Light-emitting device

1. A light-emitting device, comprising:

an electrically conductive permanent substrate;

an adhesive layer on the electrically conductive permanent substrate;

an epitaxial structure on the adhesive layer connected with the electrically conductive permanent substrate by the adhesive layer, wherein the epitaxial structure comprises:

a lower cladding layer, wherein the material of the lower cladding layer comprises AlInN;

an active layer on the lower cladding layer, wherein the material of the active layer comprises InGaN or AlGaInN; and

an upper cladding layer on the active layer, wherein the material of the upper cladding layer comprises AlInN;

a tunneling structure on the epitaxial structure, comprising

a first conductivity type semiconductor layer comprising AlInN with a first doping concentration greater than 6×10 19 /cm 3 ; and

a second conductivity type semiconductor layer comprising AlInN with a second doping concentration greater than 6×10 19 /cm 3 on the first conductivity type semiconductor layer, wherein the second conductivity type is different from the first conductivity type; and

a current spreading layer on the tunneling structure.

2. The light-emitting device according to claim 1 , wherein the range of the thickness of the first conductivity type semiconductor layer in the tunneling structure is about 100 to 500 angstroms, and the range of the first doping concentration of the first conductivity type semiconductor layer in the tunneling structure is about 6×10 19 /cm 3 to 1×10 20 /cm 3 .

3. The light-emitting device according to claim 1 , wherein the range of the thickness of the second conductivity type semiconductor layer in the tunneling structure is about 100 to 500 angstroms, and the range of the second doping concentration of the second conductivity type semiconductor layer in the tunneling structure is about 2×10 20 /cm 3 to 3×10 20 /cm 3 .

4. The light-emitting device according to claim 1 , wherein the material of the current spreading layer is n-GaN or n-AlInN.

5. The light-emitting device according to claim 4 , wherein the range of the thickness of the current spreading layer is about 0.1 to 5 micrometers.

6. A light-emitting device, comprising:

an epitaxial structure comprising a lower cladding layer comprising n-AlInN, an active layer comprising InGaN or AlGaInN on the lower cladding layer, and an upper cladding layer comprising p-AlInN on the active layer;

a tunneling structure on the epitaxial structure comprising a p-AlInN layer with a first doping concentration greater than 6×10 19 /cm 3 , and an n-AlInN layer with a second doping concentration greater than 6×10 19 /cm 3 on the p-AlInN layer; and

a current spreading layer comprising n-AlInN on the tunneling structure.

7. The light-emitting device according to claim 6 , wherein the thickness of the p-AlInN layer in the tunneling structure is about 100 to 500 angstroms, and the first doping concentration of the p-AlInN layer in the tunneling structure is about 6×10 19 /cm 3 to 1×10 20 /cm 3 .

8. The light-emitting device according to claim 6 , wherein the thickness of the n-AlInN layer in the tunneling structure is about 100 to 500 angstroms, and the second doping concentration of the n-AlInN layer in the tunneling structure is about 2×10 20 /cm 3 to 3×10 20 /cm 3 .

9. The light-emitting device according to claim 6 , further comprising:

an electrically conductive permanent substrate; and

an adhesive layer connected with the electrically conductive permanent substrate and the epitaxial structure.

10. The light-emitting device according to claim 6 , wherein the thickness of the current spreading layer is about 0.1 to 5 micrometers.