IP Library Granted Patent US 8,197,130
Granted Patent B2
US 8,197,130 · App. 12/498,423 · Granted Jun 12, 2012

Method to accurately read temperature for a room sensor apparatus

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Quick Facts
Patent No.
US 8,197,130
App. No.
12/498,423
Granted
Jun 12, 2012
Kind
B2
Abstract

A temperature sensing device enclosed in a housing having at least one thermally isolative wall and machined slot for isolating the temperature sensing device to ensure accurate reading of ambient temperature in room.

Claims (24)

1. A temperature sensing device for measuring ambient temperature in a room, comprising:

a temperature sensing element;

a printed circuit board configured to carry the temperature sensing element, wherein the printed circuit board includes a slot configured to substantially isolate the temperature sensing element;

an enclosure configured to accept and carry the printed circuit board

an isolating wall connected with and positioned within the enclosure, the isolating wall configured to cooperate with the slot and substantially isolate the temperature sensing element; and

a plurality of venting slots formed in the enclosure to allow an ambient temperature air to flow through a sensor channel defined between the isolating wall and the enclosure and across the temperature sensing element.

2. The temperature sensing device of claim 1 , wherein the isolating wall is a convective barrier.

3. The temperature sensing device of claim 1 , wherein the slot and the temperature sensing element are positioned within the sensor channel.

4. The temperature sensing device of claim 1 , wherein the slot is oriented at a 45 degree angle relative to a sidewall of the enclosure.

5. The temperature sensing device of claim 1 , wherein the enclosure comprises a top cover and a base configured to house the printed circuit board and substantially protect the temperature sensing element.

6. The temperature sensing device of claim 5 , wherein the isolating wall is a molded portion of the top cover.

7. The temperature sensing device of claim 1 , wherein the slot is a conductive barrier.

8. The temperature sensing device of claim 7 , wherein the conductive barrier establishes a conductive path to decrease the heat transfer between the printed circuit board and the temperature sensing element.

9. A method to accurately read temperature for a room sensor apparatus comprising:

providing a temperature sensing element;

arranging a printed circuit board to carry the temperature sensing element, wherein the printed circuit board includes a slot configured to substantially isolate the temperature sensing element;

providing an enclosure to accept and carry the printed circuit board

establishing an isolating wall within the enclosure to cooperate with the slot and substantially isolate the temperature sensing element; and

defining a plurality of venting slots in the enclosure to allow an ambient temperature air to flow through a sensor channel defined between the isolating wall and the enclosure and across the temperature sensing element.

10. The method to accurately read temperature for a room sensor apparatus of claim 9 , wherein the isolating wall is a convective barrier.

11. The method to accurately read temperature for a room sensor apparatus of claim 9 , wherein the enclosure comprises a top cover and a base configured to house the printed circuit board and substantially protect the temperature sensing element.

12. The method to accurately read temperature for a room sensor apparatus of claim 11 , wherein the isolating wall is a molded portion of the top cover.

13. The method to accurately read temperature for a room sensor apparatus of claim 9 , wherein the slot is a conductive barrier.

14. The method to accurately read temperature for a room sensor apparatus of claim 13 , wherein the conductive barrier establishes a conductive path to decrease the heat transfer between the printed circuit board and the temperature sensing element.

Assignments (2)
MERGER Recorded Mar 8, 2010
From: SIEMENS BUILDING TECHNOLOGIES, INC.
To: SIEMENS INDUSTRY, INC.
Reel/Frame 024054/0938 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 7, 2009
From: WILLE, JAMES P.
To: SIEMENS BUILDING TECHNOLOGIES, INC.
Reel/Frame 022919/0755 →