Method of supplying ink to ink ejection nozzles
View Patent ↗A method of supplying ink to ink ejection nozzles on a printhead for an inkjet printer with a print engine controller for controlling the printhead operation involving the provision a printhead IC having an array of the ink ejection nozzles formed on a substrate, the provision of circuitry for electrical connection to the print engine controller, the provision of a support member for supporting the printhead integrated circuit and the circuitry within the printer, the provision of a thermoplastic polymer sealing film, and securing the polymer film to a mounting surface of the support member by applying heat and pressure for a predetermined time, mounting the printhead integrated circuit and the circuitry to the support member via the polymer film and, electrically connecting the circuitry to the printhead integrated circuit. The mounting surface has ink feed channels formed in it and the polymer film is attached to the mounting surface between the ink feed channels and the printhead integrated circuits. The polymer film has an array of apertures such that the ejection nozzles are in fluid communication with the ink feed channels.
1. A method of supplying ink to ink ejection nozzles on a printhead for an inkjet printer with a print engine controller for controlling the printhead operation, the method comprising the steps of:
providing a printhead integrated circuit having an array of the ink ejection nozzles formed on a substrate;
providing circuitry for electrical connection to the print engine controller;
providing a support member for supporting the printhead integrated circuit and the circuitry within the printer;
providing a thermoplastic polymer sealing film;
securing the polymer film to a mounting surface of the support member by applying heat and pressure thereto for a predetermined time;
mounting the printhead integrated circuit and the circuitry to the mounting surface via the polymer film; and,
electrically connecting the circuitry to the printhead integrated circuit; wherein,
a plurality of ink feed channels extend over the mounting surface for establishing fluid communication with at least one ink storage compartment; and,
the polymer film is attached to the support member between the ink feed channels and the printhead integrated circuits, the polymer film having an array of apertures such that the ejection nozzles are in fluid communication with the ink feed channels.
2. A method according to claim 1 wherein the circuitry is a flexible printed circuit board with tracks of conductive material in layers of polyimide film, and the printhead integrated circuit and the flexible printed circuit board are simultaneously attached to the support member via the polymer film.
3. A method according to claim 1 wherein the circuitry is a flexible printed circuit board with tracks of conductive material in layers of polyimide film, and the flexible printed circuit board is attached to the polymer film after the printhead integrated circuit is attached.
4. A method according to claim 3 wherein the flexible printed circuit board has an adhesive area for attachment to the polymer film once the polymer film has cooled and hardened after the printhead integrated circuit attachment process.
5. A method according to claim 1 wherein the circuitry is tracks of conductive material laid within the polymer film.
6. A method according to claim 1 wherein the polymer film is more than 25 microns thick.
7. A method according to claim 6 wherein the polymer film is about 50 microns thick.
8. A method according to claim 1 wherein the array of apertures is an array of laser drilled holes in registration with respective ends of the ink feed conduits.
9. A method according to claim 1 wherein the polymer film is a laminate with an adhesive layer on both sides of a thermoplastic film.
10. A method according to claim 9 wherein the thermoplastic film is a polyethylene terephthalate or polysulphone.
11. A method according to claim 1 wherein the mounting surface and the ink feed channels are a liquid crystal polymer micro molding.