IP Library Granted Patent US 8,679,959
Granted Patent B2
US 8,679,959 · App. 12/553,861 · Granted Mar 25, 2014

High sensitivity photodetectors, imaging arrays, and high efficiency photovoltaic devices produced using ion implantation and femtosecond laser irradiation

Inventors: James E. Carey (Waltham, MA); Xia Li (Beverly, MA); Nathaniel J. McCaffrey (Hampton Falls, NH)
Assignee: Sionyx, Inc.
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Quick Facts
Patent No.
US 8,679,959
App. No.
12/553,861
Granted
Mar 25, 2014
Kind
B2
Abstract

The present invention relates generally to methods for high throughput and controllable creation of high performance semiconductor substrates for use in devices such as high sensitivity photodetectors, imaging arrays, high efficiency solar cells and the like, to semiconductor substrates prepared according to the methods, and to an apparatus for performing the methods of the invention.

Claims (8)

1. A method of controlling a photoresponse characteristic of a semiconductor device, comprising:

providing a semiconductor material having at least one surface thereof;

subjecting the surface to short-pulsed laser irradiation to roughen the surface;

annealing the surface to heal undesired lattice damage imparted by the laser irradiation;

incorporating a dopant into a region of the semiconductor material beneath said surface by ion implantation; and

annealing the surface to activate the dopant, wherein the semiconductor device has a substantially uniform photoresponse across at least a portion of the surface of the semiconductor device, wherein the substantially uniform photoresponse varies by less than 20% in said portion of the surface of the semiconductor device.

2. The method of claim 1 , incorporating said dopant into said region comprising substantially uniformly incorporating said dopant into said region of said semiconductor beneath said surface of said semiconductor material and across said portion of the surface of said semiconductor material.

3. The method of claim 1 , incorporating said dopant comprising substantially uniformly-incorporating said dopant to a concentration greater than about 0.5×10 16 atoms/cm 3 in said region of the semiconductor material to some depth beneath the surface of the semiconductor material.

Assignments (2)
CHANGE OF NAME Recorded Jan 6, 2016
From: SIONYX, INC.
To: SIONYX, LLC
Reel/Frame 037449/0884 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 4, 2013
From: CAREY, JAMES E.; LI, XIA; MCCAFFREY, NATHANIEL J.
To: SIONYX, INC.
Reel/Frame 029750/0926 →
Continuity (3)
Provisional Application 61093936 · Sep 3, 2008
Provisional Application 61155315 · Feb 25, 2009
Related Publication 20100052088A1 · Mar 4, 2010