Acoustic wave device and method for fabricating the same
View Patent ↗An acoustic wave device includes a substrate, a device chip that has a piezoelectric substrate and is flip-chip mounted on a surface of the substrate, a first insulation layer that has a dielectric constant lower than that of the piezoelectric substrate and is provided on a surface of the device chip opposite to another surface that faces the substrate, and a metal seal part that seals the device chip.
1. An acoustic wave device comprising:
a substrate;
a device chip that has a piezoelectric substrate and is flip-chip mounted on a surface of the substrate;
a first insulation layer that has a dielectric constant lower than that of the piezoelectric substrate and is provided on a surface of the device chip opposite to another surface that faces the substrate; and
a metal seal part that seals the device chip,
wherein the first insulation layer does not touch any side surfaces of the device chip and the metal seal part surrounds the side surfaces of the device chip.
2. The acoustic wave device according to claim 1 , wherein the metal seal part does not touch any of the side surfaces of the device chip.
3. The acoustic wave device according to claim 1 , further comprising a metal pattern that is provided on the surface of the substrate and is located further out than a region in which the device chip overlaps the substrate, wherein the metal pattern is connected to the metal seal part.
4. The acoustic wave device according to claim 3 , further comprising a second insulation layer that is provided on the surface of the substrate and is provided in at least a part of an area between the region and the metal pattern.
5. The acoustic wave device according to claim 4 , further comprising an interconnection pattern that is provided on the surface of the substrate and is connected to the device chip and the metal pattern, wherein the second insulation layer is provided so as to overlap at least a part of the metal pattern.
6. The acoustic wave device according to claim 1 , wherein the first insulation layer comprises one of resin, sapphire, silicon, ceramic and glass.
7. The acoustic wave device according to claim 1 , wherein the first insulation layer comprises epoxy resin.
8. The acoustic wave device according to claim 1 , wherein the metal seal resin comprises solder.
9. An acoustic wave device comprising:
a substrate;
a device chip that has a piezoelectric substrate and is flip-chip mounted on an a surface of the substrate; and
a metal seal part that seals the device chip and does not touch any side surfaces of the device chip,
wherein the metal seal part surrounds the side surfaces of the device chip and a void is formed between the side surface of the device chip and the metal seal part.
10. The acoustic wave device according to claim 9 , wherein the metal seal resin comprises solder.
11. An acoustic wave device comprising:
a substrate;
a device chip that has a piezoelectric substrate and is flip-chip mounted on a surface of the substrate;
a metal seal part that seals the device chip and does not touch any side surfaces of the device chip;
a metal pattern that is provided on the surface of the substrate and is located further out than a region in which the device chip overlaps the substrate; and
an insulation layer that is provided on the surface of the substrate and is provided in at least a part of an area between the region and the metal pattern,
wherein the metal seal part surrounds the side surface of the device chip and the metal pattern is connected to the metal seal part.
12. The acoustic wave device according to claim 11 , further comprising an interconnection pattern that is provided on the surface of the substrate and is connected to the device chip and the metal pattern, wherein the insulation layer is provided so as to overlap at least a part of the metal pattern.
13. A method for fabricating an acoustic wave device comprising:
flip-chip mounting a device chip having a piezoelectric substrate on a surface of a substrate;
providing a first insulation layer on a surface of the device chip opposite to another surface that faces the substrate, the first insulation layer having a dielectric constant smaller than that of the piezoelectric substrate, and wherein the first insulation layer does not touch any side surfaces of the device chip; and
sealing the device chip with a metal seal part that is provided on the surface of the substrate and is located further out than a region in which the device chip overlaps the substrate, the metal pattern being connected to the metal seal part,
wherein the metal seal part does not touch any of the side surfaces of the device chip and surrounds the side surfaces of the device chip.
14. The method according to claim 13 , wherein the providing the first insulation layer leads to the flip-chip mounting.
15. The method according to claim 13 , wherein the providing the first insulation layer includes the sealing the device chip with the metal seal part.