Method of manufacturing a light emitting, photovoltaic or other electronic apparatus and system
The present invention provides a method of manufacturing an electronic apparatus, such as a lighting device having light emitting diodes (LEDs) or a power generating device having photovoltaic diodes. The exemplary method includes forming at least one first conductor coupled to a base; coupling a plurality of substrate particles to the at least one first conductor; converting the plurality of substrate particles into a plurality of diodes; forming at least one second conductor coupled to the plurality of spherical diodes; and depositing or attaching a plurality of substantially spherical lenses suspended in a first polymer, with the lenses and the suspending polymer having different indices of refraction. In some embodiments, the lenses and diodes have a ratio of mean diameters or lengths between about 10:1 and 2:1. In various embodiments, the forming, coupling and converting steps are performed by or through a printing process.
1. A method of manufacturing an electronic apparatus, the method comprising:
forming a plurality of first conductors coupled to a base;
coupling a plurality of substrate particles to the plurality of first conductors, wherein each substrate particle of the plurality of substrate particles comprises a semiconductor;
subsequent to the coupling to the plurality of first conductors, converting the plurality of substrate particles into a plurality of diodes by depositing a dopant material onto a first, upper portion of the plurality of substrate particles and annealing or alloying the dopant material with the plurality of substrate particles to form a pn junction in each substrate particle, wherein about fifteen percent to fifty-five percent of a surface of each diode of substantially all of the plurality of diodes has a penetration layer or region having a first majority carrier or dopant and the remaining diode substrate has a second majority carrier or dopant;
forming a plurality of second conductors coupled to the plurality of diodes; and
depositing a plurality of lenses suspended in a first polymer, the plurality of lenses having at least a first index of refraction and the first polymer having at least a second, different index of refraction.
2. The method of claim 1 , wherein the plurality of diodes are selected from the group consisting of: substantially spherical diodes, substantially toroidal diodes, substantially cylindrical diodes, substantially faceted diodes, substantially rectangular diodes, substantially flat diodes, substantially elliptical diodes, and mixtures thereof.
3. The method of claim 1 , wherein the step of depositing further comprises:
printing the plurality of lenses suspended in the first polymer over the plurality of diodes and the plurality of second conductors.
4. The method of claim 1 , wherein each diode of the plurality of diodes is substantially spherical, each lens of the plurality of lenses is substantially spherical, and wherein a ratio of a mean diameter of the plurality of lenses to a mean diameter of the plurality of diodes is substantially about five to one (5:1).
5. The method of claim 1 , wherein each diode of the plurality of diodes is substantially spherical, each lens of the plurality of lenses is substantially spherical, and wherein a ratio of a mean diameter of the plurality of lenses to a mean diameter of the plurality of diodes is between about ten to one (10:1) and two to one (2:1).
6. The method of claim 1 , wherein each diode of the plurality of diodes is substantially spherical, each lens of the plurality of lenses is substantially spherical, and wherein the comparative size or spacing of the plurality of lenses provide a mode coupling to the plurality of diodes.
7. The method of claim 1 , wherein a mean diameter or length of the plurality of diodes is greater than about twenty (20) microns and less than about forty (40) microns.
8. The method of claim 1 , wherein the plurality of diodes are semiconductor light emitting diodes or photovoltaic diodes.
9. The method of claim 1 , wherein the step of depositing the plurality of lenses suspended in the first polymer further comprises attaching a prefabricated layer to the plurality of diodes, the prefabricated layer comprising the plurality of lenses suspended in the first polymer.
10. The method of claim 1 , wherein the semiconductor is selected from the group consisting of: gallium nitride, gallium arsenide, silicon, and mixtures thereof.
11. The method of claim 1 , wherein the step of forming the plurality of first conductors further comprises:
depositing a first conductive medium within a plurality of channels of the base.
12. The method of claim 11 , wherein the first conductive medium comprises a conductive ink or a conductive polymer.
13. The method of claim 11 , wherein the first conductive medium comprises at least one media selected from the group consisting of: a silver conductive ink, a copper conductive ink, a gold conductive ink, an aluminum conductive ink, a tin conductive ink, a carbon conductive ink, a carbon nanotube polymer, a conductive polymer, and mixtures thereof.
14. The method of claim 11 , further comprising:
partially curing the first conductive medium.
15. The method of claim 14 , wherein the step of coupling the plurality of substrate particles to the plurality of first conductors further comprises:
depositing within the plurality of channels the plurality of substrate particles suspended in a carrier medium; and
fully curing the first conductive medium.
