Intermetal stack for use in a photovoltaic device
View Patent ↗A donor silicon wafer may be bonded to a substrate and a lamina cleaved from the donor wafer. A photovoltaic cell may be formed from the lamina bonded to the substrate. An intermetal stack is described that is optimized for use in such a cell. The intermetal stack may include a titanium layer in contact with the lamina, which reacts to form titanium silicide, a non-reactive barrier layer to check the silicide reaction, a low-resistance layer, and an adhesion layer to help adhesion to the receiver element.
1. A photovoltaic assembly comprising:
a silicon lamina;
a receiver element;
a low-resistance layer disposed between the lamina and the receiver element, wherein the low-resistance layer is silver, cobalt, tungsten, or an alloy thereof;
a contact layer disposed between the low-resistance layer and the lamina, wherein the contact layer is
substantially titanium in unreacted regions and substantially titanium silicide in reacted regions wherein the reacted regions of the contact layer are in immediate contact with the lamina;
a dielectric material intervening between the lamina and the unreacted regions of the contact layer;
a non-reactive barrier layer disposed between the low-resistance layer and the contact layer; and
a photovoltaic cell, wherein the photovoltaic cell comprises the lamina.
2. The photovoltaic assembly of claim 1 wherein the non-reactive barrier layer is TiW, TiN, W, Ta, TaN, TaSiN, Ni, Mo, Zr, or an alloy thereof.
3. The photovoltaic assembly of claim 1 wherein the lamina has a thickness between 1 and 20 microns.
4. The photovoltaic assembly of claim 1 further comprising an adhesion layer disposed between the low-resistance layer and the receiver element, wherein the adhesion layer is titanium or an alloy thereof.
5. The photovoltaic assembly of claim 4 wherein the adhesion layer is in immediate contact with the receiver element.
6. The photovoltaic assembly of claim 1 wherein the low-resistance layer is silver or an alloy of silver which is at least 90 atomic percent silver.
7. The photovoltaic assembly of claim 1 wherein the receiver element comprises glass.
8. The photovoltaic assembly of claim 1 wherein the contact layer is in immediate contact with the barrier layer.
9. The photovoltaic assembly of claim 8 wherein the contact layer is 300 angstroms thick or less.
10. The photovoltaic assembly of claim 1 wherein the barrier layer is in immediate contact with the low-resistance layer.
11. The photovoltaic assembly of claim 1 wherein the unreacted regions of the contact layer are titanium or an alloy of titanium which is at least 90 atomic percent titanium, and wherein the reacted regions of the contact layer are titanium silicide or a silicide of an alloy of titanium which is at least 90 atomic percent titanium.
12. The photovoltaic assembly of claim 1 wherein the non-reactive barrier layer is conductive.
13. A photovoltaic assembly comprising:
a semiconductor lamina;
a dielectric material;
a contact layer including regions of titanium silicide and regions of substantially titanium, wherein the titanium silicide of the contact layer is in immediate contact with the semiconductor lamina and wherein the regions of substantially titanium are in immediate contact with the dielectric material;
a non-reactive barrier layer in immediate contact with the contact layer;
a low-resistance layer, the non-reactive barrier layer disposed between the low-resistance layer and the contact layer, the low-resistance layer comprising silver, cobalt, or tungsten or alloys thereof;
a receiver element;
an adhesion layer, the adhesion layer in immediate contact with the receiver element and disposed between the receiver element and the low-resistance layer; and
a photovoltaic cell, wherein the photovoltaic cell comprises the lamina.
14. The photovoltaic structure of claim 13 wherein the lamina is between 1 microns and 10 microns thick.
15. The photovoltaic structure of claim 14 wherein the lamina is between 2 microns and 5 microns thick.
16. The photovoltaic assembly of claim 13 wherein the non-reactive barrier layer is TiW, TiN, W, Ta, TaN, TaSiN, Ni, Mo, Zr, or an alloy thereof.
17. The photovoltaic assembly of claim 13 wherein the adhesion layer is titanium or an alloy thereof.
18. The photovoltaic assembly of claim 13 wherein the low-resistance layer is silver or an alloy of silver which is at least 90 atomic percent silver.
19. The photovoltaic assembly of claim 13 wherein the receiver element comprises glass.
20. The photovoltaic assembly of claim 13 wherein the silicon lamina is monocrystalline silicon.