Crack-resistant thermal bend actuator
View Patent ↗A thermal bend actuator comprises an active beam for connection to drive circuitry and a passive beam mechanically cooperating with the active beam. When a current is passed through the active beam, the active beam expands relative to the passive beam resulting in bending of the actuator. The passive beam comprises a first layer comprised of silicon nitride and a second layer comprised of silicon dioxide. The second layer is sandwiched between the first layer and the active beam to provide thermal insulation for the first layer.
1. A thermal bend actuator comprising:
an active beam for connection to drive circuitry; and
a passive beam mechanically cooperating with the active beam, such that when a current is passed through the active beam, the active beam expands relative to the passive beam, resulting in bending of the actuator,
wherein the passive beam comprises a first layer comprised of silicon nitride and a second layer comprised of silicon dioxide, said second layer being sandwiched between the first layer and the active beam.
2. The thermal bend actuator of claim 1 , wherein said first layer is thicker than said second layer.
3. The thermal bend actuator of claim 1 , wherein said first layer is at least four times thicker than the second layer.
4. The thermal actuator of claim 1 , wherein the second layer has a thickness in the range of 0.05 and 0.2 microns.
5. The thermal actuator of claim 1 , wherein the first layer has a thickness in the range of 1.0 and 2.0 microns.
6. The thermal actuator of claim 1 , wherein the active beam has a thickness in the range of 1.5 and 2.0 microns.
7. The thermal bend actuator of claim 1 , wherein said active beam is connected to said drive circuitry via a pair of electrical contacts positioned at one end of said actuator.
8. The thermal bend actuator of claim 1 , wherein the active beam is fused to the passive beam by a deposition process.
9. The thermal bend actuator of claim 1 , wherein the active beam is comprised of a material selected from the group consisting of: titanium nitride, titanium aluminium nitride and an aluminium alloy.
10. The thermal bend actuator of claim 1 , wherein the active beam is comprised of a vanadium-aluminium alloy.
11. An inkjet nozzle assembly comprising:
a nozzle chamber having a nozzle opening and an ink inlet; and
a thermal bend actuator for ejecting ink through the nozzle opening, said actuator comprising:
an active beam for connection to drive circuitry; and
a passive beam mechanically cooperating with the active beam, such that when a current is passed through the active beam, the active beam expands relative to the passive beam, resulting in bending of the actuator,
wherein the passive beam comprises a first layer comprised of silicon nitride and a second layer comprised of silicon dioxide, said second layer being sandwiched between the first layer and the active beam.
12. The inkjet nozzle assembly of claim 11 , wherein the nozzle chamber comprises a floor and a roof having a moving portion, whereby actuation of said actuator moves said moving portion towards said floor.
13. The inkjet nozzle assembly of claim 12 , wherein the moving portion comprises the actuator.
14. The inkjet nozzle assembly of claim 12 , wherein the active beam is disposed on an upper surface of said passive beam relative to the floor of the nozzle chamber.
15. The inkjet nozzle assembly of claim 12 , wherein the nozzle opening is defined in the moving portion, such that the nozzle opening is moveable relative to the floor.
16. The inkjet nozzle assembly of claim 12 , wherein the actuator is moveable relative to the nozzle opening.
17. The inkjet nozzle assembly of claim 12 , wherein said roof is coated with a polymeric material.
18. An inkjet printhead comprising a plurality of nozzle assemblies, each nozzle assembly comprising:
a nozzle chamber having a nozzle opening and an ink inlet; and
a thermal bend actuator for ejecting ink through the nozzle opening, said actuator comprising:
an active beam connected to drive circuitry; and
a passive beam mechanically cooperating with the active beam, such that when a current is passed through the active beam, the active beam expands relative to the passive beam, resulting in bending of the actuator,
wherein the passive beam comprises a first layer comprised of silicon nitride and second layer comprised of silicon dioxide, said second layer being sandwiched between the first layer and the active beam.
19. The printhead of 18 , wherein each nozzle chamber comprises a floor and a roof having a moving portion comprising the actuator, whereby actuation of said actuator moves said moving portion towards said floor.
20. A MEMS device comprising one or more thermal bend actuators, each thermal bend actuator comprising:
an active beam connected to drive circuitry; and
a passive beam mechanically cooperating with the active beam, such that when a current is passed through the active beam, the active beam expands relative to the passive beam, resulting in bending of the actuator,
wherein the passive beam comprises a first layer comprised of silicon nitride and second layer comprised of silicon dioxide, said second layer being sandwiched between the first layer and the active beam.