16. The method of claim 11 , wherein the step of depositing a first conductive medium comprises sputtering, coating, vapor depositing or electroplating a metal, a metal alloy, or a combination of metals.
17. The method of claim 16 , wherein the metal, metal alloy, or combination of metals is selected from the group consisting of: aluminum, copper, silver, nickel, gold, and mixtures thereof.
18. The method of claim 11 , wherein the step of coupling the plurality of substrate particles to the plurality of first conductors further comprises:
depositing within the plurality of channels the plurality of substrate particles suspended in a reactive carrier medium;
removing the reactive carrier medium; and
curing or re-curing the first conductive medium.
19. The method of claim 11 , wherein the step of coupling the plurality of substrate particles to the plurality of first conductors further comprises:
depositing within the plurality of channels the plurality of substrate particles suspended in an anisotropic conductive medium;
compressing the plurality of substrate particles suspended in the anisotropic conductive medium.
20. The method of claim 11 , wherein the step of coupling the plurality of substrate particles to the plurality of first conductors further comprises:
depositing within the plurality of channels the plurality of substrate particles suspended in a volatile carrier medium; and
evaporating the volatile carrier medium.
21. The method of claim 11 , wherein the step of coupling the plurality of substrate particles to the plurality of first conductors further comprises:
depositing within the plurality of channels the plurality of substrate particles suspended in a carrier medium; and
annealing or alloying the plurality of substrate particles within the plurality of channels.
22. The method of claim 11 , wherein the plurality of channels are spaced-apart and substantially parallel.
23. The method of claim 11 , wherein the plurality of channels are at least partially hemispherically-shaped and are disposed in an array.
24. The method of claim 11 , wherein the plurality of channels are spaced-apart and least partially parabolic.
25. The method of claim 11 , wherein the base further comprises a plurality of angled ridges.
26. The method of claim 11 , wherein the plurality of spaced-apart channels further comprise a plurality of integrally formed projections or supports.
27. The method of claim 26 , wherein the plurality of first conductors are coupled to the plurality of integrally formed projections or supports within the plurality of spaced-apart channels and wherein the step of coupling the plurality of substrate particles to the plurality of first conductors further comprises:
depositing within the plurality of channels the plurality of substrate particles suspended in a carrier medium; and
annealing, or alloying, or chemically coupling the plurality of substrate particles to the plurality of first conductors.
28. The method of claim 1 , wherein the annealing or alloying is laser or thermal annealing or alloying.
29. The method of claim 1 , wherein the dopant material is a substrate liquid or film.
30. The method of claim 1 , wherein the dopant material is a dopant element or compound suspended in a carrier.
31. The method of claim 1 , wherein the resulting plurality of diodes are light emitting diodes or photovoltaic diodes.
32. The method of claim 1 , further comprising:
depositing a plurality of third conductors over or within the plurality of second conductors.
33. The method of claim 1 , further comprising:
coupling a reflector or a refractor to the base.
34. The method of claim 1 , wherein the base further comprises a Bragg reflector or a reflective plastic or polyester coating.
35. The method of claim 1 , wherein the base further comprises a plurality of conductive vias extending between a first side and a second side of the base and coupled at the first side to the plurality of first conductors.
36. The method of claim 35 , wherein the plurality of conductive vias comprise a plurality of distributed, substantially spherical conductors.
37. The method of claim 36 , wherein the base further comprises a conductive backplane coupled to the plurality of conductive vias and coupled to or integrated with the second side of the base.
38. The method of claim 1 , further comprising:
depositing a plurality of inorganic dielectric particles suspended with a photoinitiator compound in a second polymer or resin to form a plurality of insulators correspondingly coupled to each of the plurality of diodes.
39. The method of claim 1 , wherein the base comprises at least one material selected from the group consisting of: paper, coated paper, plastic coated paper, embossed paper, fiber paper, cardboard, poster paper, poster board, wood, plastic, rubber, fabric, glass, ceramic, and mixtures thereof.
40. The method of claim 1 , wherein the step of forming the plurality of second conductors further comprises:
depositing an optically transmissive conductor or conductive compound suspended in a polymer, resin or other media.
41. The method of claim 40 , wherein the optically transmissive conductor or conductive compound suspended in a polymer, resin or other media further comprises at least one conductor or conductive compound selected from the group consisting of: carbon nanotubes, antimony tin oxide, indium tin oxide, polyethylene-dioxithiophene, and mixtures thereof.
42. The method of claim 1 , wherein the forming, coupling and converting steps are performed at least in part by or through a printing or coating process.
