INTRINSICALLY HEATABLE HOT MELT ADHESIVE SHEET MATERIALS
The invention relates to sheet materials, having at least one layer of an adhesive mass, within which heat can be produced, wherein the adhesive mass is a hot melt adhesive mass and a PTC resistor.
1 . A planar structure comprising at least one layer of an adhesive within which heat can be generated, wherein the adhesive is a hotmelt adhesive and a posistor.
2 . The planar structure of claim 1 , wherein the generation of the heat is induced by electrical current flow.
3 . The planar structure of claim 1 , wherein the at least one layer of the hotmelt adhesive comprises
(a) at least one adhesive component and
(b) at least one electrically conductive material.
4 . The planar structure of claim 3 , wherein the electrically conductive material is graphite and/or carbon black.
5 . The planar structure of claim 3 , wherein the at least one electrically conductive material has a mass fraction of 2% to 60% by weight, based on the hotmelt adhesive.
6 . The planar structure of claim 3 , wherein the electrically conductive material has an extent in at least one spatial direction of not more than 500 nm.
7 . The planar structure of claim 6 , wherein carbon nanotubes and/or carbon nanofibers are used as electrically conductive material.
8 . The planar structure of claim 1 , wherein the hotmelt adhesive is one based on partially crystalline polymers, or partially crystalline polymers have been added to the adhesive component.
9 . The planar structure of claim 8 , wherein the hotmelt adhesive contains at least 30% by weight of partially crystalline polymers.
10 . The planar structure of claim 9 , wherein the partially crystalline polymers are polyolefins, copolymers of polyolefins, ionomers, polyamides and/or copolymers of polyamides.
11 . The planar structure of claim 1 , which has at least one electrically conducting contacting means, the contacting means being effectuated optionally by a metal foil, a metal mesh, a metalized polymeric film and/or a metallization of the surface of the hotmelt adhesive.
12 . The planar structure of claim 1 , wherein the at least one layer of the hotmelt adhesive comprises at least one filler with a high heat capacity.
13 . The planar structure of claim 1 , which has at least one second layer of a hotmelt adhesive.
14 . The planar structure of claim 1 , which has at least one further layer composed of a pressure-sensitive adhesive.
15 . The planar structure of claim 14 , wherein the pressure-sensitive adhesive is one based on acrylic acid and/or methacrylic acid and/or based on esters of the aforementioned compounds, or one based on hydrated natural or synthetic rubber.
16 . The planar structure of claim 14 , which has at least one liner material.
17 . The planar structure of claim 1 , which has at least one backing material.
18 . The planar structure of claim 1 , wherein the heatable planar structure is equipped with a mechanism which when the planar structure is first heated leads to an increase in the cohesion of the hotmelt-adhesive, heatable layer and/or of a further hotmelt adhesive or pressure-sensitive adhesive layer.
19 . A method for bonding automobile parts, said method comprising adhering a planar structure to such automobile parts, wherein the planar structure is a planar structure of claim 1 .
20 . The method of claim 19 , which further comprises heating substrates bonded with such planar structures.
21 . The method of claim 20 , wherein the heating of the substrate is induced by heating of the planar structure, the planar structure having been applied to a base surface which is furnished with at least one electrical contact, the base surface being, optionally, one of the bonded substrates itself.