Adhesive compositions comprising a polyfarnesene
View Patent ↗Adhesive composition comprises a polyfarnesene and a tackifier. The polyfarnesene can be a farnesene homopolymer derived from a farnesene (e.g., α-farnesene or β-farnesene) or a farnesene interpolymer derived from a farnesene and at least a vinyl monomer. In some embodiments, the at least one vinyl monomer is ethylene, an α-olefin such as styrene, or a substituted or unsubstituted vinyl halide, vinyl ether, acrylonitrile, acrylic ester, methacrylic ester, acrylamide or methacrylamide, or a combination thereof. The composition disclosed herein can be used as a hot melt adhesive, a pressure sensitive adhesive or the like.
1. An adhesive composition comprising a polyfarnesene and a tackifier, wherein the polyfarnesene has formula (X′):
wherein n is from 1 to about 100,000; m is from 0 to about 100,000; X has one or more of formulae (I′)-(VIII′):
Y has formula (IX′):
wherein R 1 has formula (XI):
and
R 2 has formula (XII):
R 3 has formula (XIII):
and
R 4 has formula (XIV):
wherein each of R 5 , R 6 , R 7 and R 8 is independently H, alkyl, cycloalkyl, aryl, cycloalkenyl, alkynyl, heterocyclyl, alkoxy, aryloxy, carboxy, alkoxycarbonyl, aminocarbonyl, alkylaminocarbonyl, dialkylaminocarbonyl, acyloxy, nitrile or halo, and wherein formula (I′) is in an amount of at most about 80 wt. % and formula (II′) is in an amount of from about 5 wt. % to about 99 wt. %, based on a total weight of the polyfarnesene, with a proviso that when m is 1 or greater, a mole percent ratio of X to Y is from about 1:4 to about 100:1 and wherein the tackifier has a ring and ball softening point equal to or greater than 60° C., as measured in accordance with ASTM 28-67 and amount of the tackifier is from about 0.1 wt. % to about 70 wt. %.
2. The adhesive composition of claim 1 , wherein the polyfarnesene has a weight-average molecular weight greater than about 60,000 daltons.
3. The adhesive composition of claim 1 , wherein the polyfarnesene has a T g less than about −60° C.
4. The adhesive composition of claim 1 , wherein the tackifier is present from about 5 wt. % to about 70 wt. %, based on a total weight of the adhesive composition.
5. The adhesive composition of claim 1 further comprising an additive selected from the group consisting of plasticizers, oils, waxes, antioxidants, UV stabilizers, colorants or pigments, fillers, flow aids, coupling agents, crosslinking agents, surfactants, solvents and combinations thereof.
6. The adhesive composition of claim 1 , wherein m is 0 and the polyfarnesene is a farnesene homopolymer.
7. The adhesive composition of claim 1 , wherein m is from 1 to about 100,000 and the polyfarnesene is a random farnesene interpolymer.
8. The adhesive composition of claim 1 , wherein m is from 1 to about 100,000 and the polyfarnesene is a block farnesene interpolymer.
9. The adhesive composition of claim 8 , wherein the block farnesene interpolymer comprises one block comprising X and two blocks comprising Y and wherein the block comprising X is between the two blocks comprising Y.
10. The adhesive composition of claim 9 , wherein R 5 is aryl; and each of R 6 , R 7 and R 8 is H.
11. The adhesive composition of claim 10 , wherein the aryl is phenyl.
12. The adhesive composition of claim 1 , wherein an amount of formula (III′) is at least about 70 wt. %, based on a total weight of the polyfarnesene.
13. The adhesive composition of claim 1 , wherein the adhesive composition is a hot melt adhesive composition or a pressure sensitive adhesive composition.
14. An article comprising a substrate coated with the adhesive composition of claim 1 .
15. The article of claim 14 , wherein the article is a paper product, packaging material, laminated wood panel, kitchen countertop, vehicle, label, disposable diaper, hospital pad, feminine sanitary napkin, surgical drape, tape, case, carton, tray, medical device or bandage.
16. An adhesive composition comprising a polyfarnesene and a tackifier, wherein the polyfarnesene is prepared by polymerizing β-farnesene in the presence of a catalyst, wherein cis-1,4-microstructure in the polyfarnesene is in an amount of at most about 80 wt. %, based on a total weight of the polyfarnesene, and wherein the tackifier has a ring and ball softening point equal to or greater than 60° C., as measured in accordance with ASTM 28-67 and an amount of the tackifier is from about 0.1 wt. % to about 40 wt. %.
17. The adhesive composition of claim 16 , wherein the β-farnesene is copolymerized with a vinyl monomer to form a farnesene interpolymer and wherein a mole percent ratio of the farnesene to the vinyl monomer is from about 1:4 to about 100:1.
18. The adhesive composition of claim 17 , wherein the vinyl monomer is styrene.
19. The adhesive composition of claim 18 , wherein the farnesene interpolymer is a block interpolymer.
20. An article comprising a substrate coated with the adhesive composition of claim 16 .