Induction soldering of photovoltaic system components
View Patent ↗A method comprises positioning a pair of photovoltaic wafers in a side-by-side arrangement. An interconnect is placed on the pair of wafers such that the interconnect overlaps both wafers of the pair, solder material being provided between the interconnect and the respective wafers. A solder head is then located adjacent the interconnect, and the coil is energized to effect inductive heating of the solder material. The solder head comprises an induction coil shaped to define an eye, and a magnetic field concentrator located at least partially in the eye of the coil. The magnetic field concentrator defines a passage extending axially through the eye of the coil, and may be of a material with a high magnetic permeability.
1. A method comprising:
positioning a pair of photovoltaic wafers in a side-by-side arrangement;
placing an interconnect on the pair of wafers such that the interconnect overlaps both wafers of the pair, a solder material being provided between the interconnect and the respective wafers;
locating a solder head adjacent the interconnect, the solder head comprising: an induction coil shaped to define an eye, and a magnetic field concentrator located at least partially in the eye of the coil, the magnetic field concentrator defining a passage extending axially through the eye of the coil; and
energizing the coil to effect inductive heating of the solder material,
wherein the magnetic field concentrator comprises an annular cylindrical core component extending through the eye of the coil, having an annular shoulder at an operatively upper end of the core component, the annular shoulder resting on the coil to locate the core component in the eye of the coil.
2. The method of claim 1 , wherein the magnetic field concentrator is of a material with a high magnetic permeability.
3. The method of claim 1 , wherein the positioning of the pair of wafers is such that the wafers are co-planar and edge-to-edge, the locating of the solder head being such that the coil is transversely spaced from the interconnect, the passage of the magnetic field concentrator extending transversely a common plane of the wafers and being in register with a deposit of solder material.
4. The method of claim 1 , further comprising locating a plurality of solder heads adjacent the interconnect, each solder head being positioned in register with an associated electric contact forming part of one of the pair of wafers, and synchronously energizing coils of the plurality of solder heads.
5. The method of claim 1 , further comprising, prior to the energizing of the coil, pressing the interconnect on to the wafers with a hold-down member which is axially displaceable through the passage in the magnetic field concentrator.
6. The method of claim 1 , wherein the magnetic field concentrator houses at least part of the coil such that the coil is surrounded by the magnetic field concentrator, when viewed in cross section.
7. A method comprising:
positioning a pair of photovoltaic wafers in a side-by-side arrangement;
placing an interconnect on the pair of wafers such that the interconnect overlaps both wafers of the pair, a solder material being provided between the interconnect and the respective wafers;
locating a solder head adjacent the interconnect, the solder head comprising: an induction coil shaped to define an eye, and a magnetic field concentrator located at least partially in the eye of the coil, the magnetic field concentrator defining a passage extending axially through the eye of the coil; and
energizing the coil to effect inductive heating of the solder material,
wherein the magnetic field concentrator houses at least part of the coil such that the coil is surrounded by the magnetic field concentrator, when viewed in cross section.
8. The method of claim 7 , wherein the magnetic field concentrator is of a material with a high magnetic permeability.
9. The method of claim 7 , wherein the positioning of the pair of wafers is such that the wafers are co-planar and edge-to-edge, the locating of the solder head being such that the coil is transversely spaced from the interconnect, the passage of the magnetic field concentrator extending transversely a common plane of the wafers and being in register with a deposit of solder material.
10. The method of claim 7 , wherein the magnetic field concentrator comprises an annular cylindrical core component extending through the eye of the coil, and having an annular shoulder at an operatively upper end of the core component, the annular shoulder resting on the coil to locate the core component in the eye of the coil.
11. The method of claim 7 , further comprising locating a plurality of solder heads adjacent the interconnect, each solder head being positioned in register with an associated electric contact forming part of one of the pair of wafers, and synchronously energizing coils of the plurality of solder heads.
12. The method of claim 7 , further comprising, prior to the energizing of the coil, pressing the interconnect on to the wafers with a hold-down member which is axially displaceable through the passage in the magnetic field concentrator.