Semiconductor device and electronic equipment using same
View Patent ↗A semiconductor device includes: a first lead having an element mounting portion; a second lead located in a same plane as the first lead, with a predetermined space left between the first lead and the second lead; a molding encapsulant made of a resin for fixing the leads; and a semiconductor element affixed to a top surface of the element mounting portion of the first lead. The molding encapsulant covers at least part of each of upper and lower surfaces of the leads. A resin injection hole mark, which is a mark of a hole through which the encapsulant has been injected, is left on the encapsulant, and part of the resin injection hole mark is located above the first lead or the second lead, and the remaining part of the resin injection hole mark is located above a space between the first lead and the second lead.
1. A semiconductor device comprising:
a first lead having an element mounting portion;
a second lead disposed with a predetermined space left between the first lead and the second lead;
an encapsulant made of a transfer-molding resin for fixing the first lead and the second lead; and
a semiconductor element disposed on a top surface of the element mounting portion of the first lead, wherein:
the encapsulant covers at least part of upper and lower surfaces of the first lead and at least part of upper and lower surfaces of the second lead, and
a resin injection hole mark, which is a mark of a hole through which the encapsulant is injected, is left on the encapsulant, and part of the resin injection hole mark is located above the first lead or the second lead, and the remaining part of the resin injection hole mark is located above a space between the first lead and the second lead.
2. A semiconductor device comprising:
a first lead having an element mounting portion;
a second lead disposed with a predetermined space left between the first lead and the second lead;
an encapsulant made of a transfer-molding resin for fixing the first lead and the second lead; and
a semiconductor element disposed on a top surface of the element mounting portion of the first lead, wherein:
the encapsulant covers at least part of upper and lower surfaces of the first lead and at least part of upper and lower surfaces of the second lead,
a resin injection hole mark, which is a mark of a hole through which the encapsulant is injected, is left on the encapsulant, and part of the resin injection hole mark is located above the first lead or the second lead, and the remaining part of the resin injection hole mark is located above a space between the first lead and the second lead, and
an area of the first lead or the second lead that faces the resin injection hole mark is a thin area at which a thickness of the first lead or the second lead is smaller than the other area of the first lead or the second lead that does not face the resin injection hole mark.
3. The semiconductor device of claim 2 , wherein
the area of the first lead or the second lead that faces the resin injection hole mark is formed by being punched out downward from the resin injection hole mark side.
4. The semiconductor device of claim 1 , wherein
the semiconductor element is a laser diode.
5. Electronic equipment comprising the semiconductor device of claim 1 as a light source.
6. The semiconductor device of claim 2 , wherein
the semiconductor element is a laser diode.
7. Electronic equipment comprising the semiconductor device of claim 2 as a light source.
8. Electronic equipment comprising the semiconductor device of claim 4 as a light source.
9. Electronic equipment comprising the semiconductor device of claim 6 as a light source.
10. The semiconductor device of claim 1 , wherein the second lead is disposed in a same plane as the first lead.
11. The semiconductor device of claim 2 , wherein the second lead is disposed in a same plane as the first lead.