LED module with high index lens
View Patent ↗An array of housings with housing bodies and lenses is molded, or an array of housing bodies is molded and bonded with lenses to form an array of housings with housing bodies and lenses. Light-emitting diodes (LEDs) are attached to the housings in the array. An array of metal pads may be bonded to the back of the array or insert molded with the housing array to form bond pads on the back of the housings. The array is singulated to form individual LED modules.
1. A light-emitting diode (LED) module, comprising:
a housing body, comprising:
a recess;
a top opening in the recess;
clamps positioned around the recess; and
a bottom opening coupled to the top opening, the bottom opening comprising a ceiling, the ceiling defining glue overflow channels;
a metal shim, comprising:
a base plate abutting a bottom of the housing body, the base plate forming a bond pad;
molding tabs extending from the base plate into the housing body; and
holes each defined partly by a molding tab and the base plate, wherein the holes are filled with a housing material that forms part of the housing body so the metal shim and the housing body form an integral structure;
a lens;
a ceramic phosphor plate fixed to the bottom of the lens, wherein the lens is received in the recess so the ceramic phosphor plate fully covers the top opening and the clamps are plastically deformed to clamp the lens; and
an LED comprising a submount and one or more flip chip LED dies mounted on the submount, wherein the submount comprises bottom pads, each LED die comprises a n-type layer, a light-emitting layer, and a p-type layer, and the submount is seated completely in the bottom opening.
2. The LED module of claim 1 , wherein one or more of the top and the bottom openings comprise reflective or scattering sidewalls.
3. The LED module of claim 1 , wherein the lens has a bottom surface larger than a top surface of the LED.