IP Library Granted Patent US 7,985,059
Granted Patent B2
US 7,985,059 · App. 12/512,889 · Granted Jul 26, 2011

Formable sealant barrier

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Quick Facts
Patent No.
US 7,985,059
App. No.
12/512,889
Granted
Jul 26, 2011
Kind
B2
Abstract

In one embodiment of the present invention, an assembly for HPHT processing comprises a can with an opening. A powder mixture is disposed within the opening. A substrate is disposed within the opening adjacent the powder mixture. Paint is coated on a surface within the opening and opposite the powder mixture with respect to the substrate. A meltable sealant is disposed within the opening and opposite the substrate with respect to the surface and a cap is covering the opening.

Claims (22)

1. An assembly for HPHT processing, comprising:

a can with an opening;

a powder mixture disposed within the opening;

a substrate disposed within the opening adjacent the powder mixture;

a formable sealant barrier disposed within the opening and opposite the powder mixture from the substrate;

a meltable sealant disposed within the opening and opposite the substrate from the formable sealant barrier;

a cap covering the opening;

wherein the formable sealant barrier comprises aluminum oxide, boron nitride or a combination thereof;

a first layer of formable sealant barrier is disposed adjacent to the substrate;

a first niobium disc is disposed intermediate the first layer of formable sealant barrier and a second layer of formable sealant barrier;

an under lap component is disposed adjacent the second layer of formable sealant barrier and opposite the first niobium disc;

a metal disc is disposed opposite the second layer of formable sealant barrier from the under lap component;

the meltable sealant layer is disposed opposite the second layer of formable sealant barrier from the under lap component; and

a cap is placed on the assembly.

2. The assembly of claim 1 , wherein the formable sealant barrier comprises a powder.

3. The assembly of claim 1 , wherein the assembly comprises an under lap component.

4. The assembly of claim 1 , comprising a ram disposed within the opening adjacent the formable sealant barrier.

5. The assembly of claim 1 , wherein the formable sealant barrier comprises a first layer and a second layer.

6. The assembly of claim 5 , wherein the first layer of formable sealant barrier comprises boron nitride.

7. The assembly of claim 1 , wherein the formable sealant barrier comprises a formable anti-wetting material.

8. The assembly of claim 1 , wherein the meltable sealant comprises a material selected from the group consisting of copper, nickel, cobalt, gold, silver, manganese, palladium, titanium, niobium, zinc, phosphorus, boron, aluminum, cadmium, chromium, tin, silicon, tantalum, alloys, compound mixtures, and combinations thereof having a melting point, or melting range, at least partially higher than the temperature required to cleanse the assembly.

9. The assembly of claim 1 , wherein the can opening comprises a fold.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 15, 2015
From: HALL, DAVID R.
To: NOVATEK IP, LLC
Reel/Frame 036109/0109 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 8, 2015
From: CROCKETT, RONALD B.
To: HALL, DAVID R.
Reel/Frame 035851/0913 →