Printed multilayer filter methods and designs using extended CRLH (E-CRLH)
View Patent ↗Printed multilayer filter design techniques and filters based on metamaterial structures including an extended composite left and right handed (E-CRLH) metamaterial unit cell.
1. A metamaterial filter apparatus, comprising:
a printed multilayer assembly having a plurality of printed, vertically-stacked layers;
a plurality of inductors and capacitors, wherein each inductor and each capacitor are formed on up to six layers of the printed multilayer assembly, wherein a number of inductors formed is greater than or equal to 4, and wherein a number of capacitors formed is greater than 4; and
a plurality of vias formed in the printed multilayer assembly to connect the inductors and the capacitors,
wherein the inductors, the capacitors, and the vias are structured to produce an extended composite right-handed/left-handed (E-CRLH) configuration.
2. The metamaterial filter apparatus of claim 1 , wherein the inductors, the capacitors, and the vias are structured to produce a symmetric E-CRLH filter.
3. The metamaterial filter apparatus of claim 1 , wherein the inductors, the capacitors, and the vias are structured to produce an asymmetric E-CRLH filter.
4. The metamaterial filter apparatus of claim 2 , wherein the symmetric E-CRLH filter is configured as a broadband high-Q filter.
5. The metamaterial filter apparatus of claim 2 , wherein the symmetric E-CRLH filter is configured as a narrowband high-Q filter.
6. The metamaterial filter apparatus of claim 3 , wherein the asymmetric E-CRLH filter is configured as a broadband high-Q filter.
7. The metamaterial filter apparatus of claim 3 , wherein the asymmetric E-CRLH filter is configured as a narrowband high-Q filter.
8. The metamaterial filter apparatus of claim 1 , wherein the printed multilayer assembly is low-temperature co-fired ceramic (LTCC) or high-temperature co-fired ceramic (HTCC).
9. The metamaterial filter apparatus of claim 1 , further comprising a mounting assembly configured to be connected to a top layer or to a bottom layer of the plurality of layers.
10. The metamaterial filter apparatus of claim 1 , wherein respective ones of the plurality of layers comprise at least one dielectric substance, and wherein the respective ones of the plurality of layers are printed with a conductive substance.
11. The metamaterial filter apparatus of claim 1 , wherein the number of the plurality of layers is four.
12. The metamaterial filter apparatus of claim 1 , further comprising a plurality of vias connected to ground and to respective conducting grounding portions located around respective peripheries of respective layers of the plurality of printed, vertically-stacked layers.
13. A method of fabricating a metamaterial filter apparatus, the method comprising:
forming a plurality of printed vertically-stacked layers, comprising forming a plurality of structures on the layers, the structures configured to implement inductors and capacitors, wherein respective ones of the inductors and the capacitors are formed on up to six layers of the printed multilayer assembly, wherein a number of inductors formed is greater than or equal to four, and wherein a number of capacitors formed is greater than four; and
forming a plurality of vias among the plurality of layers to connect the inductors and capacitors,
wherein the inductors, the capacitors, and the vias are arranged to produce an extended composite right-handed/left-handed (E-CRLH) configuration.
14. The method according to claim 13 , wherein said forming the plurality of printed vertically-stacked layers comprises using a low-temperature co-fired ceramic (LTCC) or a high-temperature co-fired ceramic (HTCC).
15. The method according to claim 13 , further comprising connecting a mounting assembly to a top layer or a bottom layer of the plurality of printed vertically-stacked layers.
16. The method according to claim 13 , wherein respective ones of the plurality of layers comprise at least one dielectric substance, and wherein the forming the plurality of structures on the layers comprises printing the respective ones of the plurality of layers with a conductive substance.
17. The method according to claim 13 , further comprising forming a plurality of vias connected to ground and to respective conducting grounding portions located around respective peripheries of respective layers of the plurality of printed vertically-stacked layers.