IP Library Granted Patent US 8,372,490
Granted Patent B2
US 8,372,490 · App. 12/552,577 · Granted Feb 12, 2013

Film-formation method, method for manufacturing electro-optical device, electro-optical device, and electronic apparatus

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Quick Facts
Patent No.
US 8,372,490
App. No.
12/552,577
Granted
Feb 12, 2013
Kind
B2
Abstract

A film-formation method is a method for depositing a liquid containing a film material to form a film in a prescribed film formation area enclosed by a partition wall on a substrate. The film-formation method includes forming the partition wall using at least in part a wettability-variable material in which wettability with respect to the liquid is variable, depositing the liquid in the film formation area, varying the wettability of the wettability-variable material in the partition wall in a state in which the liquid is disposed within the film formation area so that liquid affinity of the wettability-variable material becomes higher than liquid affinity of the wettability-variable material before the liquid is deposited in the film formation area, and forming the film by solidifying the film material in the liquid.

Claims (31)

1. A film-formation method for depositing a liquid containing a film material to form a film in a prescribed film formation area enclosed by a partition wall on a substrate, the film-formation method comprising:

forming the partition wall using at least in part a wettability-variable material in which wettability with respect to the liquid is variable;

depositing the liquid in the film formation area;

varying the wettability of the wettability-variable material in the partition wall in a state in which the liquid is disposed within the film formation area so that liquid affinity of the wettability-variable material becomes higher than liquid affinity of the wettability-variable material before the liquid is deposited in the film formation area; and

forming the film by solidifying the film material in the liquid.

2. The film-formation method according to claim 1 , wherein

the forming of the partition wall includes forming at least a portion of an upper surface of the partition wall using a material having liquid-repelling properties with respect to the liquid.

3. The film-formation method according to claim 1 , wherein

the forming of the partition wall includes layering one or more partition wall layers including a partition wall layer composed of the wettability-variable material to form the partition wall.

4. The film-formation method according to claim 3 , wherein

the forming of the partition wall further includes

forming a first partition wall layer composed of a first wettability-variable material, and

forming a second partition wall layer on the first partition wall layer, the second partition wall layer being composed of a second wettability-variable material in which wettability is variable by a method different from a method of varying wettability of the first wettability-variable material.

5. The film-formation method according to claim 1 , wherein

the forming of the partition wall further includes

forming a first partition wall film,

removing a portion of the first partition wall film to form an enlarged partitioned area having a size that includes the film formation area,

forming a second partition wall film composed of the wettability-variable material in the enlarged partitioned area, and

removing a portion of the second partition wall film to form the film formation area.

6. The film-formation method according to claim 1 , wherein

the varying of the wettability of the wettability-variable material includes varying the wettability by applying heat to the wettability-variable material.

7. The film-formation method according to claim 1 , wherein

the varying of the wettability of the wettability-variable material includes varying the wettability by irradiating the wettability-variable material with light.

8. The film-formation method according claim 1 , wherein

the forming of the film includes solidifying the film material by applying heat to the liquid.

9. The film-formation method according to claim 1 , wherein

the forming of the film includes solidifying the film material by irradiating the liquid with light.

10. A method for manufacturing an electro-optical device comprising:

forming a functional film constituting an electro-conductive device using the film-formation method according to claim 1 .

11. The film-formation method according to claim 1 , wherein

the depositing of the liquid in the film formation area includes depositing the liquid so that a height of the film formed by solidifying the film material in the liquid will be smaller than a height of the partition wall.

Assignments (5)
SECURITY AGREEMENT Recorded Jan 23, 2020
From: KATEEVA, INC.
To: SINO XIN JI LIMITED
Reel/Frame 051682/0212 →
RELEASE OF SECURITY INTEREST Recorded Jan 22, 2020
From: EAST WEST BANK, A CALIFORNIA BANKING CORPORATION
To: KATEEVA, INC.
Reel/Frame 051664/0802 →
SECURITY INTEREST Recorded Apr 4, 2019
From: KATEEVA, INC.
To: EAST WEST BANK
Reel/Frame 048806/0639 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2017
From: SEIKO EPSON CORP
To: KATEEVA, INC.
Reel/Frame 044719/0414 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 2, 2009
From: KINOSHITA, TOYOTARO
To: SEIKO EPSON CORPORATION
Reel/Frame 023183/0616 →