IP Library Granted Patent US 8,308,876
Granted Patent B2
US 8,308,876 · App. 12/498,552 · Granted Nov 13, 2012

System and method to form and heat-treat a metal part

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Quick Facts
Patent No.
US 8,308,876
App. No.
12/498,552
Granted
Nov 13, 2012
Kind
B2
Abstract

A system and method for direct manufacturing and stress relieving a metal part without removing the metal part from a vacuumed chamber. The system may comprise the chamber, a wire feeder for depositing a metal wire onto a metal plate, an electron beam (EB) source for providing an electron beam to melt the metal wire during deposition, and a current-providing apparatus for joule heating the metal plate to provide heat treatment to the metal part. The method may comprise depositing the metal wire onto the metal plate within the vacuumed chamber, then providing intermediate stress relief after a portion of the metal wire is deposited onto the metal plate by applying an electrical current to the metal part. The electron beam may also be set at a temperature below a melting point of a particular metal of the metal part for relieving stress in the metal part.

Claims (24)

1. A method of direct manufacturing and heat treating a metal part, the method comprising:

depositing metal wire onto a metal plate within a vacuumed chamber, wherein the metal plate and the metal wire deposited thereon together form the metal part;

directing an electron beam onto the wire as it is deposited onto the metal plate; and

applying electric current to the metal plate after at least a portion of the metal wire has been deposited onto the metal plate, to heat treat the metal part.

2. The method of claim 1 , wherein applying electric current to the metal plate comprises passing electrical current through the metal plate during a time when the metal wire is not being deposited onto the metal plate.

3. The method of claim 1 , further comprising applying the electron beam toward one or more sections of the metal plate, when the metal wire is not being applied to the metal plate, at a particular power and focus setting sufficient to heat the one or more sections to a stress-relieving temperature below a melting point of the metal plate.

4. The method of claim 1 , further comprising vacuum pumping down the chamber to a proper temperature and atmospheric pressure for depositing metal wire onto a metal plate.

5. The method of claim 1 , further comprising attaching bus bars to the metal plate, wherein the bus bars are configured to provide electrical current to the metal plate.

6. The method of claim 1 , further comprising monitoring various stress indicators of the metal part during deposition of the metal wire and applying electric current to the metal plate when at least one of the stress indicators exceeds a given threshold of acceptable stress.

7. The method of claim 1 , wherein applying electric current comprises applying enough electrical current to the metal plate to increase a temperature of the metal part to a Fahrenheit temperature between approximately 30 percent and 50 percent of a Fahrenheit melting temperature of the metal part for a predetermined length of time sufficient to provide a predetermined amount of stress relief.

8. The method of claim 1 , wherein the metal part, metal wire, and metal plate are each comprised of at least one of titanium, titanium alloys, aluminum, and nickel-based super alloys.

9. A method of direct manufacturing and heat treating a metal part, the method comprising:

placing a metal plate within an airtight chamber;

applying vacuum to the airtight chamber;

depositing metal wire onto a metal plate within the airtight chamber, wherein the metal plate and the metal wire deposited thereon together form the metal part;

directing an electron beam onto the wire as it is deposited onto the metal plate;

monitoring various stress indicators of the metal part during deposition of the metal wire onto the metal plate;

determining when at least one of the stress indicators exceeds a given threshold of acceptable stress; and

applying electrical current to the metal plate, thereby heating the metal part.

10. The method of claim 9 , further comprising applying the electron beam toward one or more sections of the metal plate, when the metal wire is not being applied to the metal plate, at a particular power and focus setting sufficient to heat the one or more sections to a stress-relieving temperature below a melting point of the metal plate.

11. The method of claim 9 , further comprising attaching bus bars to the metal plate, wherein the bus bars are configured to provide electrical current to the metal plate.

12. The method of claim 9 , wherein the electrical current is applied to the metal plate after at least a portion of the metal wire has been deposited onto the metal plate and during a time when the metal wire is not being deposited onto the metal plate.

13. The method of claim 9 , wherein applying electric current comprises applying enough electrical current to the metal plate to increase a temperature of the metal part to a Fahrenheit temperature between approximately 30 percent and 50 percent of a Fahrenheit melting temperature of the metal part for a predetermined length of time required to provide a predetermined amount of stress relief.

14. The method of claim 13 , further comprising cutting off electrical current to the metal plate after the predetermined length of time and resuming depositing of the metal wire.

Assignments (14)
RELEASE OF SECURITY INTEREST Recorded Dec 11, 2025
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 073932/0669 →
RELEASE OF SECURITY INTEREST Recorded Dec 10, 2025
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 073900/0356 →
RELEASE OF SECURITY INTEREST Recorded Dec 9, 2025
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 073916/0346 →
SECURITY AGREEMENT Recorded Jul 8, 2024
From: SPIRIT AEROSYSTEMS, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 068217/0456 →
RELEASE OF SECURITY INTEREST Recorded Dec 4, 2023
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
To: SPIRIT AEROSYSTEMS, INC.; SPIRIT AEROSYSTEMS HOLDINGS, INC.; SPIRIT AEROSYSTEMS NORTH CAROLINA, INC.
Reel/Frame 065772/0456 →
SECURITY AGREEMENT (SECOND LIEN NOTES) Recorded Nov 21, 2023
From: SPIRIT AEROSYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
Reel/Frame 065659/0585 →
RELEASE OF SECURITY INTEREST Recorded Nov 23, 2022
From: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A., AS COLLATERAL AGENT
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 061995/0281 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Nov 23, 2022
From: SPIRIT AEROSYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 061993/0847 →
RELEASE OF SECURITY INTEREST Recorded Oct 28, 2020
From: BANK OF AMERICA, N.A.
To: SPIRIT AEROSYSTEMS, INC.
Reel/Frame 054230/0578 →
SECURITY INTEREST Recorded Oct 5, 2020
From: SPIRIT AEROSYSTEMS, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053983/0350 →
SECURITY INTEREST Recorded Oct 5, 2020
From: SPIRIT AEROSYSTEMS, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053993/0505 →
SECURITY INTEREST Recorded Oct 5, 2020
From: SPIRIT AEROSYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 053993/0569 →
SECURITY INTEREST Recorded Apr 17, 2020
From: SPIRIT AEROSYSTEMS, INC.
To: THE BANK OF NEW YORK MELLON TRUST COMPANY, N.A.
Reel/Frame 052433/0843 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Feb 24, 2020
From: SPIRIT AEROSYSTEMS, INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 052004/0929 →