IP Library Granted Patent US 8,182,562
Granted Patent B2
US 8,182,562 · App. 12/560,960 · Granted May 22, 2012

Slurries containing abrasive grains having a unique morphology

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Quick Facts
Patent No.
US 8,182,562
App. No.
12/560,960
Granted
May 22, 2012
Kind
B2
Abstract

A slurry containing a plurality of monocrystalline diamond particles, wherein the average surface roughness of said particles is less than about 0.95; a major vehicle selected from the group of water-based vehicles, glycol-based vehicles, oil-based vehicles or hydrocarbon-based vehicles and combinations thereof; and one or more optional additives.

Claims (39)

1. A slurry comprising:

a. a plurality of monocrystalline diamond particles,

wherein the average surface roughness of said particles is greater than 0 to about 0.95;

b. a vehicle selected from the group consisting of water-based vehicles, glycol-based vehicles, oil-based vehicles or hydrocarbon-based vehicles and combinations thereof; and

c. one or more optional additives.

2. The slurry of claim 1 , wherein the average sphericity of said particles is less than about 0.70.

3. The method of claim 2 , wherein the average sphericity of said particles is between about 0.25 to about 0.6.

4. The slurry of claim 1 , wherein said diamond particles are in a concentration of about 0.01 to about 60 percent by weight.

5. The slurry of claim 1 , wherein said diamond particles have a size of about 0.1 to about 100 microns.

6. The slurry of claim 1 , wherein said additive is selected from the group consisting of dispersing agents, pH modifiers, surfactants, defoamers, wetting agents, viscosity modifiers, secondary abrasives and color modifiers.

7. The slurry of claim 1 , wherein the total material removal of a workpiece is increased by at least about 20% as compared to a slurry containing the same amount of conventional monocrystalline diamond particles of the same size.

8. The slurry of claim 7 , wherein the workpiece is selected from the group consisting of silicon, sapphire, silicon carbide, glass, quartz, gallium nitride, compound semiconductors, metals, ceramics, carbides, cermets, polymers, superabrasive composites, sintered polycrystalline composites, stone and gem stones.

9. The slurry of claim 1 , wherein the total material removal of a workpiece is increased by at least about 50% as compared to a slurry containing the same amount of conventional monocrystalline diamond particles of the same size.

10. The slurry of claim 1 , wherein the average wafer roughness is reduced by at least about 20% as compared to a slurry containing the same amount of conventional monocrystalline diamond particles of the same size.

11. The slurry of claim 1 , wherein the total material removal of a workpiece is increased by at least about 20% as compared to a slurry containing the same amount of conventional monocrystalline diamond particles of the same size and the average wafer roughness is reduced by at least about 20% as compared to a slurry containing the same amount of conventional monocrystalline diamond particles of the same size.

12. A method of making a slurry comprising the steps of:

a. providing a plurality of monocrystalline diamond particles,

wherein the average surface roughness of said particles is greater than 0 to about 0.95;

b. providing a vehicle selected from the group consisting of water-based vehicles, glycol-based vehicles, oil-based vehicles or hydrocarbon-based vehicles and combinations thereof;

c. providing one or more optional additives; and

d. combining said particles, said vehicle and said optional additive to form a slurry.

13. The method of claim 12 , wherein said modified particles have an average weight loss of more than about 10% of the original weight of the particle.

14. The method of claim 12 , wherein the average sphericity of said particles is less than about 0.70.

15. The method of claim 12 , wherein the average sphericity of said particles is between about 0.25 to about 0.6.

16. The method of claim 12 , wherein the average surface area of said particles is greater than about 20 percent higher than a conventional monocrystalline diamond particle having the same particle size distribution.

17. The method of claim 12 , where the average size of the particles is between about 0.1 to about 1000 microns.

18. A slurry comprising:

a. a plurality of monocrystalline diamond particles,

wherein the average surface roughness of said particles is greater than 0 to about 0.70;

b. a vehicle selected from the group consisting of water-based vehicles, glycol-based vehicles, oil-based vehicles or hydrocarbon-based vehicles and combinations thereof; and

c. one or more optional additives.

19. The slurry of claim 18 , wherein the average sphericity of said particles is between about 0.25 to about 0.6.

20. The slurry of claim 18 , wherein said diamond particles are in a concentration of about 0.01 to about 60 percent by weight.

21. The slurry of claim 18 , wherein said diamond particles have a size of about 0.1 to about 100 microns.

22. A slurry comprising:

a. a plurality of monocrystalline diamond particles,

wherein the average surface roughness of said particles is greater than 0 to about 0.95;

b. a vehicle selected from the group consisting of water-based vehicles, glycol-based vehicles, oil-based vehicles or hydrocarbon-based vehicles and combinations thereof; and

c. one or more optional additives selected from the group consisting of dispersing agents, pH modifiers, surfactants, defoamers, wetting agents, viscosity modifiers, secondary abrasives and color modifiers.

Assignments (6)
2L PATENT SECURITY RELEASE AGREEMENT Recorded Aug 31, 2021
From: UBS AG, STAMFORD BRANCH
To: DIAMOND INNOVATIONS, INC.
Reel/Frame 057650/0602 →
1L PATENT SECURITY RELEASE AGREEMENT Recorded Aug 31, 2021
From: UBS AG, STAMFORD BRANCH
To: DIAMOND INNOVATIONS, INC.
Reel/Frame 057651/0040 →
SECURITY INTEREST Recorded Aug 31, 2021
From: DIAMOND INNOVATIONS, INC.
To: UBS AG, STAMFORD BRANCH
Reel/Frame 057388/0971 →
FIRST LIEN PATENT SECURITY AGREEMENT Recorded Sep 4, 2019
From: DIAMOND INNOVATIONS, INC.
To: UBS AG, STAMFORD BRANCH
Reel/Frame 050272/0415 →
SECOND LIEN PATENT SECURITY AGREEMENT Recorded Sep 4, 2019
From: DIAMOND INNOVATIONS, INC.
To: UBS AG, STAMFORD BRANCH
Reel/Frame 050272/0472 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 17, 2009
From: DUMM, TIMOTHY F.; NG, KAN-YIN
To: DIAMOND INNOVATIONS, INC.
Reel/Frame 023243/0025 →