IP Library Granted Patent US 9,288,893
Granted Patent B2
US 9,288,893 · App. 12/537,430 · Granted Mar 15, 2016

Implementations of twisted differential pairs on a circuit board

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Quick Facts
Patent No.
US 9,288,893
App. No.
12/537,430
Granted
Mar 15, 2016
Kind
B2
Abstract

A twisted differential conductor pair is formed on a circuit board that includes first-third conductors. The second conductor includes first-third portions. The second portion of the second conductor extends between an end of the first conductor and an end of the third conductor, and couples an end of the first portion of the second conductor to an end of the third portion of the second conductor. A solder mask layer is formed over the first, second, and third conductors on the circuit board. An end of the first conductor and the end of the third conductor are exposed through the solder mask layer. The exposed end of the first conductor is coupled to the exposed end of the third conductor over the solder mask layer with a bridge. This configuration may be repeated to create multiple twists along the twisted differential conductor pair.

Claims (39)

1. A circuit board, comprising:

an electrically insulating layer;

a first conductor, a second conductor, and a third conductor on the electrically insulating layer, the second conductor having a first portion, a second portion, and a third portion, and the second portion of the second conductor extending between an end of the first conductor and an end of the third conductor and coupling an end of the first portion of the second conductor to an end of the third portion of the second conductor;

an electrically insulating solder mask layer patterned with openings on the electrically insulating layer over the first, second, and third conductors, the solder mask layer including a solder mask material and being an outermost layer of a stack of layers comprising each layer of the circuit board; and

an electrically conductive bridge on the solder mask layer that is coupled through a first patterned opening in the solder mask layer to the end of the first conductor and through a second patterned opening in the solder mask layer to the end of the third conductor, and being outside of the stack of layers of the circuit board.

2. The circuit board of claim 1 , wherein the bridge crosses over the second portion of the second conductor and is electrically isolated from the second conductor by the solder mask layer.

3. The circuit board of claim 2 , wherein the third conductor further includes a first portion, a second portion and a third portion, the circuit board further comprising:

a fourth conductor on the circuit board, the second portion of the third conductor extending between a second end of the third portion of the second conductor and an end of the fourth conductor and coupling an end of the first portion of the third conductor to an end of the third portion of the third conductor; and

wherein the solder mask layer is over the fourth conductor.

4. The circuit board of claim 3 , further comprising:

an electrically conductive second bridge on the solder mask layer that is coupled through a third opening in the solder mask layer to the second end of the third portion of the second conductor and through a fourth opening in the solder mask layer to the end of the fourth conductor.

5. The circuit board of claim 3 , where the second conductor, the third conductor, the first bridge, and the second bridge form a loop having an area selected to improve near-end cross-talk.

6. The circuit board of claim 3 , wherein the second portion of the second conductor and the second portion of the third conductor are separated by a distance configured to improve a differential mode next-end coupling between two adjacent differential pairs.

7. The circuit board of claim 1 , wherein the bridge is a fourth conductor formed on the solder mask layer that couples the exposed end of the first conductor to the exposed end of the third conductor.

8. The circuit board of claim 1 , wherein the bridge includes at least one of an electrically conductive strip or an electrically conductive pin formed on the solder mask layer to couple the exposed end of the first conductor to the exposed end of the third conductor.

9. The circuit board of claim 1 , wherein the first conductor is coupled to a first signal of a differential signal, and the first portion of the second conductor is coupled to a second signal of the differential signal.

10. The circuit board of claim 1 , wherein the first portion of the second conductor is substantially parallel with a first portion of the first conductor, the third conductor having a first portion that is substantially parallel with the third portion of the second conductor, the first portion of the first conductor being substantially colinear with the third portion of the second conductor, and the first portion of the third conductor being substantially colinear with the first portion of the second conductor.

11. A circuit board, comprising:

an electrically insulating layer;

a first conductor, a second conductor, and a third conductor on the electrically insulating layer, the second conductor extending between an end of the first conductor and an end of the third conductor;

an electrically insulating solder mask layer patterned with openings on the electrically insulating layer over the first, second, and third conductors, the solder mask layer including a solder mask material and being an outermost layer of a stack comprised of all layers of the circuit board; and

an electrically conductive bridge on the solder mask layer, and outside of the stack of layers of the circuit board, that is coupled through a first opening in the solder mask layer to the end of the first conductor and through a second opening in the solder mask layer to the end of the third conductor.

12. The circuit board of claim 11 , wherein the bridge crosses over the second conductor and is electrically isolated from the second conductor by the solder mask layer.

13. The circuit board of claim 12 , further comprising:

a fourth conductor on the circuit board, the third conductor extending between an end of the second conductor and an end of the fourth conductor; and

wherein the solder mask layer is over the fourth conductor.

14. The circuit board of claim 13 , further comprising:

an electrically conductive second bridge on the solder mask layer that is coupled through a third opening in the solder mask layer to the end of the second conductor and through a fourth opening in the solder mask layer to the end of the fourth conductor.

15. The circuit board of claim 11 , wherein the bridge is a metal conductor formed on the solder mask layer that couples the exposed end of the first conductor to the exposed end of the third conductor.

16. A circuit board, comprising:

an electrically insulating layer;

a solder mask layer patterned with openings on the electrically insulating layer, the solder mask layer including a solder mask material; and

a twisted differential conductor pair that has multiple twists and that includes

a plurality of electrical conductors on the electrically insulating layer in a same metal layer between the electrically insulating layer and the solder mask layer; and

a plurality of electrically conductive bridges on top of the solder mask layer, each electrically conductive bridge having a first end coupled through a respective first opening in the solder mask layer to an end of a first electrical conductor of the plurality of electrical conductors, and having a second end coupled through a respective second opening in the solder mask layer to an end of a second electrical conductor of the plurality of electrical conductors, and being an outermost feature of the circuit board that is outside of a stack of layers comprising all layers of the circuit board.

17. The circuit board of claim 16 , wherein each electrically conductive bridge crosses over a third electrical conductor of the plurality of electrical conductors and is isolated from the third electrical conductor by the solder mask layer.

18. The circuit board of claim 17 , wherein the plurality of electrical conductors includes a first plurality of colinear electrical conductor portions and a second plurality of colinear electrical conductors portions that is parallel with the first plurality of colinear electrical conductor portions.

19. The circuit board of claim 18 , wherein the twisted differential conductor pair is configured to conduct a pair of complementary signals.

20. The circuit board of claim 16 , wherein at least one electrically conductive bridge comprises a metal foil, a metallic paint, an electrically conductive resin or epoxy, an electrically conductive ink, an electrically conductive paste, a pin, a rod, or a metal strip.

Assignments (7)
CORRECTIVE ASSIGNMENT TO CORRECT THE PATENT NUMBER 9,385,856 TO 9,385,756 PREVIOUSLY RECORDED AT REEL: 47349 FRAME: 001. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 22, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 051144/0648 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EFFECTIVE DATE PREVIOUSLY RECORDED ON REEL 047229 FRAME 0408. ASSIGNOR(S) HEREBY CONFIRMS THE THE EFFECTIVE DATE IS 09/05/2018. Recorded Oct 29, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047349/0001 →
MERGER Recorded Oct 4, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047229/0408 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: BROADCOM CORPORATION
Reel/Frame 041712/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 1, 2017
From: BROADCOM CORPORATION
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041706/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: BROADCOM CORPORATION
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037806/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 7, 2009
From: KARIKALAN, SAMPATH KOMARAPALAYAM VELAYUDHAM
To: BROADCOM CORPORATION
Reel/Frame 023068/0487 →