Semiconductor device and manufacturing method for the same
View Patent ↗To provide a small, high-performance semiconductor device in which contact between adjacent wires is prevented for increased flexibility in designing a wiring layout, and an efficient method for manufacturing the semiconductor device. The semiconductor device includes a substrate 10 having an electrode 21 A arranged on its surface; and a first semiconductor element 11 A which includes an electrode 22 arranged on its surface and which is supported by the substrate 10 , wherein a first wire 41 is connected through a first bump 31 to at least one of the electrodes over the substrate 10 and semiconductor element 11 A (i.e., at least one of the electrodes 21 and 22 ), and a second wire 42 is connected through a second bump 32 to a bonding portion of the wire 41.
1. A semiconductor device, comprising:
a substrate having an electrode arranged on a surface thereof;
a first semiconductor element which has at least one electrodes arranged on a surface thereof and which is supported by the substrate;
a first bump arranged on the at least one of the electrodes arranged on the first semiconductor element;
a first wire connected through the first bump;
at least one second bump arranged on a bonding portion of the first wire to the first bump;
a third bump arranged directly on the second bump; and
a second wire connected through the third bump or a fourth bump arranged on the third bump to the second bump.
2. The semiconductor device according to claim 1 , wherein the first wire is stitch-bonded to the first bump, and the second wire is stitch-bonded to the third bump.
3. The semiconductor device according to claim 1 , further comprising:
a second semiconductor element which has an electrode arranged on a surface thereof and which is supported by the first semiconductor element.