AT cut quartz crystal resonator element and method for manufacturing the same
View Patent ↗An AT cut quartz crystal resonator element includes a quartz crystal element piece having an exciting part formed from an AT cut quartz crystal plate in a rectangular shape having an X-axis direction of a quartz crystal set to a long side, and an exciting electrode formed on each of front and back main surfaces of the exciting part, in which each side surface in the longitudinal direction of the exciting part is composed of two faces, an m-face of a quartz crystal and a crystal face other than the m-face.
1. A method for manufacturing an AT cut quartz crystal resonator element comprising:
processing an outline of an quartz crystal element piece by performing a wet etching to an AT cut quartz crystal plate in an outline processing, the quartz crystal element piece having an exciting part with front and back main surfaces in a rectangular shape, the rectangular shape having four sides, each side including a side surface, the exciting part having an X-axis direction of a quartz crystal set to a long side of the four sides and having two ends, the exciting part having each side surface at the two ends of the long side composed of two faces, an m-face of the quartz crystal and a crystal face other than the m-face; and
forming an exciting electrode on each of the front and back main surfaces of the exciting part,
the side surfaces being at an outer periphery of the front main surface and the back main surface.
2. The method for manufacturing an AT cut quartz crystal resonator element according to claim 1 , wherein: the outline processing includes forming masks corresponding to an outline of the exciting part on both the front and back surfaces of the AT cut quartz crystal plate and performing a wet etching to the AT cut quartz crystal plate from both the front and back surfaces using the masks; and the mask at a side of the front surface of the AT cut quartz crystal plate and the mask at a side of the back surface are placed by being shifted from each other in a Z′-axis direction of the quartz crystal.
3. The method for manufacturing an AT cut quartz crystal resonator element according to claim 2 , wherein: on the condition that a thickness of the AT cut quartz crystal plate is set to T (μm), a mask shift amount Δz (μm) is set within a range of Δz=0.75×T±20%.
4. The method for manufacturing an AT cut quartz crystal resonator element according to claim 1 , further comprising: forming a thick center portion and a thin surrounding portion provided with the exciting electrode in a manner that each side surface in the longitudinal direction of a step between the thick center portion and the thin surrounding portion is composed of an m-face of the quartz crystal and a crystal face other than the m-face, by performing the wet etching to each of the front and back surfaces of the quartz crystal element piece having the outline processed.
5. The method for manufacturing an AT cut quartz crystal resonator element according to claim 4 , wherein: the wet etching is performed to each of the front and back surfaces of the quartz crystal element piece such that a difference in a thickness between the thick center potion and the thin surrounding portion is set to smaller than or equal to 10% of a thickness of the thick center potion.