ELONGATED SEMICONDUCTOR DEVICES, METHODS OF MAKING SAME, AND SYSTEMS FOR MAKING SAME
A patterned conductive layer is disposed around a nonplanar substrate, where a boundary of the conductive layer is defined by a single groove that traverses a perimeter of the substrate a plurality of times. A patterned conductive layer is disposed around a nonplanar substrate, where the patterned conductive layer is divided into a plurality of conductive islands by a groove that extends through a thickness of the conductive layer and traverses a perimeter of the substrate a plurality of times, and a groove extends through the thickness of the conductive layer and traverses a length of the substrate. A method of patterning a conductive layer disposed around a nonplanar substrate includes scribing the conductive layer thereby forming a continuous groove that traverses a perimeter of the conductive layer a plurality of times.
1 . A method of patterning a conductive layer disposed around a nonplanar substrate, the method comprising scribing the conductive layer thereby forming a continuous groove that traverses a perimeter of the conductive layer a plurality of times.
2 . The method of claim 1 , wherein the conductive layer comprises at least one of a metal, a semiconductor, a conductive polymer, and an insulator.
3 . The method of claim 1 , wherein the nonplanar substrate comprises at least one of metal, a semiconductor, a conductive polymer, and an insulator.
4 . The method of claim 1 , wherein the nonplanar substrate is unifacial.
5 . The method of claim 4 , wherein the unifacial nonplanar substrate is cylindrical.
6 . The method of claim 1 , wherein the nonplanar substrate is multifacial.
7 . The method of claim 6 , wherein the nonplanar substrate is bifacial.
8 . The method of claim 1 , wherein the nonplanar substrate has a width and a length that is at least three times larger than the width.
9 . The method of claim 8 , wherein the length is at least ten times larger than the width.
10 . The method of claim 1 , wherein the conductive layer has a thickness, and wherein scribing the conductive layer comprises forming a continuous groove through the thickness of the conductive layer.
11 . The method of claim 1 , wherein the groove has a repeating pattern, a non-repeating pattern, or is helical.
12 . The method of claim 1 , wherein scribing the conductive layer is performed with one of a mechanical scriber and a laser scriber.
13 . The method of claim 1 , wherein the mechanical scriber is a constant force mechanical scriber.
14 . The method of claim 1 , wherein scribing the conductive layer comprises rotating the substrate about a long axis of the substrate.
15 . The method of claim 1 , wherein scribing the conductive layer comprises moving a scribing mechanism around the substrate.
16 . The method of claim 1 , further comprising scribing the conductive layer thereby forming a continuous groove that extends along a length of the substrate.
17 . The method of claim 16 , wherein forming the continuous groove that extends along the length of the substrate comprises longitudinally translating the substrate.
18 . The method of claim 16 , wherein forming the continuous groove that extends along the length of the substrate comprises longitudinally translating a scribing mechanism.
19 . The method of claim 16 , wherein the continuous groove that extends along the length of the substrate is linear, has a repeating pattern, or has a non-repeating pattern.
20 . The method of claim 1 , further comprising forming a conductive layer overlying the scribed conductor layer.
21 . A patterned conductive layer disposed around a nonplanar substrate, wherein a boundary of the conductive layer is defined by a single groove that traverses a perimeter of the substrate a plurality of times.
22 . A patterned conductive layer disposed around a nonplanar substrate, wherein the patterned conductive layer is divided into a plurality of conductive islands by a groove that extends through a thickness of the conductive layer and traverses a perimeter of the substrate a plurality of times, and a groove extends through the thickness of the conductive layer and traverses a length of the substrate.