IP Library Granted Patent US 8,077,248
Granted Patent B2
US 8,077,248 · App. 12/534,489 · Granted Dec 13, 2011

Optical device and production method thereof

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Quick Facts
Patent No.
US 8,077,248
App. No.
12/534,489
Granted
Dec 13, 2011
Kind
B2
Abstract

A lead frame is buried in mold resin to form a mold structure. A wide blade is used to make an indentation having an alignment step in the mold structure. Then, a narrow blade is used to split the mold structure. At the outer perimeter portion of a base which is a separate part separated from the mold structure, an alignment step is formed. Due to the alignment step, an optical element, such as a mirror tube of an imaging optical system, or the like, is readily and quickly attached.

Claims (65)

1. An optical device, comprising:

an adapter including a tubular portion having a first surface and a second surface, an entirety of which surrounds an opening portion;

a translucent member having an upper surface, a bottom surface opposite to the upper surface and a side surface, and attached to the first surface of the tubular portion of the adapter at a peripheral surface area of the bottom surface, the first surface of the tubular portion and the upper surface of the translucent member facing against a direction of incoming light;

an optical element chip attached onto the second surface of the tubular portion such that a major surface of the optical element chip faces the translucent member; and

an alignment step formed in the tubular portion of the adapter and having a horizontal face and a vertical face parallel to the side surface of the translucent member, wherein:

a sealing member is formed on the side surface of the translucent member and on the first surface of the tubular portion, and

an outer perimeter end surface of the sealing member and the vertical face of the alignment step of the adapter lie in a same plane.

2. The optical device according to claim 1 , wherein:

the side surface of the translucent member is located on the first surface of the tubular portion.

3. The optical device according to claim 1 , wherein:

a bonding line between the side surface of the translucent member and the sealing member is disposed on the first surface.

4. The optical device according to claim 1 , wherein:

the optical element chip includes an imaging element,

the alignment step is provided such that a mirror tube fits into the alignment step, and

the optical imaging element is a solid state imaging device.

5. The optical device according to claim 1 , wherein:

the optical element chip includes a light receiving element,

the alignment step is provided such that a mirror tube fits into the alignment step, and

the optical device is incorporated in an optical pickup device.

6. The optical device according to claim 1 , wherein a cross section of the opening portion has a rectangular shape.

7. An optical device, comprising:

an adapter having an opening surrounded by a wall portion and a base portion located in the opening;

a translucent member having a first surface, a second surface opposite to the first surface and a side surface, the translucent member being attached to an upper surface of the wall portion of the adapter and covering the opening of the adaptor, the first surface touching on the wall portion;

an optical element chip disposed on the base portion so that a main surface of the optical element chip for receiving light faces the translucent member;

an alignment step formed at an outer surface of the wall portion of the adapter, the alignment step having a step portion substantially parallel to the first surface of the translucent member; and

a sealing member disposed on the side surfaces of the translucent member and on the wall portion of the adaptor, wherein

an outer perimeter end surface of the sealing member and the side portion of the alignment step lie in a same plane.

8. The optical device according to claim 7 , wherein

an interface between the side surface of the translucent member and the sealing member is disposed on the upper surface of the wall portion.

9. The optical device according to claim 7 , wherein the alignment step is provided such that a mirror tube fits onto the alignment step.

10. The optical device according to claim 7 , wherein

the side portion of the alignment step is substantially perpendicular to the first surface of the translucent member.

11. The optical device according to claim 7 , wherein the upper surface of the wall portion is an upmost surface of the wall portion.

12. An optical pickup device including the optical device according to claim 7 .

13. An optical device, comprising:

an adapter having a first surface and a second surface opposite to the first surface, the first surface being over the second surface;

a translucent member having an upper surface, a bottom surface opposite to the upper surface, and a side surface;

an optical element chip connected to the adapter such that a major surface of the optical element chip faces the translucent member;

an alignment step formed in the adapter and having a horizontal face and a vertical face parallel to the side surface of the translucent member; and

an external electrode disposed under the second surface of the adapter, wherein:

a sealing member is formed on the side surface of the translucent member,

the horizontal face of the alignment step is lower than the bottom surface of the translucent member, and

the external electrode is disposed directly under the alignment step.

14. The optical device according to claim 13 , wherein

the first surface of the adapter is under the translucent member.

15. The optical device according to claim 13 , wherein

the external electrode is a solder ball.

16. The optical device according to claim 13 , wherein:

the external electrode has a surface connected to the second surface of the adapter, and

the surface of the external electrode and the second surface of the adapter lie in a same plane.

17. The optical device according to claim 13 , wherein

no external electrode is directly under the optical element.

18. The optical device according to claim 13 , wherein

at least two of the external electrodes are disposed directly under the alignment step.

19. The optical device according to claim 13 , wherein

the alignment step is disposed at an outer periphery portion of the sealing member in a plan view.

20. The optical device according to claim 13 , wherein

the horizontal face of the alignment step is lower than the major surface of the optical element chip.

21. The optical device according to claim 13 , wherein

the major surface of the optical element chip is lower than the second surface of the adapter.

22. The optical device according to claim 13 , wherein:

the alignment step has an opening face which lies in the same plane as the first surface of the adapter, and

the opening face of the alignment step is lower than the bottom surface of the translucent member.

23. The optical device according to claim 13 , wherein

the alignment step is provided such that a mirror tube fits onto the alignment step.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 26, 2014
From: PANASONIC CORPORATION
To: COLLABO INNOVATIONS, INC.
Reel/Frame 033021/0806 →
LIEN Recorded Jan 13, 2014
From: COLLABO INNOVATIONS, INC.
To: PANASONIC CORPORATION
Reel/Frame 031997/0445 →