Method for manufacturing semiconductor device, and method and structure for implementing semiconductor device
View Patent ↗A method for manufacturing a semiconductor device includes forming an electrode; forming a projection projecting with respect to the electrode by melting a resin; and providing a conductive layer electrically connected to the electrode. The conductive layer is extended to an upper surface of the projection. Therefore, productivity of the semiconductor is improved.
1. A method for implementing a semiconductor device on a mounting substrate, the semiconductor device including a first electrode, wherein a second electrode is formed on the mounting substrate, the method comprising:
forming a semicircular projection using a first resin that is made of a polyimide resin and projects with respect to the first electrode, the semicircular projection having a semicircular cross-sectional shape;
forming a conductive layer that is electrically connected to the first electrode and covers an upper surface of the semicircular projection;
preparing a second resin that is made of an epoxy resin having a curing temperature that is lower than a glass transition temperature of the first resin; and
implementing the semiconductor device on the mounting substrate with a joint material formed of the second resin arranged between the semiconductor device and the mounting substrate through heating and pressurization,
wherein a load caused by mounting of the semiconductor device to the mounting substrate focally acts on a portion of the semicircular projection in the vicinity of an apex of the semicircular projection, so that a deformation of the semicircular projection is restricted only to the first resin corresponding to the portion in the vicinity of the apex, and a contact area between the conductive layer covering the upper surface of the semicircular projection and the second electrode is increased,
wherein forming the semicircular projection further includes:
forming a columnar projection body with the first resin, the columnar projection body having a flat upper end; and
heating the columnar projection body so that the columnar projection body melts to form the semicircular projection,
wherein the first resin is a resin having a glass transition temperature not less than 270 degrees Celsius,
wherein forming the semicircular projection further includes:
forming the first electrode on a semiconductor substrate of the semiconductor device;
providing an insulating protection film that covers the first electrode and the semiconductor substrate while a part of the first electrode is exposed;
providing a resin layer that covers an entirety of the protection film and the exposed part of the first electrode, the resin layer being formed of a photosensitive resin;
positioning a mask on the resin layer;
irradiating the mask so that the columnar projection body is obtained from the resin layer, and another part of the resin layer is removed; and
heating the columnar projection body with radiation so that the columnar projection body melts to form the semicircular projection,
wherein forming the conductive layer further includes:
providing a conductive material layer that covers the exposed part of the first electrode and the semicircular projection; and
providing the conductive layer by patterning the conductive material layer, the conductive layer being electrically connected to the exposed part of the first electrode, the conductive layer extending to an upper surface of the semicircular projection.
2. The method according to claim 1 ,
wherein the first electrode is one of a plurality of adjacently arranged first electrodes,
wherein the semicircular projection is formed to straddle the electrodes,
wherein the conductive layer is one of a plurality of conductive layers that are provided on the upper surface of the semicircular projection in correspondence with the first electrodes, and
wherein each of the conductive layers is electrically connected to a corresponding one of the first electrodes.
3. A structure for implementing a semiconductor device on a mounting substrate, the semiconductor device including a first electrode, a semicircular projection that is formed of a first resin made of a polyimide resin and projects with respect to the first electrode, and a conductive layer that is electrically connected to the first electrode and covers an upper surface of the semicircular projection, the semicircular projection having a semicircular cross-sectional shape,
wherein the semiconductor device is implemented on the mounting substrate with a joint material arranged between the semiconductor device and the mounting substrate through heating and pressurization, the joint material being formed of a second resin made of an epoxy resin, a glass transition temperature of the first resin being higher than a curing temperature of the second resin,
wherein a load caused by mounting of the semiconductor device to the mounting substrate focally acts on a portion of the semicircular projection in the vicinity of an apex of the semicircular projection, so that a deformation of the semicircular projection is restricted only to the first resin corresponding to the portion in the vicinity of the apex, and a contact area between the conductive layer covering the upper surface of the semicircular projection and the second electrode is increased,
wherein the semicircular projection is formed by melting a columnar projection of the first resin body having a flat upper end,
wherein the first resin is a resin having a glass transition temperature not less than 270 degrees Celsius,
wherein the first electrode is formed on a semiconductor substrate of the semiconductor device, an insulating protection film is provided that covers the first electrode and the semiconductor substrate while a part of the first electrode is exposed, and wherein a resin layer is provided that covers an entirety of the protection film and the exposed part of the first electrode, the resin layer is formed of a photosensitive resin, a mask is positioned on the resin layer, and the mask is irradiated so that the columnar projection body is obtained from the resin layer, and another part of the resin layer is removed, and wherein the columnar projection body is heated with radiation so that the columnar projection body melts to form the semicircular projection, and
wherein a conductive material layer is provided that covers the exposed part of the first electrode and the semicircular projection, the conductive layer is provided by patterning the conductive material layer, the conductive layer is electrically connected to the exposed part of the first electrode, and the conductive layer extends to an upper surface of the semicircular projection.
4. The structure according to claim 3 ,
wherein the first electrode is one of a plurality of adjacently arranged first electrodes,
wherein the semicircular projection is formed to straddle the electrodes,
wherein the conductive layer is one of a plurality of conductive layers that are provided on the upper surface of the semicircular projection in correspondence with the first electrodes, and
wherein each of the conductive layers is electrically connected to a corresponding one of the first electrodes.