Inlays for security documents
View Patent ↗Secure inlays for secure documents such as a passport comprising an inlay substrate may have laser ablated recesses within which a chip module is installed. Channels for an antenna wire may be formed in a surface of the substrate. Instead of using wire, the channels may be filled with a flowable, conductive material. Patches homogenous with the substrate layer may be used to protect and seal the chip and interconnection area. The inlay substrate may include two layers, and the antenna wire may be between the two layers. A moisture-curing polyurethane hot melt adhesive may be used to laminate a cover layer and the additional inlay substrate layers. The adhesive layer may include metal nanoscale powder and ink for electro-magnetic shielding. Additional security elements may include material that is optically changeable by an electro-magnetic field. Ferrite-containing layers may be incorporated in the inlay substrate.
1. An inlay substrate for a secure document having a recess extending into the inlay substrate from a first (top) surface thereof for receiving a chip module therein, and an antenna wire disposed in the inlay substrate, wherein:
the inlay substrate comprises at least two layers of a synthetic material laminated to one another with a layer of adhesive; and
the recess extends through a top of the two layers and at least into a bottom of the two layers.
2. The inlay substrate of claim 1 , wherein:
the antenna wire is disposed between the at least two layers.
3. The inlay substrate of claim 1 , wherein:
the recess is stepped, and is formed by a first opening having a first width dimension in a first one of the at least two layers, and a second opening having a second width dimension in a second one of the at least two layers which is adjacent to the first one of the at least two layers and the second opening is aligned with the first opening; and
the first width dimension is different than the second width dimension.
4. The inlay substrate of claim 1 , wherein:
the recess is a pocket-type recess extending only partially through the inlay substrate or a window-type recess extending completely through the inlay substrate.
5. The inlay substrate of claim 1 , further comprising:
a moisture-resistant patch covering the chip module.
6. The inlay substrate of claim 1 , further comprising:
an epoxy filling disposed in the recess, surrounding the chip module and the antenna wire interconnections.
7. The inlay substrate of claim 1 , further comprising:
pre-formed channels in a surface of the substrate within which the antenna wire is at least partially embedded.
8. The inlay substrate of claim 1 , wherein:
the chip module is a leadframe-type module or an epoxy glass type module.
9. The inlay substrate of claim 1 , further comprising:
at least one lid covering at least one opening of the recess.
10. The inlay substrate of claim 1 , further comprising:
a cover layer laminated to the inlay substrate.
11. The inlay substrate of claim 10 , wherein:
the cover layer and inlay substrate comprise an inlay, such as for a passport booklet (cover) having a front panel and a back panel.
12. The inlay substrate of claim 11 , further comprising:
a shielding/detuning antenna disposed on the back panel of the passport cover.
13. The inlay substrate of claim 11 , further comprising:
a switch disposed in the passport cover for disconnecting the chip module's antenna when the passport booklet is closed.
14. The inlay substrate of claim 1 , wherein:
the antenna wire is disposed on a top surface of the top layer.
15. The inlay substrate of claim 1 , further comprising:
ferrite particles in the bottom layer.
16. The inlay substrate of claim 1 , wherein:
the recess extends through the bottom layer.
17. The inlay substrate of claim 16 , further comprising:
a strip of material on a bottom surface of the bottom layer.
18. The inlay substrate of claim 16 , further comprising:
an epoxy filling disposed in the recess.
19. A secure document comprising the inlay substrate of claim 1 .
20. The secure document of claim 19 , comprising:
a chip module disposed in the recess and connected with the antenna.