IP Library Granted Patent US 7,932,124
Granted Patent B2
US 7,932,124 · App. 12/503,721 · Granted Apr 26, 2011

Methods of preparing photovoltaic modules

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Quick Facts
Patent No.
US 7,932,124
App. No.
12/503,721
Granted
Apr 26, 2011
Kind
B2
Abstract

Methods of preparing photovoltaic modules, as well as related components, systems, and devices, are disclosed.

Claims (27)

1. A method, comprising:

forming a first multilayer device on a substrate, the first multilayer device comprising a first electrically conductive layer and a photoactive layer, the first electrically conductive layer being between the photoactive layer and the substrate, and the photoactive layer comprising an organic electron donor material and an organic electron acceptor material; and

after forming the first multilayer device, treating the first electrically conductive layer to form a plurality of electrodes, thereby converting the first multilayer device into a first photovoltaic cell.

2. The method of claim 1 , further comprising forming a second multilayer device on the substrate before treating first electrically conductive layer, in which the second multilayer device comprises a first electrically conductive layer and a photoactive layer, the first electrically conductive layers of the first and second multilayer devices are the same layer, and treating the first electrically conductive layer converts the second multilayer device into a second photovoltaic cell.

3. The method of claim 2 , wherein each of the first and second multilayer devices further comprises a hole carrier layer.

4. The method of claim 3 , wherein the hole carrier layer comprises a polymer.

5. The method of claim 2 , wherein treating the first electrically conductive layer is carried out by laser ablation or mechanical scribing.

6. The method of claim 2 , wherein each of the first and second multilayer devices further comprises a second electrically conductive layer.

7. The method of claim 6 , wherein treating the first electrically conductive layer forms a cavity in the first electrically conductive layer between the first and second multilayer devices.

8. The method of claim 7 , further comprising disposing a first solid insulator between the first and second photovoltaic cells after treating the first electrically conductive layer.

9. The method of claim 8 , wherein at least a portion of the first solid insulator is disposed in the cavity.

10. The method of claim 9 , further comprising disposing an electrically conductive material over the first solid insulator, thereby electrically connecting the first and second photovoltaic cells.

11. The method of claim 10 , wherein the second electrically conductive layer of the first photovoltaic cell is electrically connected to the first electrically conductive layer of the second photovoltaic cell through the electrically conductive material.

12. The method of claim 6 , further comprising disposing a first solid insulator between the first and second photovoltaic cells before treating the first electrically conductive layer.

13. The method of claim 12 , wherein the first solid insulator prevents debris formed during treating the first electrically conductive layer from interacting with the first and second photovoltaic cells.

14. The method of claim 12 , wherein treating the first electrically conductive layer forms a cavity in the first electrically conductive layer between first and second multilayer devices.

15. The method of claim 14 , further comprising disposing a second solid insulator after treating the first electrically conductive layer.

16. The method of claim 15 , wherein at least a portion of the second solid insulator is disposed in the cavity.

17. The method of claim 16 , further comprising disposing an electrically conductive material over the first and second insulators, thereby electrically connecting the first and second photovoltaic cells.

18. The method of claim 17 , wherein the second electrically conductive layer of the first photovoltaic cell is electrically connected to the first electrically conductive layer of the second photovoltaic cell through the electrically conductive material.

19. The method of claim 12 , wherein treating the first electrically conductive layer is carried out on the first electrically conductive layer at a location beneath the first insulator.

20. A method, comprising:

forming a first electrically conductive layer, a photoactive layer, and a hole carrier layer on a substrate, the first electrically conductive layer being between the substrate and the photoactive layer, the photoactive layer being between the first electrically conductive layer and the hole carrier layer, and the photoactive layer comprising an organic electron donor material and an organic electron acceptor material; and

treating the first electrically conductive layer, the photoactive layer, and the hole carrier layer to form a plurality of discrete multilayer devices, each of which contains a first electrode, a photoactive layer, and a hole carrier layer.

21. A method, comprising:

forming a multilayer device on a substrate, the multilayer device comprising a first electrically conductive layer and a second layer, the first electrically conductive layer being between the substrate and the second layer, and the electrically conductive layer comprising an electrically conductive metal, an electrically conductive alloy, an electrically conductive polymer, or an electrically conductive metal oxide; and

after forming the multilayer device, forming the first electrically conductive layer into a plurality of discrete electrodes.

Assignments (7)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 15, 2023
From: MERCK PATENT GMBH
To: ASCA
Reel/Frame 062985/0513 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2013
From: KONARKA TECHNOLOGIES, INC.
To: MERCK KGAA
Reel/Frame 029717/0048 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 29, 2013
From: MERCK KGAA
To: MERCK PATENT GMBH
Reel/Frame 029717/0065 →
SECURITY AGREEMENT Recorded Oct 26, 2011
From: KONARKA TECHNOLOGIES, INC.
To: TOTAL GAS & POWER USA (SAS)
Reel/Frame 027465/0192 →
SECURITY AGREEMENT Recorded Oct 17, 2011
From: KONARKA TECHNOLOGIES, INC.
To: MASSACHUSETTS DEVELOPMENT FINANCE AGENCY
Reel/Frame 027297/0772 →
AMENDMENT TO SECURITY AGREEMENT Recorded Oct 17, 2011
From: KONARKA TECHNOLOGIES, INC.
To: MASSACHUSETTS DEVELOPMENT FINANCE AGENCY
Reel/Frame 027468/0697 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 16, 2009
From: BRABEC, CHRISTOPH; ECKERT, ROBERT D.; GRAVES, ROBERT L.; HAUCH, JENS; PICHLER, KARL; SOKOLIK, IGOR; WANG, LIAN
To: KONARKA TECHNOLOGIES, INC.
Reel/Frame 022967/0246 →