Heatsink with periodically patterned baseplate structure
View Patent ↗A heatsink including an electromagnetic bandgap structure reduces electromagnetic interference caused by an integrated circuit in an electronic device. One embodiment provides a heatsink having a base with an array of electrically-conductive, thermally-conductive patches spaced apart in two dimensions of a reference plane and having a thickness perpendicular to the reference plane. The patches are interconnected by a plurality of branches. Each branch connects adjacent patches and has a width in the reference plane of less than a width of each adjacent patch. A plurality of thermally conductive cooling fins coupled to a surface of the base and extend normal to the reference plane. The cooling fins may be formed of a thermally-conductive, electrically non-conductive material or may be coupled to the base by a thermally-conductive, electrically non-conductive material. The periodically patterned structure of the base, together with a solid metal layer of a circuit board, form an electromagnetic bandgap structure that reduces certain frequencies of electromagnetic noise caused by the integrated circuit.
1. A heatsink, comprising:
a base having a periodically patterned structure comprising an array of electrically-conductive, thermally-conductive patches spaced apart in two dimensions of a reference plane and having a thickness perpendicular to the reference plane;
a plurality of branches structurally connecting the patches, each branch connecting adjacent patches and having a width in the reference plane of less than a width of each adjacent patch; and
a plurality of thermally conductive cooling fins coupled to the base and extending normal to the reference plane.
2. The heatsink of claim 1 , wherein a cross-section of the periodically-patterned structure is constant in a direction normal to the reference plane.
3. The heatsink of claim 1 , further comprising:
a thermally conductive, electrically non-conductive filler filling the spaces between the adjacent patches.
4. The heatsink of claim 1 , wherein the patches have an electrical conductivity coefficient of at least 10^7 S/m and a thermal conductivity coefficient of greater than 1 W/m*K.
5. The heatsink of claim 1 , further comprising:
a thermally-conductive, electrically non-conductive binder coupling the cooling fins to a surface of the base.
6. The heatsink of claim 1 , wherein the cooling fins are thermally-conductive and electrically non-conductive.
7. The heatsink of claim 1 , wherein each branch has a surface area of less than about 15 percent of the surface area of either of the adjacent patches in the reference plane.
8. The heatsink of claim 1 , wherein the periodically patterned structure and the branches share common first and second opposing surfaces.
9. An apparatus comprising:
a printed circuit board including a continuous, electrically-conductive layer;
a processor physically coupled to the printed circuit board and electrically coupled to the electrically-conductive layer; and
a heatsink coupled to the circuit board in thermal contact with the processor, the heatsink including a base having a periodically patterned structure comprising an array of electrically-conductive, thermally-conductive patches spaced apart in two dimensions of a reference plane that is parallel to the conductive layer and having a thickness perpendicular to the conductive layer, a plurality of branches structurally connecting the patches, each branch spanning an opening between two adjacent patches and having a width in the reference plane of less than a width of each adjacent patch, and a plurality of thermally conductive cooling fins coupled to the base and extending perpendicular to the reference plane.
10. The apparatus of claim 9 , wherein the conductive layer of the printed circuit board is a ground plane.
11. The apparatus of claim 10 , further comprising:
a plurality of metal posts securing the processor to the circuit board, wherein the metal posts are not grounded to the ground layer.
12. The apparatus of claim 9 , further comprising a thermally-conductive, electrically non-conductive binder coupling the cooling fins to the base.
13. The apparatus of claim 9 , wherein the periodically-patterned structure has a substantially constant cross-section taken parallel to the reference plane.
14. The apparatus of claim 9 , further comprising:
a thermally conductive, electrically non-conductive filler filling the spaces between the adjacent patches.
15. The apparatus of claim 9 , wherein the patches have an electrical conductivity coefficient of at least 10^7 S/m and a thermal conductivity coefficient of greater than 1 W/m*K.
16. The apparatus of claim 9 , wherein the thermally-conductive, electrically non-conductive binder comprises an epoxy.
17. The apparatus of claim 9 , wherein each branch has a surface area of less than about 15 percent of the surface area of either of the adjacent patches.
18. The apparatus of claim 9 , wherein the periodically patterned structure and the branches share common first and second opposing planar surfaces.
19. A method of reducing the propagation of electromagnetic noise generated by an integrated circuit, comprising:
identifying a frequency band of the electromagnetic noise generated by the integrated circuit;
selecting a periodic pattern of spaced apart patches interconnected by branches with geometry having stopband within the identified frequency band; and
thermally contacting the integrated circuit with a heatsink having a base that includes an electrically-conductive, thermally-conductive material having the selected periodic pattern.
20. The method of claim 19 , wherein the step of selecting a periodic pattern of spaced apart patches interconnected by branches with geometry having stopband within the identified frequency band comprises selecting one or more of the group consisting of a patch width, a patch length, a branch width, a branch length, and a base thickness.