IP Library Granted Patent US 9,352,447
Granted Patent B2
US 9,352,447 · App. 12/555,715 · Granted May 31, 2016

Superabrasive elements and methods for processing and manufacturing the same using protective layers

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Quick Facts
Patent No.
US 9,352,447
App. No.
12/555,715
Granted
May 31, 2016
Kind
B2
Abstract

An exemplary method of processing a polycrystalline diamond element is disclosed. According to the method, a protective layer may be formed over only a selected portion of a polycrystalline diamond element. The polycrystalline diamond element may include a polycrystalline diamond table. At least a portion of the polycrystalline diamond element may be exposed to a leaching solution such that the leaching solution contacts an exposed surface region of the polycrystalline diamond table and at least a portion of the protective layer. The protective layer may be substantially impermeable to the leaching solution. An exemplary method of manufacturing a polycrystalline diamond element is also disclosed.

Claims (38)

1. A method of manufacturing a polycrystalline diamond element, the method comprising:

forming a protective layer over a selected portion of a polycrystalline diamond element during sintering of a polycrystalline diamond table of the polycrystalline diamond element;

exposing at least a portion of the polycrystalline diamond element to a leaching solution such that the leaching solution contacts an exposed surface region of the polycrystalline diamond table and at least a portion of the protective layer;

wherein the protective layer is substantially impermeable to the leaching solution.

2. The method of claim 1 , wherein forming the protective layer over the selected portion of the polycrystalline diamond element during sintering of the polycrystalline diamond table comprises:

disposing a particulate mixture comprising diamond particles adjacent to a material for forming the protective layer;

sintering the particulate mixture to form the polycrystalline diamond table such that the protective layer is formed over at least a portion of a surface of the polycrystalline diamond table.

3. The method of claim 2 , wherein forming the protective layer over the selected portion of the polycrystalline diamond element during sintering of the polycrystalline diamond table further comprises:

disposing the particulate mixture comprising diamond particles adjacent to a substrate;

wherein the selected portion comprises at least a portion of the substrate.

4. The method of claim 1 , wherein the protective layer is bonded to the substrate.

5. The method of claim 3 , wherein the protective layer is formed over the selected portion of the polycrystalline diamond element such that the protective layer substantially encloses and contacts the substrate.

6. The method of claim 1 , wherein the protective layer extends to immediately adjacent a chamfered edge of the polycrystalline diamond table.

7. The method of claim 1 , wherein the selected portion comprises at least a portion of a surface of the polycrystalline diamond table.

8. The method of claim 1 , wherein:

the polycrystalline diamond element further comprises a substrate bonded to the polycrystalline diamond table;

the selected portion comprises at least a portion of a surface of the substrate.

9. The method of claim 1 , wherein the protective layer comprises a substantially inert material.

10. The method of claim 1 , wherein forming the protective layer over the selected portion of the polycrystalline diamond element comprises exposing the protective layer to an elevated temperature and an elevated pressure,

wherein:

the elevated temperature comprises a temperature of about 50° C. or higher;

the elevated pressure comprises a pressure of about 1000 psi or higher.

11. The method of claim 1 , wherein an intercalated hybrid layer is formed at an interface between the protective layer and the polycrystalline diamond element.

12. The method of claim 11 , wherein the intercalated hybrid layer comprises portions of the protective layer disposed between portions of the polycrystalline diamond element.

13. The method of claim 11 , wherein the intercalated hybrid layer comprises portions of the protective layer disposed within cavities defined in the polycrystalline diamond element.

14. The method of claim 1 , further comprising chamfering an edge portion of the polycrystalline diamond table.

15. The method of claim 14 , wherein chamfering the edge portion of the polycrystalline diamond table comprises:

making a reference mark on a portion of the polycrystalline diamond element;

grinding the edge portion of the polycrystalline table with a centerless grinder, the centerless grinder utilizing the reference mark as a location indicator.

16. The method of claim 1 , wherein the protective layer comprises a metallic material.

17. The method of claim 16 , wherein the metallic material comprises at least one of:

a refractory metal;

a precious metal;

a steel alloy;

a steel derivative alloy.

18. The method of claim 1 , wherein the protective layer comprises a glass sealant.

19. The method of claim 1 , wherein the protective layer comprises graphite.

20. The method of claim 1 , further comprising forming an outer layer on at least a portion of an outer surface of the protective layer.

Assignments (7)
SECURITY INTEREST Recorded Jul 18, 2025
From: US SYNTHETIC CORPORATION
To: KEYBANK NATIONAL ASSOCIATION
Reel/Frame 074973/0089 →
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Jul 17, 2025
From: JPMORGAN CHASE BANK, N.A.
To: CHAMPIONX LLC; APERGY ESP SYSTEMS, LLC; APERGY BMCS ACQUISITION CORP; HARBISON-FISCHER, INC.; NORRIS RODS, INC.,; NORRIS RODS, INC.,; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; US SYNTHETIC CORPORATION
Reel/Frame 072004/0019 →
RELEASE OF SECURITY INTEREST Recorded Jun 7, 2022
From: BANK OF AMERICA, N.A.
To: ACE DOWNHOLE, LLC; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; APERGY BMCS ACQUISITION CORP.; NORRISEAL-WELLMARK, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
Reel/Frame 060305/0001 →
SECURITY INTEREST Recorded Jun 5, 2020
From: ACE DOWNHOLE, LLC; APERGY BMCS ACQUISITION CORP.; HARBISON-FISCHER, INC.; NORRIS RODS, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; THETA OILFIELD SERVICES, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053790/0001 →
SECURITY AGREEMENT Recorded May 9, 2018
From: APERGY (DELAWARE) FORMATION, INC.; APERGY BMCS ACQUISITION CORP.; APERGY ENERGY AUTOMATION, LLC; HARBISON-FISCHER, INC.; NORRISEAL-WELLMARK, INC.; PCS FERGUSON, INC.; QUARTZDYNE, INC.; SPIRIT GLOBAL ENERGY SOLUTIONS, INC.; US SYNTHETIC CORPORATION; WINDROCK, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 046117/0015 →
CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY DATA PREVIOUSLY RECORDED ON REEL 023235 FRAME 0758. ASSIGNOR(S) HEREBY CONFIRMS THE INCORRECT RECEIVING PARTY DATA ON EPAS FORM. ASSIGNMENT IS CORRECT.. Recorded Sep 17, 2009
From: MIESS, DAVID P.; DADSON, ANDREW E.; SANI, MOHAMMAD NAJAFI
To: US SYNTHETIC CORPORATION
Reel/Frame 023243/0851 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 15, 2009
From: MIESS, DAVID P.; DADSON, ANDREW E.; SANI, MOHAMMAD NAJAFI
To: SYMANTEC CORPORATION
Reel/Frame 023235/0758 →