Curable silicone composition and electronic component
View Patent ↗A curable silicone composition comprising at least the following components: (A) an epoxy-containing organopolysiloxane; (B) a curing agent for epoxy resin; and (C) an epoxy compound represented by the specific general formula; is characterized by excellent handleability and reduced oil-bleeding, and, when cured, forms a cured body of excellent flexibility and adhesion.
1. A curable silicone composition comprising at least the following components:
(A) (A 1 ) an organopolysiloxane that contains in one molecule at least two epoxy-containing univalent organic groups and is represented by the following average unit formula:
(R 1 3 SiO 1/2 ) a (R 2 2 SiO 2/2 ) b (R 3 SiO 3/2 ) c
where, R 1 , R 2 , and R 3 may be the same or different and designate monovalent hydrocarbon groups selected from alkyl groups, cycloalkyl groups, alkenyl groups, aryl groups, aralkyl groups, or halogenated alkyl groups; or epoxy-containing monovalent hydrocarbon groups; however, at least 20 mole % of the groups designated by R 3 are aryl groups; and where “a”, “b”, and “c” are numbers that satisfy the following conditions: 0≦a≦0.8; 0≦b≦0.8; 0.2≦c≦0.9; a+b+c=1, and/or (A 2 ) a diorganopolysiloxane of the following general formula:
A-R 5 —(R 4 2 SiO) m R 4 2 Si—R 5 -A
where R 4 is a monovalent hydrocarbon group selected from an alkyl group, a cycloalkyl group, an aryl group, or an aralkyl group, or a halogenated alkyl group; R 5 is bivalent organic group; and “A” is a siloxane residual radical represented by the following average unit formula:
(XR 4 2 SiO 1/2 ) d (SiO 4/2 ) e
where R 4 is the same as defined above, and “X” is a single bond, a hydrogen atom, a group designated by R 4 , an epoxy-containing monovalent organic group, or an alkoxysilylalkyl group; however, at least one group designated by “X” in one molecule is a single bond, at least two groups designated by “X” are epoxy-containing monovalent organic groups; “d” is a positive number; “e” is a positive number; and “d/e” is a number ranging from 0.2 to 4, and where “m” is an integer equal to or greater than 1;
(B) a curing agent for epoxy resin; and
(C) an epoxy compound represented by the following general formula:
where R 8 is a monovalent hydrocarbon group selected from an alkyl group, a cycloalkyl group, an ethoxy-substituted alkyl group, an alkenyl group, an aryl group, an aralkyl group, a halogenated alkyl group, or alkoxy-substituted aryl group, wherein the hydrocarbon group has 1 to 10 carbon atoms; and “f” is an integer from 0 to 4.
2. The curable silicone composition of claim 1 , wherein component (B) is a compound having a phenolic hydroxyl group.
3. The curable silicone composition of claim 2 , wherein component (B) is an organosiloxane that contains in one molecule at least two phenolic hydroxyl groups.
4. The curable silicone composition of claim 3 , wherein component (B) is an organosiloxane of the following general formula:
R 6 3 SiO(R 6 2 SiO) n SiR 6 3
where R 6 is a monovalent hydrocarbon group selected from an alkyl group, a cycloalkyl group, an aryl group, an aralkyl group, or a halogenated alkyl group; or a monovalent organic group that contains a phenolic hydroxyl group; however, at least two groups in one molecule represented by R 6 are monovalent organic groups that contains a phenolic hydroxyl group, and “n” is an integer in the range of 0 to 1000.
5. The curable silicone composition of claim 1 , wherein component (B) is contained in an amount of 0.1 to 500 parts by mass per 100 parts by mass of component (A).
6. The curable silicone composition of claim 1 , wherein component (C) is contained in an amount of 0.01 to 50 mass % of the curable silicone composition.
7. The curable silicone composition of claim 1 , further comprising (D) a curing accelerator.
8. The curable silicone composition of claim 7 , wherein component (D) is an encapsulated amine-type curing accelerator.
9. The curable silicone composition of claim 7 , wherein component (D) is contained in an amount not exceeding 50 parts by mass per 100 parts by mass of component (A).
10. The curable silicone composition of claim 1 , further comprising (E) a filler.
11. The curable silicone composition of claim 10 , wherein component (E) is contained in an amount not exceeding 5,000 parts by mass per 100 parts by mass of component (A).
12. The curable silicone composition of claim 10 , wherein component (E) is a thermally conductive filler.
13. The curable silicone composition of claim 1 , further comprising (F) an organic epoxy resin.
14. The curable silicone composition of claim 13 , wherein component (F) is contained in an amount not exceeding 500 parts by mass per 100 parts by mass of component (A).
15. An electronic component sealed or bonded by means of a cured body of a curable silicone composition according to claim 1 .