IP Library Granted Patent US 8,050,057
Granted Patent B2
US 8,050,057 · App. 12/501,506 · Granted Nov 1, 2011

Mounting structure for an electronic element

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Quick Facts
Patent No.
US 8,050,057
App. No.
12/501,506
Granted
Nov 1, 2011
Kind
B2
Abstract

A mounting structure for fixing an electronic element on a heat dissipation unit is provided. The mounting structure includes a heat dissipation unit, a fixing member, electronic elements and elastic elements. The fixing member is fixed on the heat dissipation unit. The elastic elements are sandwiched between the electronic elements and the fixing member, wherein the fixing member and the elastic elements press the electronic elements to make the electronic elements tightly contact the heat dissipation unit.

Claims (13)

1. An mounting structure for an electronic element, comprising:

a heat dissipation unit comprising a mounting surface;

a fixing member, comprising at least one receiving portion facing the mounting surface, the fixing member being fixed on the heat dissipation unit;

at least one electronic element, each of the electronic element is disposed in a corresponding receiving portion; and

at least one elastic element, sandwiched between the electronic element and the fixing member, wherein the fixing member and the elastic element press the electronic element to make the electronic element tightly contact the heat dissipation unit.

2. The mounting structure for an electronic element as claimed in claim 1 , wherein the fixing member is fixed on the heat dissipation unit via a fixer.

3. The mounting structure for an electronic element as claimed in claim 2 , wherein the fixer is a bolt.

4. The mounting structure for an electronic element as claimed in claim 1 , wherein the elastic element is an elastic sheet.

5. The mounting structure for an electronic element as claimed in claim 1 , wherein the elastic element is a wave spring.

6. The mounting structure for an electronic element as claimed in claim 1 , wherein the receiving portion is a recess.

7. The mounting structure for an electronic element as claimed in claim 1 , wherein the receiving portion has a plurality of through holes, the electronic element has a plurality of leads, and the leads extend from the receiving portion, pass through the through holes, and protrude on a surface of the fixing member.

8. The mounting structure for an electronic element as claimed in claim 1 , wherein the receiving portion comprises a plurality of positioning protrusions, and the positioning protrusions surround the electronic element to limit degree of freedom thereof.

9. The mounting structure for an electronic element as claimed in claim 8 , wherein the positioning protrusions are triangular.

Assignments (5)
RELEASE OF SECURITY INTEREST IN PATENTS RECORDED AT RECORDED AT REEL 046410, FRAME 0933 Recorded Jun 22, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064072/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 22, 2018
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 046410/0933 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 25, 2017
From: FAIRCHILD (TAIWAN) CORPORATION (FORMERLY SYSTEM GENERAL CORPORATION)
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
Reel/Frame 042328/0318 →
CHANGE OF NAME Recorded May 3, 2016
From: SYSTEM GENERAL CORPORATION
To: FAIRCHILD (TAIWAN) CORPORATION
Reel/Frame 038599/0043 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 13, 2009
From: YANG, SHIH-JEN; TU, HUNG-SEN
To: SYSTEM GENERAL CORPORATION
Reel/Frame 022943/0542 →