43. The method of claim 1 , wherein the plurality of lenses comprise borosilicate glass or polystyrene latex.
44. The method of claim 1 , further comprising:
attaching an electrical or electronic interface.
45. The method of claim 44 , wherein the interface is compatible with an E12, E14, E26, E27, or GU-10 lighting standard.
46. The method of claim 44 , wherein the interface is compatible with a standard Edison-type lighting socket.
47. The method of claim 44 , wherein the interface is compatible with a standard fluorescent-type lighting socket.
48. A method of manufacturing an electronic apparatus, the method comprising:
forming at least one first conductor coupled to a base;
coupling a plurality of substrate particles to the at least one first conductor, wherein each substrate particle of the plurality of substrate particles comprises a semiconductor;
subsequent to the coupling to the at least one first conductor, converting the plurality of substrate particles into a plurality of diodes by depositing a dopant material onto a first, upper portion of the plurality of substrate particles and annealing or alloying the dopant material with the plurality of substrate particles to form a pn junction in each substrate particle, wherein about fifteen percent to fifty-five percent of a surface of each diode of substantially all of the plurality of diodes has a layer or region having a first majority carrier or dopant and the remaining diode substrate has a second majority carrier or dopant;
forming at least one second conductor coupled to the plurality of substantially spherical diodes; and
depositing a plurality of lenses.
49. The method of claim 48 , wherein a ratio of a mean diameter or length of the plurality of lenses to a mean diameter or length of the plurality of diodes is substantially about five to one (5:1).
50. The method of claim 48 , wherein a ratio of a mean diameter or length of the plurality of lenses to a mean diameter or length of the plurality of diodes is between about ten to one (10:1) and two to one (2:1).
51. The method of claim 48 , wherein a mean diameter or length of the plurality of diodes is greater than about twenty (20) microns and less than about forty (40) microns.
52. The method of claim 48 , wherein the plurality of diodes are semiconductor light emitting diodes or photovoltaic diodes.
53. The method of claim 48 , wherein the step of depositing a plurality of lenses further comprises:
attaching a prefabricated layer to the plurality of diodes, the prefabricated layer comprising the plurality of lenses.
54. The method of claim 48 , wherein the plurality of substrate particles comprise semiconductor is selected from the group consisting of: gallium nitride, gallium arsenide, silicon, and mixtures thereof.
55. The method of claim 48 , wherein the step of forming the at least one first conductor further comprises:
depositing a first conductive medium.
56. The method of claim 55 , wherein the first conductive medium comprises at least one media selected from the group consisting of: a silver conductive ink, a copper conductive ink, a gold conductive ink, an aluminum conductive ink, a tin conductive ink, a carbon conductive ink, a carbon nanotube polymer, a conductive polymer, and mixtures thereof.
57. The method of claim 55 , wherein the step of depositing a first conductive medium comprises sputtering, coating, vapor depositing or electroplating a metal, a metal alloy, or a combination of metals.
58. The method of claim 57 , wherein the metal, metal alloy, or combination of metals comprise at least one metal selected from the group consisting of: aluminum, copper, silver, nickel, gold, and mixtures thereof.
59. The method of claim 55 , wherein the step of coupling the plurality of substrate particles to the at least one first conductor further comprises:
depositing the plurality of substrate particles suspended in a reactive carrier medium;
removing the reactive carrier medium; and
curing or re-curing the first conductive medium.
60. The method of claim 48 , wherein the step of coupling the plurality of substrate particles to the at least one first conductor further comprises:
depositing the plurality of substrate particles suspended in an anisotropic conductive medium;
compressing the plurality of substrate particles suspended in the anisotropic conductive medium.
61. The method of claim 48 , wherein the step of coupling the plurality of substrate particles to the at least one first conductor further comprises:
depositing the plurality of substrate particles suspended in a volatile carrier medium; and
evaporating the volatile carrier medium.
62. The method of claim 48 , wherein the step of coupling the plurality of substrate particles to the at least one first conductor further comprises:
depositing the plurality of substrate particles suspended in a carrier medium; and
annealing or alloying the plurality of substrate particles to or with the at least one first conductor.
63. The method of claim 48 , wherein the annealing or alloying is laser or thermal annealing or alloying.
64. The method of claim 48 , wherein the dopant material is a substrate liquid or film or a dopant element or compound suspended in a carrier.
65. The method of claim 48 , further comprising:
depositing at least one third conductor over or within the at least one second conductor.
