IP Library Granted Patent US 7,934,809
Granted Patent B2
US 7,934,809 · App. 12/500,604 · Granted May 3, 2011

Printhead integrated circuit with petal formation ink ejection actuator

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Quick Facts
Patent No.
US 7,934,809
App. No.
12/500,604
Granted
May 3, 2011
Kind
B2
Abstract

A printhead integrated circuit includes an ink chamber for storing a fluid; an ink ejection port in fluid communication with the ink chamber; a plurality of actuators radially positioned about the ink ejection port in a petal formation; and a heater structure provided in each actuator, the heater structure operable to conduct current therethrough to heat a respective actuator, whereby a differential thermal expansion is established in the respective actuator to urge the respective actuator into the ink chamber. The heater structure is positioned in each actuator to heat the actuator unevenly.

Claims (11)

1. A printhead integrated circuit comprising:

an ink chamber for storing a fluid;

an ink ejection port in fluid communication with the ink chamber;

a plurality of actuators radially positioned about the ink ejection port in a petal formation; and

a heater structure provided in each actuator, the heater structure operable to conduct current therethrough to heat a respective actuator, whereby a differential thermal expansion is established in the respective actuator to urge the respective actuator into the ink chamber, wherein

the heater structure is positioned in each actuator to heat the actuator unevenly.

2. The printhead integrated circuit of claim 1 , wherein the actuators are manufactured from a polytetrafluoroethylene (PTFE) material, and the heater structure has serpentine formation.

3. The printhead integrated circuit of claim 1 , further comprising a number of central arms radially positioned about the port between the petal formations to provide structural support for the formations.

4. The printhead integrated circuit of claim 1 , further comprising a rim about the ejection port.

5. The printhead integrated circuit of claim 1 , further comprising an integrated layer of CMOS circuitry for driving the heater structures.

6. The printhead integrated circuit of claim 5 , further comprising a number of vias through which the CMOS drive circuitry is connected to the heater structures.

Assignments (2)
CHANGE OF NAME Recorded Jun 25, 2014
From: ZAMTEC LIMITED
To: MEMJET TECHNOLOGY LIMITED
Reel/Frame 033244/0276 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2012
From: SILVERBROOK RESEARCH PTY. LIMITED AND CLAMATE PTY LIMITED
To: ZAMTEC LIMITED
Reel/Frame 028522/0857 →