Process for producing sandwich structure and adhesive film used therefor
View Patent ↗An adhesive film comprising a cycloalkanediol modified copolymerized polyester resin film and a thermosetting vinyl ester resin composition layer which is hardened at room temperature on said polyester resin film.
1. An adhesive film, comprising a cycloalkanediol modified copolymerized polyester resin film, and a thermosetting vinyl ester resin composition which is hardened at room temperature, which is held uniformly on the glycol modified copolymerized polyester resin film.
2. The adhesive film as set forth in claim 1 , wherein the cycloalkanediol modified copolymerized polyester is a cycloalkanediol modified copolymerized polyethylene terephthalate resin.
3. The adhesive film as set forth in claim 1 , wherein the thermosetting resin composition film which is hardened at room temperature has a cloth as a carrier.
4. The adhesive film as set forth in claim 3 , wherein the cloth used as the carrier is a nonwoven fabric.
5. The adhesive film as set forth in claim 1 , wherein the thermosetting resin composition which forms the thermosetting resin composition film which is hardened at room temperature has a viscosity of 2 to 200 Pa·s.
6. The adhesive film as set forth in claim 1 , wherein the thermosetting resin composition which forms the thermosetting resin composition film which is hardened at room temperature consists of a vinyl ester resin compound.
7. The adhesive film as set forth in claim 6 , wherein the thermosetting resin composition which forms the thermosetting resin composition film which is hardened at room temperature contains a viscosity increasing agent.
8. The adhesive film as set forth in claim 7 , wherein the viscosity increasing agent is polyethylene oxide.
9. The adhesive film as set forth in claim 6 , wherein the thermosetting resin composition which forms the thermosetting resin composition film which is hardened at room temperature contains a polymerization retardant or inhibitor.
10. The adhesive film as set forth in claim 9 , wherein the polymerization retardant or inhibitor is 4-methoxyphenol.
11. The adhesive film as set forth in claim 1 , wherein the thermosetting resin composition film is hardened at room temperature under a depressurized state.