Method of forming photoresist burr edge and method of manufacturing array substrate
View Patent ↗A method of forming a photoresist burr edge and a method of manufacturing an array substrate are provided in the present invention. The method of manufacturing an array substrate comprises: forming a gate line and a gate electrode on a substrate; forming a data line, a source electrode, a drain electrode and a TFT channel region without removing the photoresist on the data line, the source electrode and the drain electrode; depositing a passivation layer; removing the remained photoresist and the passivation layer thereon by a lifting-off process; applying a photoresist layer; forming a photoresist burr edge of peak shape; depositing a transparent conductive film; forming a pixel electrode by a lifting-off process, wherein the pixel electrode is directly connected with the drain electrode.
1. A method of forming a photoresist burr edge comprising:
applying a photoresist layer on a substrate;
forming a first thickness region, a second thickness region, and a third thickness region of the photoresist layer by exposing the photoresist layer with a gray tone mask or a half-tone mask and then developing the exposed photoresist layer, wherein the first thickness region, the second thickness region, and the third thickness region are integrally connected, and the first thickness region is between the second thickness region and the third thickness region, wherein the first thickness region has a photoresist ridge upwardly projected on the photoresist layer and corresponds to the region where a photoresist burr edge is to be formed, the second thickness region of the photoresist layer corresponds to the region where no structural pattern is to be formed, and the third thickness region corresponds to the region where a structural pattern is to be formed; and
immediately following the developing of the exposed photoresist layer to obtain the first thickness region, the second thickness region, and the third thickness region, performing an ashing process on the developed photoresist layer for forming the photoresist burr edge of peak shape in the first thickness region, remaining the photoresist in the second thickness region and completely removing the photoresist in the third thickness region.
2. The method according to claim 1 , wherein the applying of the photoresist layer on the substrate comprises applying the photoresist with a thickness of about 1.8 μm to about 2.2 μm on the substrate.
3. The method according to claim 1 , wherein the first thickness region corresponds to the region with a transmissivity of about 0% of the gray-tone mask or half-tone mask, the second thickness region corresponds to the region with a transmissivity of about 10% to 40% of the gray-tone mask or half-tone mask, and the third thickness region corresponds to the region with a transmissivity of about 60% to 90% of the gray-tone mask or half-tone mask.
4. The method according to claim 1 , wherein the forming of the first thickness region, the second thickness region, and the third thickness region comprises forming the first thickness region, the second thickness region and the third thickness region of the photoresist layer by exposing with the gray-tone mask or a half-tone mask and developing,
wherein the photoresist ridge is formed in the first thickness region and the first thickness region has a thickness of about 1.8 μm to about 2.2 μm and corresponds to the region where the photoresist burr edge is to be formed, the second thickness region of the photoresist layer has a thickness of about 1.3 μm to about 1.6 μm and corresponds to the region where no structural pattern is to be formed, and the third thickness region has a thickness of about 0.4 μm to about 0.6 μm and corresponds to the region where a structural pattern is to be formed.
5. The method according claim 1 , wherein the forming the photoresist burr edge comprises forming the photoresist burr edge of peak shape in the first thickness region, remaining the photoresist in the second thickness region to have a thickness of about 0.9 μm to about 2.2 μm, and completely removing the photoresist in the third thickness region by an ashing process.
6. A method of forming a photoresist burr edge comprising:
applying a photoresist layer on a substrate; and exposing the photoresist layer with a normal mask and then developing the exposed photoresist layer to form a completely remained region and a completely removed region of the photoresist layer by, wherein the completely remained region corresponds to the region where no structural pattern is to be formed, and the completely removed region corresponds to the region where a structural pattern is to be formed and the photoresist in the completely removed region is removed completely; and
immediately following the developing of the exposed photoresist layer to obtain the completely remained region and the completely removed region of the photoresist layer, dry-etching the developed photoresist layer by using double frequency plasma mode and setting the etching rate to be higher at a central portion of the completely remained region of the photoresist layer and to be lower at an edge portion of the completely remained region of the photoresist layer, so that forming a photoresist burr edge of peak shape at the edge portion of the completely remained region of the photoresist layer and upwardly projected on the formed photoresist pattern.