66. The method of claim 48 , wherein the base further comprises a Bragg reflector or a reflective plastic or polyester coating.
67. The method of claim 48 , wherein the base further comprises:
a plurality of distributed, substantially spherical conductors extending between a first side and a second side of the base and correspondingly coupled at the first side to the at least one first conductor; and
a conductive backplane coupled to the plurality of conductive vias and coupled to or integrated with the second side of the base.
68. The method of claim 48 , further comprising:
depositing a plurality of inorganic dielectric particles suspended with a photoinitiator compound in a second polymer or resin to form at least one insulator coupled to the plurality of diodes.
69. The method of claim 48 , wherein the step of forming the at least one second conductor further comprises:
depositing an optically transmissive conductor or conductive compound suspended in a polymer, resin or other media.
70. The method of claim 69 , wherein the optically transmissive conductor or conductive compound suspended in a polymer, resin or other media further comprises at least one conductor or conductive compound selected from the group consisting of: carbon nanotubes, antimony tin oxide, indium tin oxide, polyethylene-dioxithiophene, and mixtures thereof.
71. The method of claim 48 , wherein the plurality of lenses comprise borosilicate glass or polystyrene latex.
72. The method of claim 48 , wherein the forming, coupling and converting steps are performed at least in part by or through a printing or coating process.
73. The method of claim 48 , further comprising:
attaching an electrical or electronic interface.
74. The method of claim 73 , wherein the interface is compatible with an E12, E14, E26, E27, or GU-10 lighting standard.
75. The method of claim 73 , wherein the interface is compatible with a standard Edison-type lighting socket.
76. The method of claim 73 , wherein the interface is compatible with a standard fluorescent-type lighting socket.
77. A method of manufacturing an electronic system, the method comprising:
forming at least one first conductor coupled to a base;
coupling a plurality of substrate particles to the at least one first conductor, wherein each substrate particle of the plurality of substrate particles comprises a semiconductor;
converting the plurality of substrate particles into a plurality of substantially optically resonant diodes by depositing a dopant material onto a first, upper portion of the plurality of substrate particles and annealing or alloying the dopant material with the plurality of substrate particles to form a pn junction in each substrate particle, wherein about fifteen percent to fifty-five percent of a surface of each diode of substantially all of the plurality of substantially optically resonant diodes has a layer or region having a first majority carrier or dopant and the remaining diode substrate has a second majority carrier or dopant;
forming at least one second conductor coupled to the plurality of substantially optically resonant diodes;
depositing a plurality of lenses or a lens structure; and
attaching an electrical or electronic interface.
78. The method of claim 77 , wherein the plurality of substantially optically resonant diodes are selected from the group consisting of: substantially spherical diodes, substantially toroidal diodes, substantially cylindrical diodes, and mixtures thereof.
79. The method of claim 77 , wherein the plurality of diodes are semiconductor light emitting diodes or photovoltaic diodes.
80. The method of claim 77 , wherein the step of depositing a plurality of lenses further comprises:
attaching a prefabricated layer to the plurality of optically resonant diodes, the prefabricated layer comprising the plurality of lenses.
81. The method of claim 77 , wherein the step of forming the at least one first conductor further comprises:
depositing a first conductive medium.
82. The method of claim 81 , wherein the step of coupling the plurality of substrate particles to the at least one first conductor further comprises:
depositing the plurality of substrate particles suspended in a reactive carrier medium;
removing the reactive carrier medium; and
curing or re-curing the first conductive medium.
83. The method of claim 77 , wherein the step of coupling the plurality of substrate particles to the at least one first conductor further comprises:
depositing the plurality of substrate particles suspended in a carrier medium; and
annealing the plurality of substrate particles to or with the at least one first conductor.
84. The method of claim 77 , further comprising:
depositing at least one third conductor over or within the at least one second conductor.
85. The method of claim 77 , wherein the base further comprises:
a plurality of distributed, substantially spherical conductors extending between a first side and a second side of the base and correspondingly coupled at the first side to the at least one first conductor; and
a conductive backplane coupled to the plurality of conductive vias and coupled to or integrated with the second side of the base.
86. The method of claim 77 , further comprising:
depositing a plurality of inorganic dielectric particles suspended with a photoinitiator compound in a second polymer or resin to form at least one insulator coupled to the plurality of optically resonant diodes.
87. The method of claim 77 , wherein the plurality of lenses comprise borosilicate glass or polystyrene latex.
88. The method of claim 77 , wherein the forming, coupling and converting steps are performed at least in part by or through a printing or coating process.