Method of fabricating inkjet printhead assembly having backside electrical connections

1. A method of fabricating an inkjet printhead assembly having backside electrical connections, said method comprising the steps of:

providing one or more printhead integrated circuits, each printhead integrated circuit having a frontside comprising drive circuitry and a plurality of inkjet nozzle assemblies, a backside having one or more ink inlets and a recessed edge portion, and one or more connectors extending through said integrated circuit, each connector having a head connected to said drive circuitry and a base in said recessed edge portion;

positioning a connection end of a connector film in the recessed edge portion of at least one of said printhead integrated circuits, said connector film comprising a plurality of conductive tracks, each conductive track having a respective film contact at said connection end;

connecting each film contact to the base of a corresponding connector; and

attaching the backside of each printhead integrated circuit together with said connector film to an ink supply manifold so as to provide the inkjet printhead assembly having backside electrical connections.

2. The method of claim 1 , wherein said attaching step sandwiches the connection end of said connector film between part of said ink supply manifold and said one or more printhead integrated circuits.

3. The method of claim 1 , wherein said film is a tape-automated bonding (TAB) film.

4. The method of claim 1 , wherein said recessed portion is defined along a longitudinal edge region of each printhead integrated circuit.

5. The method of claim 1 , wherein each connector is tapered from said frontside towards said backside.

6. The method of claim 1 , wherein each connector is comprised of copper.

7. The method of claim 1 , wherein said connecting step comprises soldering each film contact to the base of its corresponding connector.

8. The method of claim 1 , wherein said attaching step is performed using an adhesive film.

9. The method of claim 1 , wherein, in said connecting step, each printhead integrated circuit is connected to a respective connector film.

10. The method of claim 1 , wherein, in said connecting step, a plurality of printhead integrated circuits are connected to the same connector film.

11. The method of claim 1 , wherein said plurality of printhead integrated circuits are attached to said ink supply manifold in an end-on-end butting arrangement to provide a pagewidth printhead assembly.

12. The method of claim 8 , wherein said adhesive film has a plurality of ink supply apertures defined therein.

13. The method of claim 12 , wherein said attaching step comprises aligning each printhead integrated circuit with said adhesive film such that each ink supply aperture is aligned with an ink inlet, bonding said printhead integrated circuits to one side of said adhesive film, and bonding an opposite side of said film to said ink supply manifold.

14. The method of claim 13 , wherein said backside has a plurality of ink supply channels extending longitudinally along the printhead integrated circuit, each ink supply channel defining said one or more ink inlets, wherein each ink supply channel supplies ink to a plurality of frontside inlets, and each frontside inlet supplies ink to one or more of said inkjet nozzle assemblies.

15. The method of claim 14 , wherein each ink supply channel has a depth corresponding to a depth of the recessed portion.