively removes the etch layer material relative to the mask layer material; and

removing the substrate layer relative to the etch layer after etching the feature in the etch layer.