IP Library Granted Patent US 8,284,964
Granted Patent B2
US 8,284,964 · App. 12/513,881 · Granted Oct 9, 2012

Compound membrane, method of manufacturing the same, and acoustic device

Assignee: Knowles Electronics Asia PTE. Ltd.
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Quick Facts
Patent No.
US 8,284,964
App. No.
12/513,881
Granted
Oct 9, 2012
Kind
B2
Abstract

A compound membrane ( 100 ) for an acoustic device ( 200 ), the compound membrane ( 100 ) comprising a first layer ( 101 ) and a second layer ( 102 ), wherein a value of Young's modulus of the second layer ( 102 ) does not vary more than essentially 30% in a temperature range between essentially −20° C. and essentially +85° C.

Claims (16)

1. A compound membrane for an acoustic device, the compound membrane comprising:

a first layer;

a second layer connected to the first layer,

wherein a value of Young's modulus of the second layer does not vary more than 30% in a temperature range between −20° C. and +85° C.

2. The compound membrane according to claim 1 , wherein the value of Young's modulus of the second layer does not vary more than 30% in a temperature range between −40° C. and +85° C.

3. The compound membrane according to claim 1 , wherein the second layer comprises or consists of a thermoplastic material.

4. The compound membrane according to claim 3 , wherein the thermoplastic material of the second layer has a glass transition temperature in a temperature range between −60° C. and −10 C.

5. The compound membrane according to claim 1 , wherein the second layer comprises of silicone.

6. The compound membrane according to claim 1 , wherein the first layer comprises of a thermoplastic material.

7. The compound membrane according to claim 6 , wherein the thermoplastic material of the first layer has a glass transition temperature in a temperature range between +120° C. and +150° C.

8. The compound membrane according to claim 1 , wherein the value of Young's modulus of the second layer is smaller than a value of Young's modulus of the first layer.

9. The compound membrane according to claim 1 , wherein the second layer is thicker than the first layer.

10. The compound membrane according to claim 1 , wherein the first layer and the second layer have a thickness in a range between 1 μm and 150 μm.

11. The compound membrane according to claim 1 , wherein the compound membrane is particularly adapted to at least one of the group comprising of an electroacoustic transducer, an electrodynamic acoustic device, a piezoelectric acoustic device, a speaker, a microphone, a receiver, and a vibrator.

12. A method of manufacturing a compound membrane for an acoustic device, the method comprising:

forming a second layer on a first layer, wherein a value of Young's modulus of the second layer does not vary more than 30% in a temperature range between −20° C. and +85° C.

Assignments (16)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 28, 2019
From: SOUND SOLUTIONS INTERNATIONAL CO., LTD.
To: SSI NEW MATERIAL (ZHENJIANG) CO., LTD.
Reel/Frame 051144/0466 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CHANGE OF NAME Recorded Sep 14, 2016
From: KNOWLES ELECTRONICS (BEIJING) CO., LTD.
To: SOUND SOLUTIONS INTERNATIONAL CO., LTD.
Reel/Frame 040028/0643 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 9, 2016
From: KNOWLES IPC (M) SDN. BHD.
To: KNOWLES ELECTRONICS (BEIJING) CO., LTD.
Reel/Frame 039977/0085 →
PATENT RELEASE Recorded Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 5, 2015
From: KNOWLES ELECTRONICS ASIA PTE. LTD.
To: KNOWLES IPC (M) SDN BHD
Reel/Frame 034911/0664 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 28, 2011
From: NXP B.V.
To: KNOWLES ELECTRONICS ASIA PTE. LTD.
Reel/Frame 026665/0310 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 7, 2009
From: WINDISCHBERGER, SUSANNE; LUTZ, JOSEF; FRASL, EWALD
To: NXP, B.V.
Reel/Frame 022650/0600 →
Continuity (1)
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