IP Library Granted Patent US 8,247,835
Granted Patent B2
US 8,247,835 · App. 12/554,189 · Granted Aug 21, 2012

LED package with top and bottom electrodes

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Quick Facts
Patent No.
US 8,247,835
App. No.
12/554,189
Granted
Aug 21, 2012
Kind
B2
Abstract

An LED package with an extended top electrode and an extended bottom electrode is made from a single metal sheet, one manufacturing process embodiment includes: preparing a piece of single metal sheet, forming a first metal and a coplanar second metal, mounting an LED on an inner end of the first metal, wire-bonding top electrode to an inner end of the second metal, encapsulating at least the LED and the bonding wire with a protection glue, bending an outer end of the first metal upward twice 90 degrees to form a top flat as an extended top electrode of the package, and bending an outer end of the second metal downward twice 90 degrees to form a bottom flat as an extended bottom electrode of the package.

Claims (18)

1. An LED package, comprising:

a first metal bent upwards twice 90 degrees to form a top flat and a bottom flat, wherein the top flat of the first metal forms a top electrode of the LED package;

a second metal bent downwards twice 90 degrees to form a top flat and a bottom flat, wherein the bottom flat of the second metal forms a bottom electrode of the LED package;

wherein the bottom flat of the first metal and the top flat of the second metal are coplanar;

an LED electrically coupled to the bottom flat of the first metal and to the top flat of the second metal; and

a protection molding in which the LED is enclosed.

2. The LED package of claim 1 , wherein a top surface of the top flat of the first metal extends outside the protection molding as the top electrode of the LED package, and wherein a bottom surface of the bottom flat of the second metal extends outside the protection molding as the bottom electrode of the LED package.

3. The LED package of claim 1 , wherein the LED is electrically coupled by a metal wire to at least one of the bottom flat of the first metal and the top flat of the second metal, and wherein the protection molding further encloses the wire, the bottom flat of the first metal, and the top flat of the second metal.

4. The LED package of claim 1 , wherein the bottom flat of the first metal and the top flat of the second metal are coplanar.

5. An LED package, comprising:

a c-shape metal having a top flat and a bottom flat, wherein the top flat of the c-shape metal forms a top electrode of the LED package;

an inverse c-shape metal having a top flat and a bottom flat, wherein the bottom flat of the inverse c-shape metal forms a bottom electrode of the LED package;

wherein the bottom flat of the c-shape metal and the top flat of the inverse c-shape metal are coplanar;

an LED mounted on and electrically coupled to the bottom flat of the c-shape metal and coupled by a metal wire to the top flat of the inverse c-shape metal; or the LED mounted on the electrically coupled to the top flat of the inverse c-shape metal and coupled by a metal wire to the bottom flat of the c-shape metal; and

a protection molding enclosing the LED and the metal wire.

6. The LED package of claim 5 , wherein a top surface of the top flat of the c-shape metal extends outside the protection molding to form the top electrode of the LED package, and wherein a bottom surface of the bottom flat of the inverse c-shape metal extends outside the protection molding to form the bottom electrode of the LED package.

7. The LED package of claim 5 , wherein the protection molding further encloses the bottom flat of the c-shape metal and the top flat of the inverse c-shape metal.

8. The LED package of claim 5 , wherein the bottom flat of the c-shape metal and the top flat of the inverse c-shape metal are coplanar.