Radiation enhancement and decoupling
Apparatus capable of enhancing an incident electric field to drive an electromagnetic tag ( 124 ) into operation, comprising a resonant dielectric cavity which extends out of a single plane defined between two conducting surfaces ( 102, 104, 106 ). The cavity may extend over two or more layers, and can adopt C or S shaped or spiral profiles.
1. Apparatus comprising a resonant dielectric cavity defined between conducting surfaces, adapted to enhance an electromagnetic field at the edge of one of said conducting surfaces, wherein said dielectric cavity is non-planar.
2. Apparatus according to claim 1 , wherein said dielectric cavity comprises two or more dielectric layers defined between conducting walls.
3. Apparatus according to claim 2 , wherein said layers are offset from one another.
4. Apparatus according to claim 2 , wherein said layers are angled with respect to one another.
5. Apparatus according to claim 2 , wherein said layers are joined at the ends thereof.
6. Apparatus according to claim 1 , wherein said cavity has a unique path length.
7. Apparatus according to claim 6 , wherein said dielectric cavity is substantially ‘C shaped in cross section.
8. Apparatus according to claim 6 , wherein said dielectric cavity is substantially ‘S’ shaped in cross section.
9. Apparatus according to claim 6 , wherein said dielectric cavity is substantially spiral shaped in cross section.
10. Apparatus according to claim 1 , wherein said cavity has multiple path lengths.
11. A mounting component for an electronic device comprising a first dielectric layer arranged between first and second conductor layers, and a second dielectric layer arranged between said second conductor layer and a third conductor layer, said first and third conductor layers being electrically connected at one end, thereby defining a first dielectric connecting region, joining said first and second dielectric layers, wherein said mounting component is adapted to enhance an electromagnetic field at a mounting site at an open edge of said third conductor layer.
12. A mounting component according to claim 11 , wherein said first and second conductor layers are electrically connected by an end wall, opposite said connecting region.
13. A mounting component according to claim 11 , further comprising a third dielectric layer arranged between said third conductor layer and a fourth conductor layer, said second and third dielectric layer being joined by a second connecting region opposite said first connecting region.
14. A component according to claim 11 , comprising an EM tag located at least partially in said area of field enhancement.
15. A component according to claim 14 , wherein said tag is electrically isolated from said conductor layers or surfaces.
16. A component according to claim 14 , wherein said tag is powered by differential capacitive coupling.
17. A component according to claim 14 , wherein the EM tag is a low Q RFID tag.
18. A component according to claim 11 , wherein the total thickness of the component or decoupler is less than λ/4, or λ/10, or λ/300 or λ/1000, where λ is the intended wavelength of operation.
19. A component according to claim 11 wherein the total thickness of the component is 1 mm or less, or 500 μm or less, or 200 μm or less.
20. A component according to claim 11 , wherein said electromagnetic field is enhanced by a factor greater than or equal to 50, 100, or 200.