Method of fabricating an entity and corresponding device
View Patent ↗A method of fabricating an electronic entity includes the steps of: forming at least part of the entity by hardening a material ( 28 ) in a mold, and ( 26 ); personalizing the entity while in the mould ( 26 ). A corresponding device is also described.
1. A method of fabricating an electronic entity, comprising the steps of:
forming at least part of the entity by hardening a material in a mold;
personalizing the entity while in the mold, including electrically personalizing the entity by storing data in a memory of the electronic entity; and
removing the personalized entity from the mold.
2. A method according to claim 1 , wherein the step of personalizing occurs while the material is hardening.
3. A method according to claim 1 , wherein the step of personalizing occurs while the material is flowing into the mold.
4. A method according to claim 1 , wherein the step of personalizing includes forming a graphical representation on a face of the entity.
5. A method of fabricating an electronic entity, comprising the steps of:
forming at least part of the entity by hardening a material in a mold; and
personalizing the entity while in the mold, including storing data in a memory of the electronic entity,
wherein a contact plate of the entity electrically linked to the memory is connected to a personalization equipment while the entity is in the mold.
6. A method according to claim 5 , wherein a contact head connected to the personalization equipment is inserted in an opening of the mold for contacting the contact plate.
7. A method according to claim 5 , wherein at least one conductor extending through the mold contacts the contact plate for connection to the personalization equipment.
8. A method of fabricating an electronic entity, comprising the steps of:
forming at least part of the entity by hardening a material in a mold; and
personalizing the entity while in the mold, including storing data in a memory of the electronic entity,
wherein the step of personalizing includes exchanging said data through contactless communication between a microcircuit connected to the memory and a contactless head connected to the personalization equipment.
9. A method according to claim 1 , wherein the mold is an open mold.
10. A method according to claim 9 , wherein a forming plate is applied against said material in an open part of the mold.
11. A method according to claim 8 , wherein the contactless head faces an open side of the mold, and the mold is an open mold.
12. A method according to claim 1 , wherein the step of forming includes injection molding said part of the entity.
13. A method according to claim 1 , wherein a plurality of entities are formed within said mold.
14. A method according to claim 13 , wherein personalization of said entities is performed simultaneously.
15. A method according to claim 1 , wherein the electronic entity is a USB key.
16. A method according to claim 1 , wherein the electronic entity is a microcircuit card.
17. A method according to claim 16 , wherein the microcircuit card is in conformity with ISO7816.
18. A device for fabricating an electronic entity, comprising:
a mold for forming at least part of the entity by hardening a material; and
means for personalizing the entity while in the mold,
wherein the means for personalizing includes means for electrically personalizing the entity by storing data in a memory of the electronic entity.
19. A device according to claim 18 , wherein the means for personalizing includes means for forming a graphical representation on a face of the entity.
20. A device for fabricating an electronic entity, comprising:
a mold for forming at least part of the entity by hardening a material;
means for connecting a contact plate of the entity electrically linked to the memory to a personalization equipment while the entity is in the mold; and
means for personalizing the entity while in the mold,
wherein the means for personalizing includes means for storing data in a memory of the electronic entity.
21. A device according to claim 20 , wherein a contact head connected to the personalization equipment is adapted for insertion in an opening of the mold for contacting the contact plate.
22. A device according to claim 20 , wherein at least one conductor extending through the mold is adapted to contact the contact plate for connection to the personalization equipment.
23. A device, for fabricating an electronic entity, comprising:
a mold for forming at least part of the entity by hardening a material;
means for personalizing the entity while in the mold,
wherein the means for personalizing includes means for storing data in a memory of the electronic entity and means for exchanging said data through contactless communication between a microcircuit connected to the memory and a contactless head connected to the personalizing equipment.
24. A device according to claim 18 , wherein the mold is an open mold.
25. A device according to claim 24 , wherein a forming plate is applied against said material in an open part of the mold.
26. A device according to claim 23 , wherein the contactless head faces an open side of the mold, and the mold is an open mold.
27. A device according to claim 18 , wherein said mold is adapted to injection molding said part of the entity.
28. A device according to claim 18 , wherein said mold is adapted to form a plurality of entities.
29. A device according to claim 28 , including means for simultaneously personalizing said entities.
30. A device according to claim 18 , wherein the electronic entity is a USB key.
31. A device according to claim 18 , wherein the electronic entity is a microcircuit card.
32. A device according to claim 31 , wherein the microcircuit card is in conformity with ISO7816.
33. A device according to claim 18 , further comprising means for removing the personalized entity from the mold.