IP Library Patent Application 12513894
Patent Application
App. No. 12/513,894

ACOUSTIC DEVICE AND METHOD OF MANUFACTURING THE SAME

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Quick Facts
Patent No.
US None
App. No.
12/513,894
Abstract

An acoustic device ( 200, 300 ) comprising an oscillatory compound membrane ( 201 ) comprising a plurality of layers ( 202, 203, 205 ), wherein one of the plurality of layers ( 202, 203, 205 ) is a thermoplastic layer ( 203, 205 ), wherein the thermoplastic layer ( 203, 205 ) is joined to at least one further component ( 204, 206, 207 ) of the acoustic device ( 200 ).

Claims (18)

1 . An acoustic device, comprising:

an oscillatory compound membrane that includes a plurality of layers, wherein one of the plurality of layers is a thermoplastic layer, and and

at least one further component of the acoustic device,

wherein the thermoplastic layer is joined to the at least one further component of the acoustic device.

2 . The acoustic device according to claim 1 , wherein the thermoplastic layer is joined to the at least one further component by tempering.

3 . The acoustic device according to claim 1 , wherein an externally exposed surface of the thermoplastic layer is joined to the at least one further component.

4 . The acoustic device according to claim 1 , wherein the thermoplastic layer is an acoustically damping layer.

5 . The acoustic device according to claim 1 , wherein the thermoplastic layer is joined to the at least one further component without an additive.

6 . The acoustic device according to claim 1 , wherein the at least one further component of the acoustic device comprises at least one of the group comprising a base member, a cover member, a transducer element, and a coil.

7 . The acoustic device according to claim 1 , wherein a second of the plurality of layers is a thermoplastic layer that opposes the one of the plurality of layers, wherein the second of the plurality of layers is joined to the at least one further component of the acoustic device.

8 . The acoustic device according to claim 1 , wherein the acoustic device is an electrodynamic acoustic device or a piezoelectric acoustic device.

9 . The acoustic device according to claim 1 , wherein the acoustic device is a speaker, a microphone, a receiver, or a vibrator.

10 . The acoustic device according to claim 1 , wherein the acoustic device is a handheld sound reproduction system, a wearable device, a near-field sound reproduction system, headphones, earphones, a portable audio player, an audio surround system, a mobile phone, a headset, a hearing aid, a handsfree system, a television device, a TV set audio player, a video recorder, a monitor, a gaming device, a laptop, a DVD player, a CD player, a hard_disk-based media player, an internet radio device, a public entertainment device, an MP3 player, a hi-fi system, a vehicle entertainment device, a car entertainment device, a medical communication system, a speech communication device, a home cinema system, a home theater system, a flat television apparatus, an ambiance creation device, or a music hall system.

11 . A method of manufacturing an acoustic device, the method comprising

forming an oscillatory compound membrane that includes a plurality of layers, wherein one of the plurality of layers is a thermoplastic layer; and

joining the thermoplastic layer to at least one further component of the acoustic device.

12 . The method according to claim 11 , wherein the joining step comprises joining an externally exposed surface of the thermoplastic layer to the at least one further component, wherein the thermoplastic layer is an acoustically damping layer.

13 . The method according to claim 12 , further comprising joining a second of the plurality of layers to the at least one further component of the acoustic device, wherein the second of the plurality of layers is a thermoplastic layer that opposes the one of the plurality of layers.

Assignments (12)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
PATENT RELEASE Recorded Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 28, 2011
From: NXP B.V.
To: KNOWLES ELECTRONICS ASIA PTE. LTD.
Reel/Frame 026665/0310 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 7, 2009
From: WINDISCHBERGER, SUSANNE; FRASL, EWALD
To: NXP, B.V.
Reel/Frame 022650/0811 →