IP Library Granted Patent US 8,400,770
Granted Patent B2
US 8,400,770 · App. 12/552,794 · Granted Mar 19, 2013

Heat spreader, electronic apparatus, and heat spreader manufacturing method

Inventors: Mitsuo Hashimoto (Kanagawa, JP); Kazuaki Yazawa (Tokyo, JP); Yuichi Ishida (Kanagawa, JP); Hiroyuki Ryoson (Kanagawa, JP)
Assignee: Sony Corporation
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Quick Facts
Patent No.
US 8,400,770
App. No.
12/552,794
Granted
Mar 19, 2013
Kind
B2
Abstract

According to an embodiment, there is provided a heat spreader including a condenser portion formed of a nanomaterial. The heat spreader further includes a first plate member, a second plate member, and a support portion. The first plate member includes a first surface, the first surface including a first area provided with the condenser portion. The second plate member includes a second surface and is arranged such that the second surface faces the first surface. The support portion protrudes from the first area of the first plate member to the second plate member, and has an end portion that is free from the nanomaterial and is in contact with the second surface of the second plate member.

Claims (48)

1. A heat spreader, comprising:

a condenser portion formed of an elongated nanomaterial having tip end portions arranged on an upper surface of the heat spreader; and

an evaporation portion formed of a nanomaterial and positioned on a lower surface of the heat spreader opposite to the condenser portion with a flow path gap between the condenser portion and the evaporation portion,

wherein the elongated nanomaterial is vertically arranged in parallel on the upper surface of the heat spreader such that the tip end portions of the nanomaterial face downward toward the lower surface of the heat spreader, and

wherein the condenser portion has been subjected to hydrophilic processing, and the elongated nanomaterial has a hydrophobic property.

2. The heat spreader according to claim 1 , further comprising:

a first plate member that includes a first surface as the upper surface, the first surface including a first area provided with the condenser portion;

a second plate member that includes a second surface that is the lower surface and is arranged such that the second surface faces the first surface; and

a support portion that protruding from the first area of the first plate member to the second plate member, and having an end portion that is free from the nanomaterial and is in contact with the second surface of the second plate member.

3. The heat spreader according to claim 2 ,

wherein the second surface of the second plate member has a second area and a third area, the second area being provided with the evaporation portion, the third area excluding the second area, and

wherein the end portion of the support portion is in contact with the third area of the second surface.

4. The heat spreader according to claim 3 ,

wherein the first plate member is arranged in a first position,

wherein the second plate member is arranged in a second position that is lower than the first position, and

wherein the nanomaterial forming the condenser portion is carbon nanotubes having the tip end portions facing downward toward the second plate member.

5. The heat spreader according to claim 1 , wherein the density of the carbon nanotubes is 5×10 6 (1/cm 2 ).

6. The heat spreader according to claim 1 , wherein an average length of the carbon nanotubes ranges from about 50 to 90 μm.

7. The heat spreader according to claim 1 , wherein the nanomaterial of the evaporation portion is carbon nanotubes.

8. The heat spreader according to claim 1 , wherein the evaporation portion is formed in a center of the lower surface of the heat spreader.

9. The heat spreader according to claim 8 , wherein column portions are arranged around the outside of the evaporation portion, and are arranged to extend between the upper surface of the heat spreader and the lower surface of the heat spreader.

10. The heat spreader according to claim 9 , wherein the column portions are formed on the upper surface of the condenser portion, and each column portion has an end portion extending to and contacting the lower surface of the heat spreader.

11. The heat spreader according to claim 1 , wherein a portion of the upper surface of the heat spreader is arranged perpendicularly with respect to the vertical downward direction of the nanomaterial.

12. The heat spreader according to claim 1 , wherein a portion of the upper surface of the heat spreader is tilted with respect to the vertical downward direction of the nanomaterial.

13. An electronic apparatus, comprising:

a heat source; and

a heat spreader that is thermally connected to the heat source and includes

a condenser portion formed of an elongated nanomaterial having tip end portions arranged on an upper surface of the heat spreader, and

an evaporation portion formed of a nanomaterial and positioned on a lower surface of the heat spreader opposite to the condenser portion with a flow path gap between the condenser portion and the evaporation portion,

wherein the elongated nanomaterial is vertically arranged in parallel on the upper surface of the heat spreader such that the tip end portions of the nanomaterial face downward toward a lower surface of the heat spreader, and

wherein the condenser portion has been subjected to hydrophilic processing, and the elongated nanomaterial has a hydrophobic property.

14. The electronic apparatus according to claim 13 ,

wherein the heat spreader further includes a support portion, a first plate member, and a second plate member, the first plate member including a first surface that is the upper surface, the first surface including a first area provided with the condenser portion, the second plate member including a second surface that is the lower surface and is arranged such that the second surface faces the first surface, the support portion protruding from the first area of the first plate member to the second plate member and having an end portion that is free from the nanomaterial and is in contact with the second surface of the second plate member.

15. A heat spreader manufacturing method, comprising:

preparing a first plate member having a first area provided on an upper surface of the first plate member and provided with a protrusion portion;

producing an elongated nanomaterial having tip end portions in the first area provided with the protrusion portion;

removing the nanomaterial that has been produced in an end portion of the protrusion portion, thus leaving the nanomaterial on at least the upper surface of the first plate member;

preparing a second plate member formed of a nanomaterial and formed in a second area on a lower surface of the heat spreader opposite to the first plate member with a flow path gap between the first plate member and the second plate member; and

causing the end portion of the protrusion portion to contact with the second area of the second plate member,

wherein the elongated nanomaterial is vertically arranged in parallel on the upper surface of the heat spreader such that the tip end portions of the nanomaterial face downward toward the lower surface of the second plate member, and

wherein the first plate member has been subjected to hydrophilic processing, and the elongated nanomaterial has a hydrophobic property.

16. The heat spreader manufacturing method according to claim 15 , further comprising

producing a nanomaterial in a third area of the lower surface of the second plate member, the lower surface being in contact with the end portion of the protrusion portion, the third area excluding the second area of the lower surface.

17. The heat spreader manufacturing method according to claim 15 ,

wherein the nanomaterial is carbon nanotubes,

wherein the first plate member is arranged in a first position,

wherein the second plate member is arranged in a second position lower than the first position, and

wherein the carbon nanotubes are produced such that the tip end portions of the carbon nanotubes face the lower surface of the second plate member.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 15, 2009
From: HASHIMOTO, MITSUO; YAZAWA, KAZUAKI; ISHIDA, YUICHI; RYOSON, HIROYUKI
To: SONY CORPORATION
Reel/Frame 023229/0990 →
Priority Claims (1)
JP 2008-224363 · Sep 2, 2008 · national
Continuity (1)
Related Publication 20100053899A1 · Mar 4, 2010