IP Library Granted Patent US 8,076,682
Granted Patent B2
US 8,076,682 · App. 12/506,632 · Granted Dec 13, 2011

Contact for a semiconductor light emitting device

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Quick Facts
Patent No.
US 8,076,682
App. No.
12/506,632
Granted
Dec 13, 2011
Kind
B2
Abstract

A semiconductor structure includes a light emitting layer disposed between an n-type region and a p-type region. A p-electrode is disposed on a portion of the p-type region. The p-electrode includes a reflective first material in direct contact with a first portion of the p-type region and a second material in direct contact with a second portion of the p-type region adjacent to the first portion. The first material and second material are formed in planar layers of substantially the same thickness.

Claims (16)

1. A device comprising:

a semiconductor structure comprising a light emitting layer disposed between an n-type region and a p-type region; and

a p-electrode disposed on a portion of the p-type region, the p-electrode comprising:

a reflective first material in direct contact with a first portion of the p-type region; and

a second material in direct contact with a second portion of the p-type region adjacent to the first portion;

wherein the first material and second material are different materials and are formed in planar layers of substantially the same thickness.

2. The device of claim 1 wherein the first material comprises silver.

3. The device of claim 1 wherein the second material comprises aluminum.

4. The device of claim 1 wherein the second material comprises one of an aluminum alloy, an aluminum metal stack, AlTi, an Al 2 O 3 /Al bilayer, and a SiO 2 /Al bilayer.

5. The device of claim 1 wherein:

a portion of the p-type region and light emitting layer are etched away to reveal a portion of the n-type region; and

a remaining portion of the p-type region forms a mesa;

wherein the second material is disposed between the first material and an edge of the mesa.

6. The device of claim 1 wherein the p-electrode further comprises a third material disposed over the first and second material, wherein the third material is configured to prevent migration of the first material.

7. The device of claim 1 wherein the p-electrode further comprises a third material disposed over the first and second material, wherein a bottom surface of the third material is in direct contact with both the first material and the second material.

8. The device of claim 6 wherein the third material comprises titanium and tungsten.

Assignments (8)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 10, 2025
From: LUMILEDS LLC
To: LUMILEDS SINGAPORE PTE. LTD.
Reel/Frame 071888/0086 →
RELEASE OF SECURITY INTEREST Recorded Jan 29, 2025
From: SOUND POINT AGENCY LLC
To: LUMILEDS LLC; LUMILEDS HOLDING B.V.
Reel/Frame 070046/0001 →
SECURITY INTEREST Recorded Jan 5, 2023
From: LUMILEDS LLC; LUMILEDS HOLDING B.V.
To: SOUND POINT AGENCY LLC
Reel/Frame 062299/0338 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 9, 2017
From: KONINKLIJKE PHILIPS N.V.
To: LUMILEDS LLC
Reel/Frame 044416/0019 →
CHANGE OF NAME Recorded Nov 8, 2017
From: PHILIPS LUMILEDS LIGHTING COMPANY, LLC
To: LUMILEDS LLC
Reel/Frame 044723/0034 →
CHANGE OF NAME Recorded Nov 8, 2017
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 044723/0025 →
SECURITY INTEREST Recorded Jul 7, 2017
From: LUMILEDS LLC
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 043108/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 21, 2009
From: EPLER, JOHN E.
To: KONINKLIJKE PHILIPS ELECTRONICS N V; PHILIPS LUMILEDS LIGHTING COMPANY, LLC
Reel/Frame 022984/0001 →