Motherboard interconnection device
View Patent ↗A motherboard interconnection device includes a top layer, a bottom layer, a first and a third electronic elements positioned on the top layer, and a second and a fourth electronic elements positioned on the bottom layer. A first end of the first electronic element on the top layer is connected to the first end of the second electronic element on the bottom layer with a first via hole, and the first end of the third electronic element on the top layer is connected to the first end of the fourth electronic element on the bottom layer with a second via hole. The second ends of the two electronic elements on the top layer are connected to a first part, and the second ends of the two electronic elements on the bottom layer are connected to a second part.
1. A motherboard interconnection device, comprising:
a first and a third electronic element being positioned on a top layer of the motherboard interconnection device and a second and a fourth electronic element being positioned on a bottom layer of the motherboard interconnection device;
a first via hole that connects a first bonding pad of a first end of the first electronic element on the top layer to a second bonding pad of the first end of the second electronic element on the bottom layer corresponding to the first electronic element on the top layer;
a second via hole that connects a third bonding pad of the first end of the third electronic element on the top layer to a fourth bonding pad of the first end of the fourth electronic element on the bottom layer corresponding to the third electronic element on the top layer;
a first part that connects to a bonding pad of a second end of the first and the third electronic elements on the top layer; and
a second part that connects to a bonding pad of the second end of the second and the fourth electronic elements on the bottom layer.
2. The motherboard interconnection device according to claim 1 , wherein the first, second, third, and fourth electronic elements are selected from the group consisting of a capacitor and a resistor.
3. The motherboard interconnection device according to claim 1 , wherein a type of the first part is different from a type of the second part.
4. The motherboard interconnection device according to claim 3 , wherein the first and the third electronic elements on the top layer are connected to the first part, and differential signals are transmitted to the first part through the first and the third electronic elements on the top layer of the motherboard interconnection device.
5. The motherboard interconnection device according to claim 3 , wherein the second and the fourth electronic elements on the bottom layer are connected to the second part, and differential signals are transmitted to the second part through the second and the fourth electronic elements on the bottom layer of the motherboard interconnection device.