Wide area stamp for antireflective surface

1. A method for forming a nanoimprint mold, the method comprising:

filling nanoholes formed in a substrate with a material to form nanopillars on the substrate;

performing at least a first partial oxidation of the nanopillars and then removing at least a portion of the oxidized material;

depositing a hard substance on the nanopillars to begin forming the nanoimprint mold on the nanopillars;

depositing a second material on the hard substance; and

removing the substrate from a molding surface of the nanoimprint mold.

2. The method of claim 1 , wherein filling the nanoholes formed in a substrate with a material to form nanopillars further comprises depositing additional material on at least the nanopillars, wherein the material is preferentially deposited on the nanopillars at a faster rate than on the substrate.

3. The method of claim 1 , wherein the nanoholes in a substrate are arranged in a geometric pattern.

4. The method of claim 1 , wherein the material comprises silicon.

5. The method of claim 1 , wherein depositing a hard substance comprises depositing metal in a space between the nanopillars, wherein the nanopillars define a shape of the molding surface.

6. The method of claim 1 , wherein removing the substrate from a molding surface comprises:

grinding the substrate;

oxidizing any remaining substrate and the nanopillars; and

etching the remaining substrate and nanopillars from the molding surface.

7. The method of claim 1 , further comprising depositing a layer on the nanomold surface, the layer comprising at least one of gold, an F-containing polymer, or a self assembled monolayer.

8. The method of claim 1 , further comprising attaching a second substrate to a surface opposite the molding surface, the second substrate comprising a handle.

9. The method of claim 1 , wherein the molding surface comprises nanowells having a shape that is formed from the nanopillars.

10. The method of claim 1 , wherein depositing a hard substance and depositing a second material are repeated two or more times to form layers of the hard substance and of the second material in the nanoimprint mold, wherein the layers of the hard substance and of the second material each have a thickness between about 3 nanometers and about 30 nanometers.

11. The method of claim 10 :

wherein the second material provides flexibility to the nanoimprint mold and the second material comprises one of carbon nanotube and graphene and aluminum; and

wherein the hard substance comprises at least one of metal carbide and iron carbide.

12. A method for forming a nanoimprint mold, the method comprising:

forming nanopillars on a substrate with a first material;

partially oxidizing the nanopillars and a portion of the substrate between the nanopillars;

depositing a second material on the nanopillars, wherein the second material is harder than the first material and wherein the nanopillars define a shape of a molding surface of the nanoimprint mold; and

removing the substrate and the nanopillars from the molding surface of the nanoimprint mold.

13. The method of claim 12 , wherein forming nanopillars on a substrate with a first material further comprises:

forming nanoholes in the substrate;

filling the nanoholes with the first material using photoresist to form the nanopillars;

depositing additional first material on the nanopillars, wherein some of the additional first material is deposited on the substrate between the nanopillars;

oxidizing at least a portion of the nanopillars and the first material deposited on the substrate; and

removing the oxidized portion of the first material and the oxidized portion of the nanopillars, wherein the nanopillars are thinner than when first formed after the oxidized portion is removed.

14. The method of claim 12 , further comprising depositing a layer on the molding surface, the layer comprising at least one of gold, an F-containing polymer, or a self assembled monolayer.

15. The method of claim 12 , further comprising depositing additional layers on the second material, wherein the additional layers include at least an additional layer of the first material and an additional layer of the second material, wherein at least some of the additional layers are oxidized.

16. The method of claim 15 , wherein spaces between the nanopillars are filled by the additional layers when depositing the additional layers.

17. The method of claim 15 , further comprising oxidizing the substrate and the nanopillars.

18. The method of claim 17 , wherein the nanopillars are arranged in a geometric pattern.

19. The method of claim 17 , wherein the first material comprises silicon and the second material comprises at least one of metal carbide and iron carbide.

20. A method for forming a nanoimprint mold, the method comprising:

forming nanopillars in a defined region on a substrate with a first material;

depositing additional first material on the nanopillars to increase a height of the nanopillars;

performing a first oxidation to oxidize a portion of the nanopillars, wherein the additional first material deposited on the substrate between the nanopillars is oxidized;

removing both the oxidized additional first material on the substrate and at least some of the portion of the nanopillars that has been oxidized;

performing a second oxidation to oxidize a second portion of the nanopillars and to oxidize a portion of the substrate;

depositing a second material on the oxidized nanopillars and on the oxidized substrate, wherein the second material is harder than the first material and harder than the oxidized first material; and

depositing additional layers on the second material, wherein the additional layers fill spaces between the nanopillars; and

removing the substrate and the nanopillars effective to define a molding surface including nanowells in the defined region.

21. The method of claim 20 further comprising depositing a layer on the molding surface, the layer comprising at least one of gold, an F-containing polymer, or a self assembled monolayer.