Apparatus for processing substrate and method of doing the same
View Patent ↗A method of processing a substrate through the use of an apparatus, including a substrate carrier for carrying a substrate; a liquid-applying unit for applying chemical to said substrate; and a gas-applying unit for applying gas atmosphere to said substrate, wherein the method includes processing an organic film pattern formed on a substrate, by, in sequence, removing one of an altered layer and a deposited layer formed on the organic film pattern, and fusing said organic film pattern for deformation by applying gas atmosphere to the organic film pattern in the gas-applying unit, wherein at least a part of the removal step is carried out by applying a liquid to the organic film pattern in the liquid-applying unit. The process may include an ashing unit for ashing the substrate and/or a development unit for developing the organic film pattern.
1. A method of processing a substrate through the use of an apparatus comprising:
a substrate carrier for carrying a substrate;
a liquid-applying unit for applying a liquid to said substrate; and
a gas-applying unit for applying gas atmosphere to said substrate,
said method comprising a step of processing an organic film pattern formed on a substrate, said step including, in sequence:
a removal step of removing one of an altered layer and a deposited layer formed on said organic film pattern; and
a fusion/deformation step of fusing said organic film pattern for deformation by applying gas atmosphere to said organic film pattern in said gas-applying unit,
wherein at least a part of said removal step is carried out by applying said liquid to said organic film pattern in said liquid-applying unit, and
said liquid comprises at least one amine selected from the group consisting of hydroxyl amine, diethylhydroxyl amine, diethylhydroxyl amine anhydride, pyridine and picoline in a range of 0.05 to 1.5 weight %.
2. A method of processing a substrate through the use of an apparatus comprising:
a substrate carrier for carrying a substrate;
a liquid-applying unit for applying a liquid to said substrate;
a gas-applying unit for applying gas atmosphere to said substrate; and
an ashing unit for ashing said substrate,
said method comprising a step of processing an organic film pattern formed on a substrate, said step including, in sequence:
a removal step of removing one of an altered layer and a deposited layer formed on said organic film pattern; and
a fusion/deformation step of fusing said organic film pattern for deformation by applying gas atmosphere to said organic film pattern in said gas-applying unit,
said removal step including, in sequence:
ashing said organic film pattern in said ashing unit; and
applying said liquid to said organic film pattern in said liquid-applying unit,
wherein said liquid comprises an amine selected from the group consisting of hydroxyl amine, diethylhydroxyl amine, diethylhydroxyl amine anhydride, pyridine and picoline in a range of 0.05 to 1.5 weight %.
3. A method of processing a substrate through the use of an apparatus comprising:
a substrate carrier for carrying a substrate;
a liquid-applying unit for applying a liquid to said substrate;
a gas-applying unit for applying gas atmosphere to said substrate; and
an ashing unit for ashing said substrate,
said method comprising a step of processing an organic film pattern formed on a substrate, said step including, in sequence:
a removal step of removing one of an altered layer and a deposited layer formed on said organic film pattern; and
a fusion/deformation step of fusing said organic film pattern for deformation by applying gas atmosphere to said organic film pattern in said gas-applying unit,
said removal step including, in sequence:
applying said liquid to said organic pattern film in said liquid-applying unit; and
developing said organic film pattern in a development unit,
wherein said liquid comprises an amine selected from the group consisting of hydroxyl amine, diethylhydroxyl amine, diethylhydroxyl amine anhydride, pyridine and picoline in a range of 0.05 to 1.5 weight %.