Sealing material and mounting method using the sealing material
View Patent ↗A sealing material is provided which has sealing characteristics with low stress and high reliability upon mounting electronic parts on a board, and good repairablity after the sealing. The sealing material contains a heat-curable resin component and is characterized by ΔE/ΔT in a range of from 0.5 MPa/° C. to 30 MPa/° C. wherein ΔE/ΔT represents a ratio of change (ΔE) in storage elastic modulus (E) relative to a temperature change (ΔT) when the storage elastic modulus (E) is determined as the temperature is raised within a temperature range including a glass transition point (Tg) of the cured sealing material.
1. A sealing material comprising at least (a) a heat curable resin component and (b) a hardner for the heat curable resin component, which has:
a ΔE/ΔT in a range of from 0.5 MPa/° C. to 6.7 MPa/° C. wherein ΔE/ΔT represents a ratio of change (ΔE) in storage elastic modulus (E) relative to a temperature change (ΔT) when the storage elastic modulus (E) is determined as the temperature is raised within a temperature range including a glass transition point (Tg) of the cured sealing material,
wherein the glass transition point (Tg) of the sealing material is in a range from −80° C. to 50° C. after being cured.
2. The sealing material according to claim 1 , which further comprises (c) an insulating filler component and/or (d) a reactive diluent component.
3. The sealing material according to claim 1 , which has an elastic modulus of 100 MPa or higher at a temperature T 1 which is lower than the glass transition point (Tg) and the elastic modulus of 10 MPa or lower at a temperature T 2 which is higher than the glass transition point (Tg).
4. The sealing material according to claim 3 , which has an elastic modulus of 1 GPa or higher at a temperature T 1 which is lower than the glass transition point (Tg), and the elastic modulus of 10 MPa or lower at a temperature T 2 which is higher than the glass transition point (Tg).
5. The sealing material according to claim 4 , wherein the temperature at which the elastic modulus shows the ratio of change (ΔE/ΔT) within a range of from 0.5 MPa/° C. 6.7 MPa/° C. is in a range of from 50° C. to 200° C.
6. The sealing material according to claim 3 , wherein the temperature at which the elastic modulus shows the ratio of change (ΔE/ΔT) within a range of from 0.5 MPa/° C. 6.7 MPa/° C. is in a range of from 50° C. to 200° C.
7. A method for mounting an electronic part on a board, comprising:
(i) placing the electronic part at a predetermined position on a circuit board and forming an electrically conductive connection;
(ii) supplying the electrically conductive connection and the area around the connection with the sealing material according to claim 1 ; and
(iii) heating the board.
8. A repairing method which comprises optionally heating a mounting-completed board which is given by the method according to claim 7 up to a predetermined temperature and pressing a tool to an area around a boarder between the board and the sealing material to cause substantial interface failure between the board and the sealing material, and removing the sealing material and/or the electronic part from the board.
9. A mounted structure wherein an electronic part is placed at a predetermined position on a circuit board and an electrically conductive connection is formed between an electrode of the circuit board and a corresponding electrode of the electronic part, and the area around the connection and the area between the electronic part and the circuit board are sealed with the sealing material according to claim 1 .