Optoelectronic component disposed in a recess of a housing and electrical componenet disposed in the housing

1. A housing for an optoelectronic component, the housing comprising:

a planar carrier element having a front side and a rear side, the rear side of the carrier element including contact surfaces for external electrical connection;

a plastic housing arranged on the front side and side surfaces of the carrier element, wherein the carrier element has no leads leading outside of the plastic housing;

a recess in the plastic housing, the recess having dimensions that allow the optoelectronic component to be accommodated, and the recess having an opening on a side facing away from the carrier element; and

an electronic component arranged on the front side of the carrier element and encapsulated within the plastic housing.

2. The housing according to claim 1 , further comprising a transparent cover over the opening of the recess.

3. The housing according to claim 2 , wherein the transparent cover comprises a lens.

4. The housing according to claim 1 , further comprising a transparent filling material in the recess.

5. The housing according to claim 4 , wherein the plastic housing is provided with a structure for adhesion of the transparent filling material.

6. The housing according to claim 1 , wherein the carrier element comprises a patterned metal layer.

7. The housing according to claim 1 , wherein the plastic housing comprises a thermosetting plastic.

8. The housing according to claim 1 , wherein the plastic housing is provided with a structure or a mounting opening that defines an arrangement of a cover or an optical component relative to the plastic housing.

9. The housing according to claim 1 , wherein the carrier element has a chip island or a structure element to accommodate the optoelectronic component inside the recess.

10. An optoelectronic device comprising:

a planar carrier element having a front side and a rear side, the rear side of the carrier element including contact surfaces for external electrical connection;

a plastic housing arranged on the front side and side surfaces of the carrier element, wherein the carrier element has no leads leading outside of the plastic housing;

a recess having an opening in the plastic housing;

an optoelectronic component arranged on the front side of the planar carrier element and inside the recess, the optoelectronic component having a region for light emission or light reception oriented towards the opening; and

an electronic component disposed within the plastic housing and electrically connected to the carrier element.

11. The device according to claim 10 , wherein the optoelectronic component comprises a light-emitting diode.

12. The device according to claim 10 , further comprising a conversion element arranged between the opening of the recess and the optoelectronic component.

13. The device according to claim 12 , wherein the conversion element is configured to change light propagation to or from the optoelectronic component arranged in the recess in a direction-independent manner.

14. The device according to claim 10 , wherein the further electronic component contains a protection circuit for protecting against damage caused by electrostatic charging.

15. The device according to claim 10 , wherein the further electronic component contains a drive circuit for the optoelectronic component.

16. The device according to claim 10 , further comprising at least one further optoelectronic component arranged inside the recess, each further optoelectronic component having a region for light emission or light reception oriented towards the opening.

17. The device according to claim 16 , wherein each further optoelectronic component comprises a light-emitting diode.