Methods of implanting electronics in objects and objects with implanted electronics
View Patent ↗Systems and methods including implanting RFID tags into metal-containing objects. The RFID tags are coated in a heat resistant coating. The surface of the metal-containing object could be heated and the coated RFID tag could be injected into the metal-containing object by allowing less heat to be transferred to the RFID electronics than an amount of heat to destroy the RFID electronics. The metal-containing objects can be monitored and tracked. Apparatus with implanted metal-containing objects can be remotely monitored and controlled.
1. A method comprising:
encapsulating electronics in a heat resistant coating;
heating an object so as to cause at least a portion of a surface of the object to become softened;
implanting the encapsulated electronics into the object via the softened surface,
the heat resistant coating encapsulating the electronics configured to protect the electronics from heat during implantation of the electronics in the object by allowing less heat to be transferred from the softened surface to the electronics than an amount of heat to destroy the electronics; and
performing post-implantation processing of the object, the post-implantation processing including at least one of annealing, grinding, polishing, peening, painting and varnishing.
2. The method of claim 1 , wherein the object comprises metal.
3. The method of claim 2 , wherein at least a portion of the softened surface comprises a molten metal.
4. The method of claim 1 , wherein the electronics comprise a radio frequency identification (RFID) tag.
5. The method of claim 4 , further comprising testing the RFID tag after said implanting.
6. The method of claim 1 , wherein the heat resistant coating comprises amorphous silicon, SiN, SiO 2 , Al 2 O 3 , SiO 2 —Al 2 O 3 , or a borosilicate.
7. The method of claim 1 , wherein encapsulating the electronics comprises dip coating the electronics in the heat resistant coating.
8. The method of claim 1 , wherein encapsulating the electronics comprises sputtering the heat resistant coating onto the electronics.
9. The method of claim 1 , wherein heating the surface of the object comprises heating at least a portion of the object to at least one-half the melting temperature of the object.
10. The method of claim 1 , wherein heating the surface of the object comprises irradiating the surface of the object with at least one of an electron beam, a laser beam, infrared radiation, a plasma, and an electrical arc.
11. The method of claim 1 , wherein implanting the encapsulated electronics comprises ejecting the encapsulated electronics from a nozzle into the object.
12. The method of claim 1 , wherein implanting the encapsulated electronics comprises pneumatically accelerating the encapsulated electronics towards the softened surface of the object.
13. The method of claim 1 , wherein implanting the encapsulated electronics comprises:
applying an electric charge to at least one of the encapsulated electronics and the softened surface of the object; and
generating an electric potential between the encapsulated electronics and the softened surface of the object.
14. The method of claim 1 , further comprising:
determining an implantation energy required to implant the encapsulated electronics to a desired depth below the surface of the object.
15. The method of claim 1 , wherein the object comprises at least one of an air conditioner, a dishwasher, a clothes dryer, a freezer, a refrigerator, a range, a stove, an oven, a water heater, a washing machine, a trash compactor, and a microwave oven.
16. A method comprising:
encapsulating electronics in a heat resistant coating;
heating an object so as to cause at least a portion of a surface of the object to become softened;
implanting the encapsulated electronics into the object via the softened surface, the heat resistant coating encapsulating the electronics configured to protect the electronics from heat surrounding the electronics during implantation of the electronics into the object by allowing less heat to be transferred to the electronics from the softened surface than an amount of heat to destroy the electronics; and
reforming the surface of the object after implanting the encapsulated electronics into the object.
17. The method of claim 16 , wherein reforming the surface of the object comprises spot melting at least a portion of the surface of the object.
18. An object comprising:
metal; and
an electronic circuit encapsulated in a heat resistant coating and embedded in the metal, the heat resistant coating configured to protect the electronic circuit from heat surrounding the electronic circuit during implantation of the electronic circuit in the metal by allowing less heat to be transferred to the electronic circuit than an amount of heat to destroy the electronic circuit.
19. The object of claim 18 , wherein the electronic circuit comprises a radio frequency identification (RFID) tag.
20. The object of claim 19 , wherein the RFID tag comprises a passive, semi-passive, or active RFID tag.
21. The object of claim 18 , wherein the metal comprises at least one of lead, aluminum, iron, titanium, or carbon.
22. The object of claim 21 , wherein the metal comprises an essentially pure metal, a metal alloy, or a metal composite.
23. The object of claim 18 , wherein the object is seamless.
24. The object of claim 18 , wherein the object comprises at least one of an air conditioner, a dishwasher, a clothes dryer, a freezer, a refrigerator, a range, a stove, an oven, a water heater, a washing machine, a trash compactor, and a microwave oven.