IP Library Granted Patent US 8,379,181
Granted Patent B2
US 8,379,181 · App. 12/540,310 · Granted Feb 19, 2013

LCD panel to backlight fixation

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Quick Facts
Patent No.
US 8,379,181
App. No.
12/540,310
Granted
Feb 19, 2013
Kind
B2
Abstract

The present invention provides a method of manufacturing a display module, the display module comprising a display panel and a backlight, The method includes the following steps: placing the display panel and the backlight into contact on a common contact area, the common contact area being defined as a fixation region of a contacting surface of the display panel coinciding with a contacting surface of the backlight, and applying a heat flow in the common contact area to create a local weld connection in the common contact area between the display panel and the backlight.

Claims (34)

1. A method of manufacturing a display module, the display module comprising a display panel and a backlight, the method comprising:

placing the display panel and the backlight into contact on a common contact area, the common contact area being defined as a fixation region of a contacting surface of the display panel coinciding with a contacting surface of the backlight; and

applying a heat flow in the common contact area to create a local weld connection in the common contact area between the display panel and the backlight, wherein the heat flow is applied by placing an embedded heater between the contacting surface of the display panel and the contacting surface of the backlight.

2. A method according to claim 1 , further comprising applying a pressure on the contacting surfaces during the application of the heat flow.

3. A method according to claim 2 , wherein the heat flow is applied by placing a resistive wire between the contacting surface of the display panel and the contacting surface of the backlight and by passing an electric current through the resistive wire.

4. A method according to claim 3 , wherein placing the resistive wire comprises depositing a conductive material on the contacting surface of the backlight and patterning the conductive material into a wire-shaped line.

5. A method according to claim 4 , wherein the conductive material is a metal, a semiconductor material, a conductive oxide, or a transparent conductive oxide.

6. A method according to claim 1 , wherein the backlight comprises a framework and a light guide, the framework surrounding and holding the light guide, and the contacting surface of the backlight comprises a surface portion of the framework.

7. A method according to claim 1 , wherein the display panel further comprises a pixel layer, a substrate, and a back polarizer, the substrate being disposed between the pixel layer and the back polarizer, and the contacting surface of the display panel comprising a surface portion of the back polarizer.

8. A method according to claim 7 , wherein the back polarizer exposes a surface portion of the substrate, and the contacting surface of the display panel comprises the surface portion of the back polarizer and the surface portion of the substrate.

9. A method according to claim 7 , wherein the contacting surface of the backlight consists of a thermoplastic material and the contacting surface of the display panel consists of a material other than the thermoplastic and incompatible for welding to the thermoplastic, wherein the method further comprises attaching a layer of a thermoplastic material on the contacting surface of the display panel, preceding the placement of the display panel and the backlight into contact on the common contact area.

10. A method according to claim 9 , wherein attaching the layer of the thermoplastic material on the contacting surface of the display panel comprises a provision of an adhesive layer between the layer of the thermoplastic material and the contacting surface of the display panel.

11. A method according to claim 1 , wherein the embedded heater generates heat flow without relying on heat conduction from a source external of the display panel and backlight when they are placed into contact at the common contact area.

12. A LCD display module, comprising:

a display panel;

a backlight, wherein the display panel and the backlight are placed into contact on a common contact area, the common contact area being defined as a fixation region of a contacting surface of the display panel coinciding with a contacting surface of the backlight; a local weld connection provided in the common contact area between the display panel and the backlight, wherein the local weld connection is created by applying a heat flow in the common contact area; and

an embedded heater, disposed between the display panel and the backlight, for generating the heat flow.

13. A LCD display module according to claim 12 , further comprising:

a resistive wire, disposed between the display panel and the backlight, for generating the heat flow when being given an electric current.

14. An electronic device comprising a LCD display module according to claim 12 .

15. An electronic device according to claim 14 , wherein said LCD display module further comprises:

a resistive wire, disposed between the display panel and the backlight, for generating a heat flow when being given an electric current.

16. A method of manufacturing a display module, the display module comprising a display panel and a backlight, the method comprising:

placing the display panel and the backlight into contact on a common contact area, the common contact area being defined as a fixation region of a contacting surface of the display panel coinciding with a contacting surface of the backlight, wherein the contacting surface of the backlight consists of a thermoplastic material and the contacting surface of the display panel consists of a material other than the thermoplastic and incompatible for welding to the thermoplastic, wherein the method further comprises attaching a layer of a thermoplastic material on the contacting surface of the display panel, preceding the placement of the display panel and the backlight into contact on the common contact area; and

applying a heat flow in the common contact area to create a local weld connection in the common contact area between the display panel and the backlight.

17. A method according to claim 16 , wherein the heat flow is applied by placing a resistive wire between the contacting surface of the display panel and the contacting surface of the backlight and by passing an electric current through the resistive wire.

18. A LCD display module, comprising:

a display panel;

a backlight, wherein the display panel and the backlight are placed into contact on a common contact area, the common contact area being defined as a fixation region of a contacting surface of the display panel coinciding with a contacting surface of the backlight, wherein the contacting surface of the backlight consists of a thermoplastic material and the contacting surface of the display panel consists of a material other than the thermoplastic and incompatible for welding to the thermoplastic, wherein the method further comprises attaching a layer of a thermoplastic material on the contacting surface of the display panel, preceding the placement of the display panel and the backlight into contact on the common contact area; and

a local weld connection provided in the common contact area between the display panel and the backlight.

19. A LCD display module according to claim 18 , wherein the local weld connection is created by applying a heat flow in the common contact area, and further comprising a resistive wire, disposed between the display panel and the backlight, for generating the heat flow when being given an electric current.

20. An electronic device comprising an LCD display module according to claim 18 .

21. An electronic device according to claim 20 , wherein said LCD display module further comprises:

a resistive wire, disposed between the display panel and the backlight, for generating a heat flow when being given an electric current.

Assignments (3)
CHANGE OF NAME Recorded Apr 13, 2014
From: CHIMEI INNOLUX CORPORATION
To: INNOLUX CORPORATION
Reel/Frame 032672/0813 →
MERGER Recorded Jan 23, 2011
From: TPO DISPLAYS CORP.
To: CHIMEI INNOLUX CORPORATION
Reel/Frame 025681/0266 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 2, 2009
From: PAULUSSEN, MARCO; AMORY, RALPH
To: TPO DISPLAYS CORP.
Reel/Frame 023459/0020 →